JPS5434778A - Mask aligner - Google Patents

Mask aligner

Info

Publication number
JPS5434778A
JPS5434778A JP10049477A JP10049477A JPS5434778A JP S5434778 A JPS5434778 A JP S5434778A JP 10049477 A JP10049477 A JP 10049477A JP 10049477 A JP10049477 A JP 10049477A JP S5434778 A JPS5434778 A JP S5434778A
Authority
JP
Japan
Prior art keywords
mask aligner
mask
blowing
circumference
separating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10049477A
Other languages
Japanese (ja)
Other versions
JPS5952536B2 (en
Inventor
Yoshimitsu Tanaka
Yasushi Asami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP52100494A priority Critical patent/JPS5952536B2/en
Publication of JPS5434778A publication Critical patent/JPS5434778A/en
Publication of JPS5952536B2 publication Critical patent/JPS5952536B2/en
Expired legal-status Critical Current

Links

Abstract

PURPOSE:To simplify detachment by a vacuum chuck at the time of separating a semiconductor wafer adhered to a mask by generating wedge action by blowing a gas mainly on the circumference of a wafer adhesive surface.
JP52100494A 1977-08-24 1977-08-24 mask aligner Expired JPS5952536B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP52100494A JPS5952536B2 (en) 1977-08-24 1977-08-24 mask aligner

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP52100494A JPS5952536B2 (en) 1977-08-24 1977-08-24 mask aligner

Publications (2)

Publication Number Publication Date
JPS5434778A true JPS5434778A (en) 1979-03-14
JPS5952536B2 JPS5952536B2 (en) 1984-12-20

Family

ID=14275470

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52100494A Expired JPS5952536B2 (en) 1977-08-24 1977-08-24 mask aligner

Country Status (1)

Country Link
JP (1) JPS5952536B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55130542A (en) * 1979-03-30 1980-10-09 Fujitsu Ltd Exposing method
US20100291289A1 (en) * 2009-05-13 2010-11-18 Samsung Electro-Mechanics Co., Ltd. Bump printing apparatus and method of controlling the same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55130542A (en) * 1979-03-30 1980-10-09 Fujitsu Ltd Exposing method
US20100291289A1 (en) * 2009-05-13 2010-11-18 Samsung Electro-Mechanics Co., Ltd. Bump printing apparatus and method of controlling the same
US8297486B2 (en) * 2009-05-13 2012-10-30 Samsung Electro-Mechanics Co., Ltd. Bump printing apparatus and method of controlling the same
US8408449B2 (en) 2009-05-13 2013-04-02 Samsung Electro-Mechanics Co., Ltd. Method of controlling bump printing apparatus

Also Published As

Publication number Publication date
JPS5952536B2 (en) 1984-12-20

Similar Documents

Publication Publication Date Title
JPS5225651A (en) Process for fabricating an optical curved surface using a photopolymer izable adhesive
JPS5434778A (en) Mask aligner
JPS5432143A (en) Etching process
JPS52155494A (en) Process for w orking parallel plane of wafer
JPS5482173A (en) Wafer adhesion/separation mechanism for mask aligner
JPS5414679A (en) Plasma etching device
JPS55110246A (en) Production of photomask
JPS5353962A (en) Production of semicnductor wafers
JPS5384684A (en) Plasma etching device
JPS5437468A (en) Breaking device for semiconductor wafer
JPS535573A (en) Photo mask for semiconductor device
JPS51140469A (en) Wafer cracking process
JPS5371566A (en) Wafer matching equipment
JPS5314548A (en) Cathode for electronic tube
JPS5339855A (en) Production of semiconductor device
JPS5227276A (en) Glass mask holder
JPS52118696A (en) Apparatus for grinding semi-conductor wafer
JPS545386A (en) Surface processor for wafer
JPS5257592A (en) Sheet for processing lenses
JPS5345975A (en) Mask for exposure
JPS52174A (en) Plasma etching process
JPS5229147A (en) Semiconductor directoscillator
JPS53123068A (en) Holding jig for shadow mask
JPS5263674A (en) Semiconductor device
JPS51135465A (en) Semi-conductor unit

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090525

Year of fee payment: 8

FPAY Renewal fee payment (prs date is renewal date of database)

Year of fee payment: 9

Free format text: PAYMENT UNTIL: 20100525

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110525

Year of fee payment: 10

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120525

Year of fee payment: 11

FPAY Renewal fee payment (prs date is renewal date of database)

Year of fee payment: 12

Free format text: PAYMENT UNTIL: 20130525

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term