JPS51140469A - Wafer cracking process - Google Patents

Wafer cracking process

Info

Publication number
JPS51140469A
JPS51140469A JP50064196A JP6419675A JPS51140469A JP S51140469 A JPS51140469 A JP S51140469A JP 50064196 A JP50064196 A JP 50064196A JP 6419675 A JP6419675 A JP 6419675A JP S51140469 A JPS51140469 A JP S51140469A
Authority
JP
Japan
Prior art keywords
cracking process
wafer cracking
wafer
cracking
mistake
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50064196A
Other languages
Japanese (ja)
Inventor
Tatsumi Kuramoto
Yukitaka Tsunoda
Takao Ishihara
Yoichi Otoguro
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50064196A priority Critical patent/JPS51140469A/en
Publication of JPS51140469A publication Critical patent/JPS51140469A/en
Pending legal-status Critical Current

Links

Landscapes

  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)

Abstract

PURPOSE:To eliminate a mistake in cracking upon cracking of silicon wafer.
JP50064196A 1975-05-30 1975-05-30 Wafer cracking process Pending JPS51140469A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50064196A JPS51140469A (en) 1975-05-30 1975-05-30 Wafer cracking process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50064196A JPS51140469A (en) 1975-05-30 1975-05-30 Wafer cracking process

Publications (1)

Publication Number Publication Date
JPS51140469A true JPS51140469A (en) 1976-12-03

Family

ID=13251064

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50064196A Pending JPS51140469A (en) 1975-05-30 1975-05-30 Wafer cracking process

Country Status (1)

Country Link
JP (1) JPS51140469A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01190412A (en) * 1988-01-26 1989-07-31 Nachi Fujikoshi Corp Cutting of plate-shaped brittle material and its device
CN102543708A (en) * 2010-12-27 2012-07-04 隆达电子股份有限公司 Wafer splitting device and wafer splitting process
CN102729340A (en) * 2011-04-15 2012-10-17 隆达电子股份有限公司 Crystal grain splitting process

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4923952A (en) * 1972-06-30 1974-03-02

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4923952A (en) * 1972-06-30 1974-03-02

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01190412A (en) * 1988-01-26 1989-07-31 Nachi Fujikoshi Corp Cutting of plate-shaped brittle material and its device
CN102543708A (en) * 2010-12-27 2012-07-04 隆达电子股份有限公司 Wafer splitting device and wafer splitting process
CN102729340A (en) * 2011-04-15 2012-10-17 隆达电子股份有限公司 Crystal grain splitting process

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