JPS5752141A - Manufacture of semiconductor element - Google Patents
Manufacture of semiconductor elementInfo
- Publication number
- JPS5752141A JPS5752141A JP12774680A JP12774680A JPS5752141A JP S5752141 A JPS5752141 A JP S5752141A JP 12774680 A JP12774680 A JP 12774680A JP 12774680 A JP12774680 A JP 12774680A JP S5752141 A JPS5752141 A JP S5752141A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- film
- back surface
- thin
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title abstract 4
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 abstract 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 4
- 229910052681 coesite Inorganic materials 0.000 abstract 2
- 229910052906 cristobalite Inorganic materials 0.000 abstract 2
- 229910052594 sapphire Inorganic materials 0.000 abstract 2
- 239000010980 sapphire Substances 0.000 abstract 2
- 239000000377 silicon dioxide Substances 0.000 abstract 2
- 235000012239 silicon dioxide Nutrition 0.000 abstract 2
- 229910052682 stishovite Inorganic materials 0.000 abstract 2
- 229910052905 tridymite Inorganic materials 0.000 abstract 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- 238000005229 chemical vapour deposition Methods 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 230000001681 protective effect Effects 0.000 abstract 1
- 239000012808 vapor phase Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Abstract
PURPOSE:To obtain the preferable characteristics of a semiconductor element by epitaxially growing a thin semiconductor film on an insulating substrate and forming a protective film, e.g., an SiO2 film on the back surface of the substrate before heat treating it, thereby preventing the intrusion of substrate forming elements to the thin semiconductor film from vapor phase. CONSTITUTION:After a thin Si film 2 is epitaxially grown on a sapphire insulating substrate 1, an SiO2 film 3 is formed by a CVD method in a thickness of 6,000Angstrom on the back surface of the substrate 1. Thereafter, it is heat treated. In this manner, the substrate forming element, e.g., aluminum or the like is prevented from being exhausted from the back surface of the sapphire substrate in the step of heat treatment.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12774680A JPS5752141A (en) | 1980-09-12 | 1980-09-12 | Manufacture of semiconductor element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12774680A JPS5752141A (en) | 1980-09-12 | 1980-09-12 | Manufacture of semiconductor element |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5752141A true JPS5752141A (en) | 1982-03-27 |
Family
ID=14967657
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12774680A Pending JPS5752141A (en) | 1980-09-12 | 1980-09-12 | Manufacture of semiconductor element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5752141A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58169462A (en) * | 1982-03-30 | 1983-10-05 | アイシン精機株式会社 | Artificial heart drive apparatus |
JPS6131346A (en) * | 1984-07-18 | 1986-02-13 | ハリマセラミック株式会社 | Nozzle for casting |
JPH03145718A (en) * | 1989-10-31 | 1991-06-20 | Matsushita Electric Ind Co Ltd | Vapor epitaxial growth method |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51145267A (en) * | 1975-06-09 | 1976-12-14 | Matsushita Electric Ind Co Ltd | Manufacture of semiconductor device |
-
1980
- 1980-09-12 JP JP12774680A patent/JPS5752141A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51145267A (en) * | 1975-06-09 | 1976-12-14 | Matsushita Electric Ind Co Ltd | Manufacture of semiconductor device |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58169462A (en) * | 1982-03-30 | 1983-10-05 | アイシン精機株式会社 | Artificial heart drive apparatus |
JPS6131346A (en) * | 1984-07-18 | 1986-02-13 | ハリマセラミック株式会社 | Nozzle for casting |
JPH03145718A (en) * | 1989-10-31 | 1991-06-20 | Matsushita Electric Ind Co Ltd | Vapor epitaxial growth method |
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