JPS6146559B2 - - Google Patents
Info
- Publication number
- JPS6146559B2 JPS6146559B2 JP14219080A JP14219080A JPS6146559B2 JP S6146559 B2 JPS6146559 B2 JP S6146559B2 JP 14219080 A JP14219080 A JP 14219080A JP 14219080 A JP14219080 A JP 14219080A JP S6146559 B2 JPS6146559 B2 JP S6146559B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- plated
- electroplating
- anode
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 74
- 239000007788 liquid Substances 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 12
- 238000009713 electroplating Methods 0.000 claims description 11
- 238000000926 separation method Methods 0.000 claims 1
- 238000003756 stirring Methods 0.000 description 20
- 238000013019 agitation Methods 0.000 description 13
- PEVJCYPAFCUXEZ-UHFFFAOYSA-J dicopper;phosphonato phosphate Chemical compound [Cu+2].[Cu+2].[O-]P([O-])(=O)OP([O-])([O-])=O PEVJCYPAFCUXEZ-UHFFFAOYSA-J 0.000 description 5
- 229910000365 copper sulfate Inorganic materials 0.000 description 4
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 4
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 210000003746 feather Anatomy 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 210000005252 bulbus oculi Anatomy 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000002659 electrodeposit Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- RYCLIXPGLDDLTM-UHFFFAOYSA-J tetrapotassium;phosphonato phosphate Chemical compound [K+].[K+].[K+].[K+].[O-]P([O-])(=O)OP([O-])([O-])=O RYCLIXPGLDDLTM-UHFFFAOYSA-J 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
Landscapes
- Electroplating Methods And Accessories (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14219080A JPS5767192A (en) | 1980-10-11 | 1980-10-11 | High-speed plating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14219080A JPS5767192A (en) | 1980-10-11 | 1980-10-11 | High-speed plating method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5767192A JPS5767192A (en) | 1982-04-23 |
| JPS6146559B2 true JPS6146559B2 (enrdf_load_stackoverflow) | 1986-10-15 |
Family
ID=15309474
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14219080A Granted JPS5767192A (en) | 1980-10-11 | 1980-10-11 | High-speed plating method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5767192A (enrdf_load_stackoverflow) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2644848B2 (ja) * | 1988-09-28 | 1997-08-25 | 株式会社日立製作所 | 孔内処理用治具 |
| JP2707530B2 (ja) * | 1992-12-28 | 1998-01-28 | 日本テクノ株式会社 | めっき方法 |
| JP2911350B2 (ja) * | 1993-11-02 | 1999-06-23 | 日本テクノ株式会社 | 表面処理方法およびそれに使用する表面処理装置 |
| JP2008266670A (ja) * | 2007-04-16 | 2008-11-06 | Sumitomo Electric Ind Ltd | 電気めっき装置 |
| DE102007026635B4 (de) * | 2007-06-06 | 2010-07-29 | Atotech Deutschland Gmbh | Vorrichtung zum nasschemischen Behandeln von Ware, Verwendung eines Strömungsorgans, Verfahren zum Einbauen eines Strömungsorgans in die Vorrichtung sowie Verfahren zur Herstellung einer nasschemisch behandelten Ware |
| JP5184308B2 (ja) * | 2007-12-04 | 2013-04-17 | 株式会社荏原製作所 | めっき装置及びめっき方法 |
| US8177944B2 (en) | 2007-12-04 | 2012-05-15 | Ebara Corporation | Plating apparatus and plating method |
-
1980
- 1980-10-11 JP JP14219080A patent/JPS5767192A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5767192A (en) | 1982-04-23 |
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