JPS577926A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS577926A JPS577926A JP8238780A JP8238780A JPS577926A JP S577926 A JPS577926 A JP S577926A JP 8238780 A JP8238780 A JP 8238780A JP 8238780 A JP8238780 A JP 8238780A JP S577926 A JPS577926 A JP S577926A
- Authority
- JP
- Japan
- Prior art keywords
- film
- semiconductor device
- amorphous
- substrate
- highly integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
- H01L21/02675—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using laser beams
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
- H01L21/02675—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using laser beams
- H01L21/02686—Pulsed laser beam
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02373—Group 14 semiconducting materials
- H01L21/02381—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02488—Insulating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02587—Structure
- H01L21/0259—Microstructure
- H01L21/02598—Microstructure monocrystalline
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
- H01L21/02691—Scanning of a beam
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Materials Engineering (AREA)
- Recrystallisation Techniques (AREA)
Abstract
PURPOSE:To form a highly integrated semiconductor device wherein many insulators and semiconductors are layered by forming polycrystal Si or amorphous Si on an insulating film formed on a substrate, and crystallizing said Si by laser annealing. CONSTITUTION:The surface of a polycrystal Si substrate 1 is thermally oxidized and an SiO2 film 2 is formed. Then, amorphous Si is deposited on the SiO2 film 2, and single crystal is obtained by applying laser annealing on a specified part. Thereafter, the amorphous part 1 is converted into an oxide film by thermal oxidization, and the most of the single-crystallized part is formed as a single crystal Si region 3'. In this method, the insulating films and the laser-annealed and single-crystallized semiconductor films are alternately layered, a semiconductor element is formed on said semiconductor film, and the highly integrated semiconductor device can be formed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8238780A JPS577926A (en) | 1980-06-18 | 1980-06-18 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8238780A JPS577926A (en) | 1980-06-18 | 1980-06-18 | Manufacture of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS577926A true JPS577926A (en) | 1982-01-16 |
Family
ID=13773164
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8238780A Pending JPS577926A (en) | 1980-06-18 | 1980-06-18 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS577926A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5011783A (en) * | 1981-12-28 | 1991-04-30 | Fujitsu Limited | Forming selective single crystal regions in insulated pockets formed on silicon by energy beams and devices formed in the pockets |
US5077233A (en) * | 1984-10-09 | 1991-12-31 | Fujitsu Limited | Method for recrystallizing specified portions of a non-crystalline semiconductor material to fabricate a semiconductor device therein |
-
1980
- 1980-06-18 JP JP8238780A patent/JPS577926A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5011783A (en) * | 1981-12-28 | 1991-04-30 | Fujitsu Limited | Forming selective single crystal regions in insulated pockets formed on silicon by energy beams and devices formed in the pockets |
US5077233A (en) * | 1984-10-09 | 1991-12-31 | Fujitsu Limited | Method for recrystallizing specified portions of a non-crystalline semiconductor material to fabricate a semiconductor device therein |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS56142630A (en) | Manufacture of semiconductor device | |
JPS55115341A (en) | Manufacture of semiconductor device | |
EP0068094B1 (en) | Process for forming a semiconductor device on a silicon ribbon and device thus formed | |
JPS57155726A (en) | Manufacture of semiconductor device | |
JPS6459866A (en) | Manufacture of mos transistor | |
JPS5688317A (en) | Manufacture of semiconductor device | |
JPS577926A (en) | Manufacture of semiconductor device | |
JPS575328A (en) | Growing method for semiconductor crystal | |
JPS57208124A (en) | Manufacture of semiconductor device | |
JPS57155764A (en) | Manufacture of semiconductor device | |
JPS5687339A (en) | Manufacture of semiconductor device | |
JPS56144530A (en) | Manufacture of semiconductor device | |
JPS56111239A (en) | Preparation of semiconductor device | |
JPS57102053A (en) | Semiconductor device | |
JPS6461952A (en) | Semiconductor device | |
JPS56146254A (en) | Manufacture of semiconductor device | |
JPS57145316A (en) | Manufacture of semicondcutor device | |
JPS57211737A (en) | Manufacture of semiconductor substrate | |
JPS5749224A (en) | Semiconductor device | |
JPS52124860A (en) | Electrode formation method for semiconductor devices | |
JPS56157019A (en) | Manufacture of substrate for semiconductor device | |
JPS5779642A (en) | Manufacture of semiconductor device | |
JPS57180117A (en) | Manufacture of semiconductor device | |
JPS5524459A (en) | Selective formation of silicon | |
JPS567482A (en) | Manufacturing of semiconductor device |