JPS5753966A - Protection for metal pattern - Google Patents
Protection for metal patternInfo
- Publication number
- JPS5753966A JPS5753966A JP12973280A JP12973280A JPS5753966A JP S5753966 A JPS5753966 A JP S5753966A JP 12973280 A JP12973280 A JP 12973280A JP 12973280 A JP12973280 A JP 12973280A JP S5753966 A JPS5753966 A JP S5753966A
- Authority
- JP
- Japan
- Prior art keywords
- resist
- metal pattern
- pattern
- substrate
- side face
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE:To protect the side face of a metal pattern from corrosion by a method wherein a metal pattern is formed on a substrate using a photosensitive resin pattern, the resin is allowed to run on the substrate by heating up the substrate and the side face of the metal pattern is covered with the resin. CONSTITUTION:A resist mask 13 is applied to the Al on a wafer 11 and an Al wiring pattern 14 is formed by performing an etching using gas. Subsequently, the resist 13 is heated up to the softening temperature without exposing to the air directly and it is maintained in that state, and then the side face of the Al 14 is covered by the resist by allowing the resist 13 to run. According to this constitution, as the wafer is not exposed to the air directly, HCl is not generated even when Cl is adhered to the side surface of the Al wiring, and also even when the HCl is generated on the circumference of the resist, the Al is not corroded because it is not come in contact with the Al wiring pattern directly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12973280A JPS5753966A (en) | 1980-09-17 | 1980-09-17 | Protection for metal pattern |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12973280A JPS5753966A (en) | 1980-09-17 | 1980-09-17 | Protection for metal pattern |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5753966A true JPS5753966A (en) | 1982-03-31 |
Family
ID=15016826
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12973280A Pending JPS5753966A (en) | 1980-09-17 | 1980-09-17 | Protection for metal pattern |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5753966A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01220428A (en) * | 1988-02-28 | 1989-09-04 | J C C Eng Kk | Method and apparatus for winding electrolytic capacitor element |
| US5213996A (en) * | 1990-07-04 | 1993-05-25 | Mitsubishi Denki Kabushiki Kaisha | Method and apparatus for forming interconnection pattern and semiconductor device having such interconnection pattern |
| US5418397A (en) * | 1990-07-04 | 1995-05-23 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device having an interconnection pattern |
| US5459092A (en) * | 1989-01-27 | 1995-10-17 | Matsushita Electric Industrial Co., Ltd. | Method for fabricating an active matrix addressed liquid crystal image device |
| US10515457B2 (en) | 2016-09-20 | 2019-12-24 | Kabushiki Kaisha Toshiba | Image collation system and image collation method |
-
1980
- 1980-09-17 JP JP12973280A patent/JPS5753966A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01220428A (en) * | 1988-02-28 | 1989-09-04 | J C C Eng Kk | Method and apparatus for winding electrolytic capacitor element |
| US5459092A (en) * | 1989-01-27 | 1995-10-17 | Matsushita Electric Industrial Co., Ltd. | Method for fabricating an active matrix addressed liquid crystal image device |
| US5213996A (en) * | 1990-07-04 | 1993-05-25 | Mitsubishi Denki Kabushiki Kaisha | Method and apparatus for forming interconnection pattern and semiconductor device having such interconnection pattern |
| US5418397A (en) * | 1990-07-04 | 1995-05-23 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device having an interconnection pattern |
| US10515457B2 (en) | 2016-09-20 | 2019-12-24 | Kabushiki Kaisha Toshiba | Image collation system and image collation method |
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