JPS5758319A - Wafer chuck device - Google Patents
Wafer chuck deviceInfo
- Publication number
- JPS5758319A JPS5758319A JP55132914A JP13291480A JPS5758319A JP S5758319 A JPS5758319 A JP S5758319A JP 55132914 A JP55132914 A JP 55132914A JP 13291480 A JP13291480 A JP 13291480A JP S5758319 A JPS5758319 A JP S5758319A
- Authority
- JP
- Japan
- Prior art keywords
- chuck
- wafer
- flatness
- shape
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55132914A JPS5758319A (en) | 1980-09-26 | 1980-09-26 | Wafer chuck device |
DE3110341A DE3110341C2 (de) | 1980-03-19 | 1981-03-17 | Verfahren und Vorrichtung zum Ausrichten eines dünnen Substrats in der Bildebene eines Kopiergerätes |
US06/245,193 US4391511A (en) | 1980-03-19 | 1981-03-18 | Light exposure device and method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55132914A JPS5758319A (en) | 1980-09-26 | 1980-09-26 | Wafer chuck device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5758319A true JPS5758319A (en) | 1982-04-08 |
JPS6322454B2 JPS6322454B2 (ja) | 1988-05-12 |
Family
ID=15092466
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP55132914A Granted JPS5758319A (en) | 1980-03-19 | 1980-09-26 | Wafer chuck device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5758319A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59121932A (ja) * | 1982-12-28 | 1984-07-14 | Fujitsu Ltd | 自動焦点制御装置 |
JP2012015508A (ja) * | 2010-06-30 | 2012-01-19 | Asml Holding Nv | レチクルクランプシステム |
-
1980
- 1980-09-26 JP JP55132914A patent/JPS5758319A/ja active Granted
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59121932A (ja) * | 1982-12-28 | 1984-07-14 | Fujitsu Ltd | 自動焦点制御装置 |
JPS6355859B2 (ja) * | 1982-12-28 | 1988-11-04 | Fujitsu Ltd | |
JP2012015508A (ja) * | 2010-06-30 | 2012-01-19 | Asml Holding Nv | レチクルクランプシステム |
US9274439B2 (en) | 2010-06-30 | 2016-03-01 | Asml Holding N.V. | Reticle clamping system |
Also Published As
Publication number | Publication date |
---|---|
JPS6322454B2 (ja) | 1988-05-12 |
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