JPS5741369A - Continuous vacuum treatment device - Google Patents

Continuous vacuum treatment device

Info

Publication number
JPS5741369A
JPS5741369A JP11706980A JP11706980A JPS5741369A JP S5741369 A JPS5741369 A JP S5741369A JP 11706980 A JP11706980 A JP 11706980A JP 11706980 A JP11706980 A JP 11706980A JP S5741369 A JPS5741369 A JP S5741369A
Authority
JP
Japan
Prior art keywords
chamber
take
substrates
chambers
respective chambers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11706980A
Other languages
Japanese (ja)
Other versions
JPS609102B2 (en
Inventor
Hideki Tateishi
Tsuneaki Kamei
Katsuo Abe
Hide Kobayashi
Susumu Aiuchi
Masashi Nakatsuka
Nobuyuki Takahashi
Ryuji Sugimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Anelva Corp
Hitachi Ltd
Original Assignee
Hitachi Ltd
Anelva Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Anelva Corp filed Critical Hitachi Ltd
Priority to JP11706980A priority Critical patent/JPS609102B2/en
Priority to US06/296,314 priority patent/US4405435A/en
Publication of JPS5741369A publication Critical patent/JPS5741369A/en
Publication of JPS609102B2 publication Critical patent/JPS609102B2/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • C23C14/566—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases using a load-lock chamber

Abstract

PURPOSE:To reduce the size of a titled device, and form thin films of stable film quality on substrates with good productivity by providing a take-in chamber, the 1st containing chamber, a vacuum treatment chamber, the 2nd containing chamber and a take-out chamber, and suitably disposing respective treating means. CONSTITUTION:A take-in chamber 52, the 1st containing chamber 53, a sputter etching chamber 54, a puttering chamber 55, a cooling chamber 56, the 2nd containing chamber 57, and a take-out chamber 58 are disposed in a U shape, and gate valves 64, 71, 77, 86, 101, 106, 113, 120 which operate to open only when substrates 3 pass are provided to the side wall on the inlet side of the chamber 52, between the respective chambers and the side wall on the outlet side of the chamber 58. Next, in the respective chambers, conveyor belts and exhaust ports 69, 76, 84, 100, 105, 112, 119 connecting to vacuum pumps are provided in the respective chambers. Further, cassette elevators 67, 74, 110, 117 are provided to the chambers 52, 53, 57, 58, and a sputter etching electrode 83 is provided in the chamber 54, and sputtering electrodes 90, 96 are provided in the chamber 55. Outside containing means 50, 59 for substrates are provided on the inlet side of the chamber 52 and the outlet side of the chamber 58.
JP11706980A 1980-08-27 1980-08-27 Continuous vacuum processing equipment Expired JPS609102B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP11706980A JPS609102B2 (en) 1980-08-27 1980-08-27 Continuous vacuum processing equipment
US06/296,314 US4405435A (en) 1980-08-27 1981-08-26 Apparatus for performing continuous treatment in vacuum

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11706980A JPS609102B2 (en) 1980-08-27 1980-08-27 Continuous vacuum processing equipment

Publications (2)

Publication Number Publication Date
JPS5741369A true JPS5741369A (en) 1982-03-08
JPS609102B2 JPS609102B2 (en) 1985-03-07

Family

ID=14702644

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11706980A Expired JPS609102B2 (en) 1980-08-27 1980-08-27 Continuous vacuum processing equipment

Country Status (1)

Country Link
JP (1) JPS609102B2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59208074A (en) * 1983-05-13 1984-11-26 Toshiba Corp Sheet type film forming device
JPS61149476A (en) * 1984-12-24 1986-07-08 Toshiba Corp Sputtering device
JPS6280265A (en) * 1985-10-04 1987-04-13 Toshiba Corp Vacuum treatment device
JPH0353554U (en) * 1989-09-28 1991-05-23
KR100667886B1 (en) 2005-07-01 2007-01-11 주식회사 에스에프에이 In-line sputtering system
CN112391608A (en) * 2020-11-13 2021-02-23 宁波沁圆科技有限公司 CVD processing system and processing method

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59208074A (en) * 1983-05-13 1984-11-26 Toshiba Corp Sheet type film forming device
JPS6325068B2 (en) * 1983-05-13 1988-05-24 Tokyo Shibaura Electric Co
JPS61149476A (en) * 1984-12-24 1986-07-08 Toshiba Corp Sputtering device
JPH0375631B2 (en) * 1984-12-24 1991-12-02 Tokyo Shibaura Electric Co
JPS6280265A (en) * 1985-10-04 1987-04-13 Toshiba Corp Vacuum treatment device
JPH0353554U (en) * 1989-09-28 1991-05-23
KR100667886B1 (en) 2005-07-01 2007-01-11 주식회사 에스에프에이 In-line sputtering system
CN112391608A (en) * 2020-11-13 2021-02-23 宁波沁圆科技有限公司 CVD processing system and processing method

Also Published As

Publication number Publication date
JPS609102B2 (en) 1985-03-07

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