JPS5482173A - Wafer adhesion/separation mechanism for mask aligner - Google Patents

Wafer adhesion/separation mechanism for mask aligner

Info

Publication number
JPS5482173A
JPS5482173A JP14922277A JP14922277A JPS5482173A JP S5482173 A JPS5482173 A JP S5482173A JP 14922277 A JP14922277 A JP 14922277A JP 14922277 A JP14922277 A JP 14922277A JP S5482173 A JPS5482173 A JP S5482173A
Authority
JP
Japan
Prior art keywords
wafer
mask
vent
sucking disc
circumference
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14922277A
Other languages
Japanese (ja)
Other versions
JPS6019657B2 (en
Inventor
Hiroshi Nishizuka
Hiroshi Maejima
Kiyoshi Yoshida
Mitsuhiro Morita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP52149222A priority Critical patent/JPS6019657B2/en
Publication of JPS5482173A publication Critical patent/JPS5482173A/en
Publication of JPS6019657B2 publication Critical patent/JPS6019657B2/en
Expired legal-status Critical Current

Links

Abstract

PURPOSE: To secure smooth adhesion and separation of the wafer by providing the sucking disc at the wafer circumference area of the chuck. The sucking disc expands and pushes the wafer when the mask is adhered to the wafer and contracts to suck the wafer when separating the mask from the wafer.
CONSTITUTION: With supply of the compressed N2 gas through vent 10a, the center part of wafer 14 is adhered earlier than the circumference part to mask 16, and furthermore high-voltage N2 is supplied through vent 10b to expand sucking disc 12 and thus to adhere the wafer circumference to the mask. In this way, the mask adheres uniformly to the wafer. Vent 10b is exhausted first and then the vacuum exhaustion is given to vent 10a, and thus the wafer circumference is separated first from the mask via the function of the sucking disc. And then the whole wafer is separated by the vacuum force of the chuck. Thus, the smooth adhesion and separation becomes possible for the wafer.
COPYRIGHT: (C)1979,JPO&Japio
JP52149222A 1977-12-14 1977-12-14 Mask aligner wafer adhesion/separation mechanism Expired JPS6019657B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP52149222A JPS6019657B2 (en) 1977-12-14 1977-12-14 Mask aligner wafer adhesion/separation mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP52149222A JPS6019657B2 (en) 1977-12-14 1977-12-14 Mask aligner wafer adhesion/separation mechanism

Publications (2)

Publication Number Publication Date
JPS5482173A true JPS5482173A (en) 1979-06-30
JPS6019657B2 JPS6019657B2 (en) 1985-05-17

Family

ID=15470518

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52149222A Expired JPS6019657B2 (en) 1977-12-14 1977-12-14 Mask aligner wafer adhesion/separation mechanism

Country Status (1)

Country Link
JP (1) JPS6019657B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108074856A (en) * 2016-11-10 2018-05-25 辛耘企业股份有限公司 Monobasal processing unit

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0340461U (en) * 1989-08-30 1991-04-18

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108074856A (en) * 2016-11-10 2018-05-25 辛耘企业股份有限公司 Monobasal processing unit
CN108074856B (en) * 2016-11-10 2020-06-09 辛耘企业股份有限公司 Single substrate processing apparatus

Also Published As

Publication number Publication date
JPS6019657B2 (en) 1985-05-17

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