JPS5763678A - Sputtering device - Google Patents

Sputtering device

Info

Publication number
JPS5763678A
JPS5763678A JP13780480A JP13780480A JPS5763678A JP S5763678 A JPS5763678 A JP S5763678A JP 13780480 A JP13780480 A JP 13780480A JP 13780480 A JP13780480 A JP 13780480A JP S5763678 A JPS5763678 A JP S5763678A
Authority
JP
Japan
Prior art keywords
substrate
motor
chamber
gate valve
sputtering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13780480A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62996B2 (enrdf_load_stackoverflow
Inventor
Hideki Tateishi
Tsuneaki Kamei
Katsuo Abe
Hide Kobayashi
Susumu Aiuchi
Masashi Nakatsuka
Nobuyuki Takahashi
Ryuji Sugimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Anelva Corp
Hitachi Ltd
Original Assignee
Hitachi Ltd
Anelva Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Anelva Corp filed Critical Hitachi Ltd
Priority to JP13780480A priority Critical patent/JPS5763678A/ja
Priority to US06/296,314 priority patent/US4405435A/en
Publication of JPS5763678A publication Critical patent/JPS5763678A/ja
Publication of JPS62996B2 publication Critical patent/JPS62996B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • C23C14/566—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases using a load-lock chamber

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Physical Vapour Deposition (AREA)
  • ing And Chemical Polishing (AREA)
JP13780480A 1980-08-27 1980-10-03 Sputtering device Granted JPS5763678A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP13780480A JPS5763678A (en) 1980-10-03 1980-10-03 Sputtering device
US06/296,314 US4405435A (en) 1980-08-27 1981-08-26 Apparatus for performing continuous treatment in vacuum

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13780480A JPS5763678A (en) 1980-10-03 1980-10-03 Sputtering device

Publications (2)

Publication Number Publication Date
JPS5763678A true JPS5763678A (en) 1982-04-17
JPS62996B2 JPS62996B2 (enrdf_load_stackoverflow) 1987-01-10

Family

ID=15207231

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13780480A Granted JPS5763678A (en) 1980-08-27 1980-10-03 Sputtering device

Country Status (1)

Country Link
JP (1) JPS5763678A (enrdf_load_stackoverflow)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57149748A (en) * 1981-03-12 1982-09-16 Anelva Corp Treating device for substrate
JPS59177367A (ja) * 1983-03-25 1984-10-08 Matsushita Electric Ind Co Ltd 試料搬送機構を有する真空蒸着装置
JPS59208074A (ja) * 1983-05-13 1984-11-26 Toshiba Corp 枚葉式膜形成装置
JPS61106768A (ja) * 1984-10-31 1986-05-24 Anelva Corp 基体処理装置
JPS61159570A (ja) * 1984-12-31 1986-07-19 Tokyo Erekutoron Kk イオン注入装置
JPS62182275A (ja) * 1986-02-05 1987-08-10 Toppan Printing Co Ltd 金属酸化物膜の製造装置
JPS62230977A (ja) * 1986-04-01 1987-10-09 Seiko Epson Corp 薄膜製造装置
JPS637162U (enrdf_load_stackoverflow) * 1986-06-27 1988-01-18
WO1991007773A1 (fr) * 1989-11-14 1991-05-30 Anelva Corporation Procede de traitement sous vide d'un substrat et appareil utilise

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS506195A (enrdf_load_stackoverflow) * 1972-11-21 1975-01-22
JPS609103A (ja) * 1983-06-28 1985-01-18 松下電器産業株式会社 電圧依存性非直線抵抗体磁器組成物
JPS609102A (ja) * 1983-06-28 1985-01-18 松下電器産業株式会社 電圧依存性非直線抵抗体磁器組成物

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS506195A (enrdf_load_stackoverflow) * 1972-11-21 1975-01-22
JPS609103A (ja) * 1983-06-28 1985-01-18 松下電器産業株式会社 電圧依存性非直線抵抗体磁器組成物
JPS609102A (ja) * 1983-06-28 1985-01-18 松下電器産業株式会社 電圧依存性非直線抵抗体磁器組成物

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57149748A (en) * 1981-03-12 1982-09-16 Anelva Corp Treating device for substrate
JPS59177367A (ja) * 1983-03-25 1984-10-08 Matsushita Electric Ind Co Ltd 試料搬送機構を有する真空蒸着装置
JPS59208074A (ja) * 1983-05-13 1984-11-26 Toshiba Corp 枚葉式膜形成装置
JPS61106768A (ja) * 1984-10-31 1986-05-24 Anelva Corp 基体処理装置
JPS61159570A (ja) * 1984-12-31 1986-07-19 Tokyo Erekutoron Kk イオン注入装置
JPS62182275A (ja) * 1986-02-05 1987-08-10 Toppan Printing Co Ltd 金属酸化物膜の製造装置
JPS62230977A (ja) * 1986-04-01 1987-10-09 Seiko Epson Corp 薄膜製造装置
JPS637162U (enrdf_load_stackoverflow) * 1986-06-27 1988-01-18
WO1991007773A1 (fr) * 1989-11-14 1991-05-30 Anelva Corporation Procede de traitement sous vide d'un substrat et appareil utilise

Also Published As

Publication number Publication date
JPS62996B2 (enrdf_load_stackoverflow) 1987-01-10

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