JPH0154852B2 - - Google Patents

Info

Publication number
JPH0154852B2
JPH0154852B2 JP56104998A JP10499881A JPH0154852B2 JP H0154852 B2 JPH0154852 B2 JP H0154852B2 JP 56104998 A JP56104998 A JP 56104998A JP 10499881 A JP10499881 A JP 10499881A JP H0154852 B2 JPH0154852 B2 JP H0154852B2
Authority
JP
Japan
Prior art keywords
tube
opening
closing
mounting shaft
diffusion furnace
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56104998A
Other languages
Japanese (ja)
Other versions
JPS587820A (en
Inventor
Akyuki Furuya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP10499881A priority Critical patent/JPS587820A/en
Publication of JPS587820A publication Critical patent/JPS587820A/en
Publication of JPH0154852B2 publication Critical patent/JPH0154852B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67754Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Description

【発明の詳細な説明】 本発明は拡散炉におけるチユーブ入口開閉装置
に関するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a tube inlet opening/closing device in a diffusion furnace.

従来、半導体ウエハの拡散処理に用いられる拡
散炉のチユーブ入口開閉は、人手に依つており、
作業者がすり合せ式のキヤツプをチユーブ入口に
挿し込むことにより実施されている。しかしこの
作業は高温および高所での作業であることから危
険が多いため、最近ではそのチユーブ入口開閉を
機械によつて行なつている。
Conventionally, opening and closing the tube entrance of a diffusion furnace used for semiconductor wafer diffusion processing has been done manually.
This is done by a worker inserting a sliding cap into the tube entrance. However, this work is very dangerous as it involves high temperatures and high places, so recently the tube entrance is opened and closed by a machine.

第1図はその拡散炉のチユーブ入口開閉装置の
一例を示し、該装置では、チユーブ入口の開閉動
作が、チユーブ1の中心軸に直交する取付軸2に
取着された開閉板3を、図示しない駆動手段によ
つて矢印aに示す方向に回動することによつてな
されている。そのため、取付軸2から最遠となる
開閉板先端部は破線bのような軌跡をとつて運動
するので、その破線bの左側の領域には、ボート
受け4を支持する支工5を設けることができな
い。
FIG. 1 shows an example of a tube inlet opening/closing device for the diffusion furnace. This is done by rotating in the direction shown by the arrow a by means of a drive means that does not have the same structure. Therefore, since the tip of the opening/closing plate that is farthest from the mounting shaft 2 moves along a trajectory shown by the broken line b, a support 5 that supports the boat support 4 is provided in the area to the left of the broken line b. I can't.

ところで、半導体ウエハ6を塔載するボート7
は、一般に、熱容量を低限するなどの目的から出
来る限り短く形成されている。したがつて、上記
のような開閉装置を具備する拡散炉のチユーブ1
にボートを挿入する場合には、開閉板3が開かれ
た後に支工5をチユーブ側へ移動させるか、さも
なくば上記領域に新たにボート7を保持させるた
めの昇降手段(図示せず)を設ける必要がある。
By the way, the boat 7 on which the semiconductor wafers 6 are loaded
is generally made as short as possible for purposes such as limiting heat capacity. Therefore, the tube 1 of the diffusion furnace equipped with the above-mentioned opening/closing device
When inserting a boat into the area, after the opening/closing plate 3 is opened, the support 5 is moved to the tube side, or else a lifting means (not shown) is used to newly hold the boat 7 in the above area. It is necessary to provide

そのため、装置全体のコストの上昇や信頼性の
低下を招来し、さらには、装置の保守点検の回数
を増やさなければならないなどの難点があつた。
This results in an increase in the cost and a decrease in reliability of the entire device, and furthermore, there are drawbacks such as the need to increase the frequency of maintenance and inspection of the device.

本発明はかかる難点を解消するためなされたも
ので、拡散炉におけるチユーブの中心軸に平行し
て設けた取付軸に、前記チユーブ入口を開閉する
ための開閉板を取着すると共に、該取付軸をその
軸線の回りに回動させかつ前記取付軸をその軸線
方向に往復動させるための駆動手段を連結させた
ことを特徴とする拡散炉におけるチユーブ入口開
閉装置を提供するものである。
The present invention has been made to solve this problem, and includes attaching an opening/closing plate for opening and closing the inlet of the tube to a mounting shaft provided parallel to the central axis of the tube in a diffusion furnace. The present invention provides a tube inlet opening/closing device for a diffusion furnace, characterized in that the tube inlet opening/closing device for a diffusion furnace is connected to a driving means for rotating the tube around its axis and reciprocating the mounting shaft in the axial direction.

以下、本発明の詳細を図面に示す実施例に基づ
いて説明する。なお、以下の図面で、第1図と同
一部材は同一符号で表わすものとする。
Hereinafter, details of the present invention will be explained based on embodiments shown in the drawings. In the following drawings, the same members as in FIG. 1 are denoted by the same symbols.

第2図は、本発明に係るチユーブ入口開閉装置
を示し、該装置では、チユーブ1の開閉を行なう
ための開閉板8が、チユーブ1の中心軸に平行に
設けた取付軸9に取着されている。また、取付軸
9は、該取付軸9をその軸線の回りに回動させか
つ該取付軸9をその軸線方向に往復動させるため
の駆動手段(図示せず)に連結されている。例え
ば、この駆動手段としては、エアーシリンダ等が
用いられる。
FIG. 2 shows a tube inlet opening/closing device according to the present invention, in which an opening/closing plate 8 for opening and closing the tube 1 is attached to a mounting shaft 9 provided parallel to the central axis of the tube 1. ing. Further, the mounting shaft 9 is connected to a driving means (not shown) for rotating the mounting shaft 9 about its axis and reciprocating the mounting shaft 9 in its axial direction. For example, an air cylinder or the like is used as this driving means.

而して、かかるチユーブ入口開閉装置では、半
導体ウエハ6を塔載するボート7をチユーブ1に
挿入するにあたつては、第3図のように開閉板8
を手前側に位置させたた状態で行なう。そして、
ボート7がチユーブ1に挿入された後、駆動手段
によつて取付軸9を回動させ、取付板8をチユー
ブ1の中心と致心させる。続いて、該取付軸9
を、チユーブ入口に近づく方向に移動させ、取付
板8をチユーブ1の入口面に圧接させる。この場
合、チユーブ1の気密性を確保するために、チユ
ーブ1にOリングを続けておくことが好ましい。
In this tube entrance opening/closing device, when inserting the boat 7 carrying the semiconductor wafers 6 into the tube 1, the opening/closing plate 8 is moved as shown in FIG.
Place it in front of you and fold it up. and,
After the boat 7 is inserted into the tube 1, the mounting shaft 9 is rotated by the driving means to center the mounting plate 8 on the center of the tube 1. Next, the mounting shaft 9
is moved in the direction approaching the tube inlet, and the mounting plate 8 is brought into pressure contact with the inlet surface of the tube 1. In this case, in order to ensure the airtightness of the tube 1, it is preferable to keep an O-ring attached to the tube 1.

一方、チユーブ入口の遮蔽は、上記操作と逆の
順序を経て行なわれる。
On the other hand, shielding the tube entrance is performed through the reverse order of the above operations.

以上の実施例からも明らかなように、本発明に
よれば、チユーブの中心軸に平行して設けた取付
軸に開閉板を取着すると共に、該取付軸をその軸
線の回りに回動させかつ前記取付軸をその軸線方
向に往復動させるための駆動手段を連結させ、そ
れによりチユーブ入口の開閉を行なつているた
め、支工が設けられない空間が小さくなる。ちな
みに、その値を比較してみると、開閉板の大きさ
を100mm〜200mmとすると、従来のものではこの距
離が支工が設けられない空間として存在するが、
本発明では取着板がチユーブの中心軸方向に10mm
〜20mm、即ちその気密を解除できる長さだけ移動
できれば良く、開閉板の厚さを考慮した場合でも
確実に上記距離は1/3〜1/5となる。したがつて、
従来のように開閉板を開けた後に、支工をチユー
ブ側に移動させたり、またボート挿入のための昇
降手段も必要としないため自動化に適する。ま
た、ボートを自動的に挿入する機構を組合せる場
合でも、駆動部を少なくでき、装置全体の価格の
低減と信頼性の向上が図れるという利点がある。
As is clear from the above embodiments, according to the present invention, the opening/closing plate is attached to the mounting shaft provided parallel to the central axis of the tube, and the mounting shaft is rotated around the axis. Further, since a drive means for reciprocating the mounting shaft in its axial direction is connected, and the tube entrance is opened and closed thereby, the space where no support is provided is reduced. By the way, when comparing the values, if the size of the opening/closing plate is 100 mm to 200 mm, with conventional models this distance exists as a space where no supports can be installed.
In the present invention, the mounting plate is 10mm in the direction of the center axis of the tube.
It is only necessary to move by ~20 mm, that is, a length that can break the airtightness, and even when considering the thickness of the opening/closing plate, the above distance will definitely be 1/3 to 1/5. Therefore,
It is suitable for automation because it does not require moving the support to the tube side after opening the opening/closing plate like in the past, nor does it require lifting means to insert the boat. Further, even when a mechanism for automatically inserting the boat is combined, there is an advantage that the number of driving parts can be reduced, and the cost of the entire device can be reduced and reliability can be improved.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来のチユーブ入口開閉装置の説明
図、第2および第3図は本発明に係るチユーブ入
口開閉装置の説明図である。 1……チユーブ、2,9……取付軸、3,8…
…開閉板。
FIG. 1 is an explanatory diagram of a conventional tube inlet opening/closing device, and FIGS. 2 and 3 are explanatory diagrams of a tube inlet opening/closing device according to the present invention. 1...Tube, 2,9...Mounting shaft, 3,8...
...Opening/closing board.

Claims (1)

【特許請求の範囲】[Claims] 1 拡散炉におけるチユーブの中心軸に平行して
設けた取付軸に、前記チユーブ入口を開閉するた
めの開閉板を取着すると共に、該取付軸をその軸
線の回りに回動させかつ前記取付軸をその軸線方
向に往復動させるための駆動手段を連結させたこ
とを特徴とする拡散炉におけるチユーブ入口開閉
装置。
1 Attach an opening/closing plate for opening and closing the tube inlet to a mounting shaft provided parallel to the central axis of the tube in the diffusion furnace, and rotate the mounting shaft around the axis and A tube inlet opening/closing device for a diffusion furnace, characterized in that a tube inlet opening/closing device is connected to a drive means for reciprocating the tube in its axial direction.
JP10499881A 1981-07-07 1981-07-07 Open-close device for tube inlet in diffusion reactor Granted JPS587820A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10499881A JPS587820A (en) 1981-07-07 1981-07-07 Open-close device for tube inlet in diffusion reactor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10499881A JPS587820A (en) 1981-07-07 1981-07-07 Open-close device for tube inlet in diffusion reactor

Publications (2)

Publication Number Publication Date
JPS587820A JPS587820A (en) 1983-01-17
JPH0154852B2 true JPH0154852B2 (en) 1989-11-21

Family

ID=14395761

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10499881A Granted JPS587820A (en) 1981-07-07 1981-07-07 Open-close device for tube inlet in diffusion reactor

Country Status (1)

Country Link
JP (1) JPS587820A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60169660A (en) * 1984-02-14 1985-09-03 Nippon Mining Co Ltd Combustivity improving method for diesel engine fuel
JPH06105692B2 (en) * 1988-06-24 1994-12-21 ソニー株式会社 Heat treatment equipment
DE8902607U1 (en) * 1989-03-04 1989-06-22 Owis GmbH, 7813 Staufen Device on an oxidation or diffusion furnace

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57121246A (en) * 1981-01-21 1982-07-28 Hitachi Ltd Semiconductor treating device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6311719Y2 (en) * 1981-03-09 1988-04-05

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57121246A (en) * 1981-01-21 1982-07-28 Hitachi Ltd Semiconductor treating device

Also Published As

Publication number Publication date
JPS587820A (en) 1983-01-17

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