JPS5758319A - Wafer chuck device - Google Patents
Wafer chuck deviceInfo
- Publication number
- JPS5758319A JPS5758319A JP55132914A JP13291480A JPS5758319A JP S5758319 A JPS5758319 A JP S5758319A JP 55132914 A JP55132914 A JP 55132914A JP 13291480 A JP13291480 A JP 13291480A JP S5758319 A JPS5758319 A JP S5758319A
- Authority
- JP
- Japan
- Prior art keywords
- chuck
- wafer
- flatness
- shape
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55132914A JPS5758319A (en) | 1980-09-26 | 1980-09-26 | Wafer chuck device |
| DE3110341A DE3110341C2 (de) | 1980-03-19 | 1981-03-17 | Verfahren und Vorrichtung zum Ausrichten eines dünnen Substrats in der Bildebene eines Kopiergerätes |
| US06/245,193 US4391511A (en) | 1980-03-19 | 1981-03-18 | Light exposure device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55132914A JPS5758319A (en) | 1980-09-26 | 1980-09-26 | Wafer chuck device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5758319A true JPS5758319A (en) | 1982-04-08 |
| JPS6322454B2 JPS6322454B2 (https=) | 1988-05-12 |
Family
ID=15092466
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP55132914A Granted JPS5758319A (en) | 1980-03-19 | 1980-09-26 | Wafer chuck device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5758319A (https=) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59121932A (ja) * | 1982-12-28 | 1984-07-14 | Fujitsu Ltd | 自動焦点制御装置 |
| JP2012015508A (ja) * | 2010-06-30 | 2012-01-19 | Asml Holding Nv | レチクルクランプシステム |
-
1980
- 1980-09-26 JP JP55132914A patent/JPS5758319A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59121932A (ja) * | 1982-12-28 | 1984-07-14 | Fujitsu Ltd | 自動焦点制御装置 |
| JP2012015508A (ja) * | 2010-06-30 | 2012-01-19 | Asml Holding Nv | レチクルクランプシステム |
| US9274439B2 (en) | 2010-06-30 | 2016-03-01 | Asml Holding N.V. | Reticle clamping system |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6322454B2 (https=) | 1988-05-12 |
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