JPS6411316A - Formation of soi structure - Google Patents

Formation of soi structure

Info

Publication number
JPS6411316A
JPS6411316A JP16729287A JP16729287A JPS6411316A JP S6411316 A JPS6411316 A JP S6411316A JP 16729287 A JP16729287 A JP 16729287A JP 16729287 A JP16729287 A JP 16729287A JP S6411316 A JPS6411316 A JP S6411316A
Authority
JP
Japan
Prior art keywords
film
al2o3
mgo
layer
crystal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16729287A
Other languages
Japanese (ja)
Inventor
Keita Kawahara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP16729287A priority Critical patent/JPS6411316A/en
Publication of JPS6411316A publication Critical patent/JPS6411316A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To suppress leakage current upon the forming of a transistor element (MOSFET), by performing a high-temperature annealing process to form a high-resistance layer on an interface of a single-crystal Si film which is formed on an Al2O3 layer or a MgO/Al2O3 layer by epitaxial growth. CONSTITUTION:A single-crystalline Si film 3 of about 500nm in thickness is formed at 950 deg.C of growth temperature is formed on a MgO/Al2O3 film 2 by a vapor phase epitaxial growth method in which heat decomposition of a silane (SiH4) gas is performed. This substrate is provided with a lamp annealing process at 1200 deg.C or above and for about 10 seconds in a nitrogen atmosphere by lamp heating, so that a high-resistance layer 4 is formed on an interface between the MgO-Al2O3 film 2 and the single-crystal Si film 3.
JP16729287A 1987-07-03 1987-07-03 Formation of soi structure Pending JPS6411316A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16729287A JPS6411316A (en) 1987-07-03 1987-07-03 Formation of soi structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16729287A JPS6411316A (en) 1987-07-03 1987-07-03 Formation of soi structure

Publications (1)

Publication Number Publication Date
JPS6411316A true JPS6411316A (en) 1989-01-13

Family

ID=15847050

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16729287A Pending JPS6411316A (en) 1987-07-03 1987-07-03 Formation of soi structure

Country Status (1)

Country Link
JP (1) JPS6411316A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1037272A1 (en) * 1997-06-19 2000-09-20 Asahi Kasei Kogyo Kabushiki Kaisha Soi substrate and process for preparing the same, and semiconductor device and process for preparing the same
US6676748B1 (en) 1999-11-17 2004-01-13 Denso Corporation Method for manufacturing semiconductor substrate
JP2008045515A (en) * 2006-08-18 2008-02-28 Honda Motor Co Ltd Catalyst holding structure for exhaust system
DE112010001631T5 (en) 2009-04-15 2012-06-21 Toyota Jidosha Kabushiki Kaisha The fuel cell system
CN110785856A (en) * 2017-06-23 2020-02-11 信越化学工业株式会社 Method for manufacturing high-efficiency solar cell

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1037272A1 (en) * 1997-06-19 2000-09-20 Asahi Kasei Kogyo Kabushiki Kaisha Soi substrate and process for preparing the same, and semiconductor device and process for preparing the same
US6528387B1 (en) 1997-06-19 2003-03-04 Asahi Kasei Kabushiki Kaisha SOI substrate and process for preparing the same, and semiconductor device and process for preparing the same
EP1037272A4 (en) * 1997-06-19 2004-07-28 Asahi Chemical Ind Soi substrate and process for preparing the same, and semiconductor device and process for preparing the same
US6676748B1 (en) 1999-11-17 2004-01-13 Denso Corporation Method for manufacturing semiconductor substrate
JP2008045515A (en) * 2006-08-18 2008-02-28 Honda Motor Co Ltd Catalyst holding structure for exhaust system
DE112010001631T5 (en) 2009-04-15 2012-06-21 Toyota Jidosha Kabushiki Kaisha The fuel cell system
CN110785856A (en) * 2017-06-23 2020-02-11 信越化学工业株式会社 Method for manufacturing high-efficiency solar cell
CN110785856B (en) * 2017-06-23 2022-09-27 信越化学工业株式会社 Method for manufacturing high-efficiency solar cell

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