JPS5752052A - Heat treatment of photosensitive resin - Google Patents

Heat treatment of photosensitive resin

Info

Publication number
JPS5752052A
JPS5752052A JP12689980A JP12689980A JPS5752052A JP S5752052 A JPS5752052 A JP S5752052A JP 12689980 A JP12689980 A JP 12689980A JP 12689980 A JP12689980 A JP 12689980A JP S5752052 A JPS5752052 A JP S5752052A
Authority
JP
Japan
Prior art keywords
resin
wafer
irradiated
beams
photosensitive resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12689980A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0130138B2 (enrdf_load_stackoverflow
Inventor
Tsunehiro Naganami
Hiroshi Maruyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP12689980A priority Critical patent/JPS5752052A/ja
Publication of JPS5752052A publication Critical patent/JPS5752052A/ja
Publication of JPH0130138B2 publication Critical patent/JPH0130138B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
    • G03F7/2024—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure of the already developed image

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP12689980A 1980-09-12 1980-09-12 Heat treatment of photosensitive resin Granted JPS5752052A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12689980A JPS5752052A (en) 1980-09-12 1980-09-12 Heat treatment of photosensitive resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12689980A JPS5752052A (en) 1980-09-12 1980-09-12 Heat treatment of photosensitive resin

Publications (2)

Publication Number Publication Date
JPS5752052A true JPS5752052A (en) 1982-03-27
JPH0130138B2 JPH0130138B2 (enrdf_load_stackoverflow) 1989-06-16

Family

ID=14946628

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12689980A Granted JPS5752052A (en) 1980-09-12 1980-09-12 Heat treatment of photosensitive resin

Country Status (1)

Country Link
JP (1) JPS5752052A (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100272574A1 (en) * 2006-04-13 2010-10-28 General Electric Company Dual cure resin composite system and method of manufacturing the same
JP2015164194A (ja) * 2012-06-11 2015-09-10 ウルトラテック インク 滞留時間が非常に短いレーザアニールシステムおよび方法
US9558973B2 (en) 2012-06-11 2017-01-31 Ultratech, Inc. Laser annealing systems and methods with ultra-short dwell times
US10083843B2 (en) 2014-12-17 2018-09-25 Ultratech, Inc. Laser annealing systems and methods with ultra-short dwell times
JP2023082685A (ja) * 2021-12-02 2023-06-14 セメス株式会社 基板処理装置及び基板処理方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49124979A (enrdf_load_stackoverflow) * 1973-04-02 1974-11-29

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49124979A (enrdf_load_stackoverflow) * 1973-04-02 1974-11-29

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100272574A1 (en) * 2006-04-13 2010-10-28 General Electric Company Dual cure resin composite system and method of manufacturing the same
US9556315B2 (en) * 2006-04-13 2017-01-31 General Electric Company Dual cure resin composite system and method of manufacturing the same
JP2015164194A (ja) * 2012-06-11 2015-09-10 ウルトラテック インク 滞留時間が非常に短いレーザアニールシステムおよび方法
US9558973B2 (en) 2012-06-11 2017-01-31 Ultratech, Inc. Laser annealing systems and methods with ultra-short dwell times
US10083843B2 (en) 2014-12-17 2018-09-25 Ultratech, Inc. Laser annealing systems and methods with ultra-short dwell times
JP2023082685A (ja) * 2021-12-02 2023-06-14 セメス株式会社 基板処理装置及び基板処理方法

Also Published As

Publication number Publication date
JPH0130138B2 (enrdf_load_stackoverflow) 1989-06-16

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