JPS5767192A - High-speed plating method - Google Patents

High-speed plating method

Info

Publication number
JPS5767192A
JPS5767192A JP14219080A JP14219080A JPS5767192A JP S5767192 A JPS5767192 A JP S5767192A JP 14219080 A JP14219080 A JP 14219080A JP 14219080 A JP14219080 A JP 14219080A JP S5767192 A JPS5767192 A JP S5767192A
Authority
JP
Japan
Prior art keywords
vanes
plating
cathode
electrodes
current density
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14219080A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6146559B2 (enrdf_load_stackoverflow
Inventor
Yasuo Uchikoshiki
Fujio Asa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Uemera Kogyo Co Ltd
C Uyemura and Co Ltd
Original Assignee
Uemera Kogyo Co Ltd
C Uyemura and Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Uemera Kogyo Co Ltd, C Uyemura and Co Ltd filed Critical Uemera Kogyo Co Ltd
Priority to JP14219080A priority Critical patent/JPS5767192A/ja
Publication of JPS5767192A publication Critical patent/JPS5767192A/ja
Publication of JPS6146559B2 publication Critical patent/JPS6146559B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP14219080A 1980-10-11 1980-10-11 High-speed plating method Granted JPS5767192A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14219080A JPS5767192A (en) 1980-10-11 1980-10-11 High-speed plating method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14219080A JPS5767192A (en) 1980-10-11 1980-10-11 High-speed plating method

Publications (2)

Publication Number Publication Date
JPS5767192A true JPS5767192A (en) 1982-04-23
JPS6146559B2 JPS6146559B2 (enrdf_load_stackoverflow) 1986-10-15

Family

ID=15309474

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14219080A Granted JPS5767192A (en) 1980-10-11 1980-10-11 High-speed plating method

Country Status (1)

Country Link
JP (1) JPS5767192A (enrdf_load_stackoverflow)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0290591A (ja) * 1988-09-28 1990-03-30 Hitachi Ltd 孔内処理用治具
JPH06220697A (ja) * 1992-12-28 1994-08-09 Nippon Techno Kk めっき方法
JPH07126896A (ja) * 1993-11-02 1995-05-16 Nippon Techno Kk 表面処理方法およびそれに使用する表面処理装置
JP2008266670A (ja) * 2007-04-16 2008-11-06 Sumitomo Electric Ind Ltd 電気めっき装置
JP2009155726A (ja) * 2007-12-04 2009-07-16 Ebara Corp めっき装置及びめっき方法
JP2010529293A (ja) * 2007-06-06 2010-08-26 アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング 製品の湿式化学処理用装置及び方法と、上記装置内に流量部材を取り付けるための方法
US8486234B2 (en) 2007-12-04 2013-07-16 Ebara Corporation Plating apparatus and plating method

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0290591A (ja) * 1988-09-28 1990-03-30 Hitachi Ltd 孔内処理用治具
JPH06220697A (ja) * 1992-12-28 1994-08-09 Nippon Techno Kk めっき方法
JPH07126896A (ja) * 1993-11-02 1995-05-16 Nippon Techno Kk 表面処理方法およびそれに使用する表面処理装置
JP2008266670A (ja) * 2007-04-16 2008-11-06 Sumitomo Electric Ind Ltd 電気めっき装置
JP2010529293A (ja) * 2007-06-06 2010-08-26 アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング 製品の湿式化学処理用装置及び方法と、上記装置内に流量部材を取り付けるための方法
JP2013174016A (ja) * 2007-06-06 2013-09-05 Atotech Deutschland Gmbh 板状製品の湿式化学処理用装置及び方法と、上記装置内に流量部材を取り付けるための方法
KR101526022B1 (ko) * 2007-06-06 2015-06-04 아토테크더치랜드게엠베하 생산물의 습식 화학 처리를 위한 장치 및 방법, 및 상기 장치에 유동 부재를 설치하는 방법
JP2009155726A (ja) * 2007-12-04 2009-07-16 Ebara Corp めっき装置及びめっき方法
US8486234B2 (en) 2007-12-04 2013-07-16 Ebara Corporation Plating apparatus and plating method
KR101486441B1 (ko) * 2007-12-04 2015-01-28 가부시키가이샤 에바라 세이사꾸쇼 도금장치 및 도금방법
KR101493380B1 (ko) * 2007-12-04 2015-02-23 가부시키가이샤 에바라 세이사꾸쇼 도금장치 및 도금방법
USRE45687E1 (en) 2007-12-04 2015-09-29 Ebara Corporation Plating apparatus and plating method

Also Published As

Publication number Publication date
JPS6146559B2 (enrdf_load_stackoverflow) 1986-10-15

Similar Documents

Publication Publication Date Title
JPS526374A (en) Anode structure for electrolysis
JPS5767192A (en) High-speed plating method
JPS5751290A (en) Electrolytic treatment of beltlike metallic plate
JPS5767184A (en) Stabilizing method for metallic bed of aluminum in electrolytic cell for aluminum
JPS55152200A (en) Electroplating
JPS56119792A (en) Electroplating method
JPS56156793A (en) Manufacture of composite powder by electroplating
JPS5245720A (en) Electrical anticorrosion of external surface of bottom plate of surface tank
JPS5792191A (en) Partial plating method
GB779906A (en) Improvements in or relating to electro-plating process and apparatus
JPS5380161A (en) Electrode formation of semiconductor
JPS54159341A (en) Plating method
JPS5330406A (en) Depositing method for metal from solution of metal salt by electrolysis
JPS54121239A (en) Plating internal surface of elongated metal pipe
JPS5623297A (en) Partial plating method
JPS55161096A (en) Continuous electroplating method
JPS6423542A (en) Wiring structure
SU1790255A1 (ru) Электролизер с электродом из порошкового материала
JPS5249249A (en) Method for electro-plating with aluminium
JPS52148419A (en) Electrolytic refining method of lead
JPS52148539A (en) Electrolytic plating
JPS53125942A (en) Horizontal multi-tank type continuous single side electroplating apparatus
JPS55158297A (en) Control method of electric current density in electroplating
JPS5565388A (en) Electric manganese plating method of steel strip
SU1602306A1 (ru) Биполярный электрод свинцового аккумулятора