JPS5752052A - Heat treatment of photosensitive resin - Google Patents
Heat treatment of photosensitive resinInfo
- Publication number
- JPS5752052A JPS5752052A JP12689980A JP12689980A JPS5752052A JP S5752052 A JPS5752052 A JP S5752052A JP 12689980 A JP12689980 A JP 12689980A JP 12689980 A JP12689980 A JP 12689980A JP S5752052 A JPS5752052 A JP S5752052A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- wafer
- irradiated
- beams
- photosensitive resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
- G03F7/2024—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure of the already developed image
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12689980A JPS5752052A (en) | 1980-09-12 | 1980-09-12 | Heat treatment of photosensitive resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12689980A JPS5752052A (en) | 1980-09-12 | 1980-09-12 | Heat treatment of photosensitive resin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5752052A true JPS5752052A (en) | 1982-03-27 |
| JPH0130138B2 JPH0130138B2 (cs) | 1989-06-16 |
Family
ID=14946628
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12689980A Granted JPS5752052A (en) | 1980-09-12 | 1980-09-12 | Heat treatment of photosensitive resin |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5752052A (cs) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100272574A1 (en) * | 2006-04-13 | 2010-10-28 | General Electric Company | Dual cure resin composite system and method of manufacturing the same |
| JP2015164194A (ja) * | 2012-06-11 | 2015-09-10 | ウルトラテック インク | 滞留時間が非常に短いレーザアニールシステムおよび方法 |
| US9558973B2 (en) | 2012-06-11 | 2017-01-31 | Ultratech, Inc. | Laser annealing systems and methods with ultra-short dwell times |
| US10083843B2 (en) | 2014-12-17 | 2018-09-25 | Ultratech, Inc. | Laser annealing systems and methods with ultra-short dwell times |
| JP2023082685A (ja) * | 2021-12-02 | 2023-06-14 | セメス株式会社 | 基板処理装置及び基板処理方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49124979A (cs) * | 1973-04-02 | 1974-11-29 |
-
1980
- 1980-09-12 JP JP12689980A patent/JPS5752052A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49124979A (cs) * | 1973-04-02 | 1974-11-29 |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100272574A1 (en) * | 2006-04-13 | 2010-10-28 | General Electric Company | Dual cure resin composite system and method of manufacturing the same |
| US9556315B2 (en) * | 2006-04-13 | 2017-01-31 | General Electric Company | Dual cure resin composite system and method of manufacturing the same |
| JP2015164194A (ja) * | 2012-06-11 | 2015-09-10 | ウルトラテック インク | 滞留時間が非常に短いレーザアニールシステムおよび方法 |
| US9558973B2 (en) | 2012-06-11 | 2017-01-31 | Ultratech, Inc. | Laser annealing systems and methods with ultra-short dwell times |
| US10083843B2 (en) | 2014-12-17 | 2018-09-25 | Ultratech, Inc. | Laser annealing systems and methods with ultra-short dwell times |
| JP2023082685A (ja) * | 2021-12-02 | 2023-06-14 | セメス株式会社 | 基板処理装置及び基板処理方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0130138B2 (cs) | 1989-06-16 |
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