JPS57121246A - Semiconductor treating device - Google Patents

Semiconductor treating device

Info

Publication number
JPS57121246A
JPS57121246A JP638281A JP638281A JPS57121246A JP S57121246 A JPS57121246 A JP S57121246A JP 638281 A JP638281 A JP 638281A JP 638281 A JP638281 A JP 638281A JP S57121246 A JPS57121246 A JP S57121246A
Authority
JP
Japan
Prior art keywords
lid
semiconductor
furnace
feeding
feeding inlet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP638281A
Other languages
Japanese (ja)
Inventor
Hiroto Nagatomo
Tetsuya Takagaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP638281A priority Critical patent/JPS57121246A/en
Publication of JPS57121246A publication Critical patent/JPS57121246A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54—Apparatus specially adapted for continuous coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)

Abstract

PURPOSE:To make automation of opening and closing of a lid possible in addition to improvement on space factor of a feeding inlet by a method wherein a movable lid of a furnace for treatment on a semiconductor is provided so that it may be opened and closed along the direction which traverses the feeding for the semiconductor. CONSTITUTION:A circular movable lid 14 which opens and closes a feeding inlet 12 of a process tube 10 in a semiconductor treating furnace such as a low-pressure diffusion furnace and a low-pressure CVD furnace or the like is opened and closed along C direction in consequence with a movement of a cam plate 24 by a lid activating mechanism 18 consisting of a lid supporter 20 which supprots it, a guide rail 22 through which the supporter 20 is slid, and the cam plate 24 which guides the supporter 20 along the direction approximately traverse to the feeding direction of the product into a feeding inlet 12. By this method, there is no necessity for a large space in front of the feeding inlet 12 and regardless of large adhering force against a flange 16, the movable lid can be opened and colosed with a comparatively small force.
JP638281A 1981-01-21 1981-01-21 Semiconductor treating device Pending JPS57121246A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP638281A JPS57121246A (en) 1981-01-21 1981-01-21 Semiconductor treating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP638281A JPS57121246A (en) 1981-01-21 1981-01-21 Semiconductor treating device

Publications (1)

Publication Number Publication Date
JPS57121246A true JPS57121246A (en) 1982-07-28

Family

ID=11636827

Family Applications (1)

Application Number Title Priority Date Filing Date
JP638281A Pending JPS57121246A (en) 1981-01-21 1981-01-21 Semiconductor treating device

Country Status (1)

Country Link
JP (1) JPS57121246A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS587820A (en) * 1981-07-07 1983-01-17 Toshiba Corp Open-close device for tube inlet in diffusion reactor
JPS61267805A (en) * 1985-05-23 1986-11-27 Teru Saamuko Kk Shutter device
EP1367145A1 (en) * 2002-05-24 2003-12-03 Schott Glas CVD apparatus

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5295968A (en) * 1976-02-09 1977-08-12 Hitachi Ltd Diffusion furnace with automatic shutter
JPS5565432A (en) * 1978-11-13 1980-05-16 Hitachi Ltd Sealed-type vacuum vessel

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5295968A (en) * 1976-02-09 1977-08-12 Hitachi Ltd Diffusion furnace with automatic shutter
JPS5565432A (en) * 1978-11-13 1980-05-16 Hitachi Ltd Sealed-type vacuum vessel

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS587820A (en) * 1981-07-07 1983-01-17 Toshiba Corp Open-close device for tube inlet in diffusion reactor
JPH0154852B2 (en) * 1981-07-07 1989-11-21 Tokyo Shibaura Electric Co
JPS61267805A (en) * 1985-05-23 1986-11-27 Teru Saamuko Kk Shutter device
EP1367145A1 (en) * 2002-05-24 2003-12-03 Schott Glas CVD apparatus
JP2004003026A (en) * 2002-05-24 2004-01-08 Carl-Zeiss-Stiftung Chemical vapor deposition treatment system

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