JPS5482173A - Wafer adhesion/separation mechanism for mask aligner - Google Patents
Wafer adhesion/separation mechanism for mask alignerInfo
- Publication number
- JPS5482173A JPS5482173A JP14922277A JP14922277A JPS5482173A JP S5482173 A JPS5482173 A JP S5482173A JP 14922277 A JP14922277 A JP 14922277A JP 14922277 A JP14922277 A JP 14922277A JP S5482173 A JPS5482173 A JP S5482173A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- mask
- vent
- sucking disc
- circumference
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE: To secure smooth adhesion and separation of the wafer by providing the sucking disc at the wafer circumference area of the chuck. The sucking disc expands and pushes the wafer when the mask is adhered to the wafer and contracts to suck the wafer when separating the mask from the wafer.
CONSTITUTION: With supply of the compressed N2 gas through vent 10a, the center part of wafer 14 is adhered earlier than the circumference part to mask 16, and furthermore high-voltage N2 is supplied through vent 10b to expand sucking disc 12 and thus to adhere the wafer circumference to the mask. In this way, the mask adheres uniformly to the wafer. Vent 10b is exhausted first and then the vacuum exhaustion is given to vent 10a, and thus the wafer circumference is separated first from the mask via the function of the sucking disc. And then the whole wafer is separated by the vacuum force of the chuck. Thus, the smooth adhesion and separation becomes possible for the wafer.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP52149222A JPS6019657B2 (en) | 1977-12-14 | 1977-12-14 | Mask aligner wafer adhesion/separation mechanism |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP52149222A JPS6019657B2 (en) | 1977-12-14 | 1977-12-14 | Mask aligner wafer adhesion/separation mechanism |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5482173A true JPS5482173A (en) | 1979-06-30 |
JPS6019657B2 JPS6019657B2 (en) | 1985-05-17 |
Family
ID=15470518
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP52149222A Expired JPS6019657B2 (en) | 1977-12-14 | 1977-12-14 | Mask aligner wafer adhesion/separation mechanism |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6019657B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108074856A (en) * | 2016-11-10 | 2018-05-25 | 辛耘企业股份有限公司 | Monobasal processing unit |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0340461U (en) * | 1989-08-30 | 1991-04-18 |
-
1977
- 1977-12-14 JP JP52149222A patent/JPS6019657B2/en not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108074856A (en) * | 2016-11-10 | 2018-05-25 | 辛耘企业股份有限公司 | Monobasal processing unit |
CN108074856B (en) * | 2016-11-10 | 2020-06-09 | 辛耘企业股份有限公司 | Single substrate processing apparatus |
Also Published As
Publication number | Publication date |
---|---|
JPS6019657B2 (en) | 1985-05-17 |
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