JPS5750457A - Ic lead frame material - Google Patents

Ic lead frame material

Info

Publication number
JPS5750457A
JPS5750457A JP12683880A JP12683880A JPS5750457A JP S5750457 A JPS5750457 A JP S5750457A JP 12683880 A JP12683880 A JP 12683880A JP 12683880 A JP12683880 A JP 12683880A JP S5750457 A JPS5750457 A JP S5750457A
Authority
JP
Japan
Prior art keywords
lead frame
frame material
corrosion resistance
alloy
superior
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12683880A
Other languages
Japanese (ja)
Other versions
JPS6244691B2 (en
Inventor
Kazu Sasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Proterial Ltd
Original Assignee
Hitachi Metals Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Metals Ltd filed Critical Hitachi Metals Ltd
Priority to JP12683880A priority Critical patent/JPS5750457A/en
Publication of JPS5750457A publication Critical patent/JPS5750457A/en
Publication of JPS6244691B2 publication Critical patent/JPS6244691B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To form an inexpensive lead frame material having superior corrosion resistance without losing platability, by adding Mo to a Cr-Fe alloy with a predetermined weight ratio. CONSTITUTION:An alloy consisting of Cr 7-10%, Mo 0.6-2%, Ni 0.8-2.6% Cu 0.8-1.6% by weight, and Fe as residue and impurites is used as a lead frame material. In this method, an inexpensive lead frame having good plating and superior heat resistance strength and corrosion resistance can be formed.
JP12683880A 1980-09-12 1980-09-12 Ic lead frame material Granted JPS5750457A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12683880A JPS5750457A (en) 1980-09-12 1980-09-12 Ic lead frame material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12683880A JPS5750457A (en) 1980-09-12 1980-09-12 Ic lead frame material

Publications (2)

Publication Number Publication Date
JPS5750457A true JPS5750457A (en) 1982-03-24
JPS6244691B2 JPS6244691B2 (en) 1987-09-22

Family

ID=14945138

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12683880A Granted JPS5750457A (en) 1980-09-12 1980-09-12 Ic lead frame material

Country Status (1)

Country Link
JP (1) JPS5750457A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS599149A (en) * 1982-07-07 1984-01-18 Daido Steel Co Ltd Material for lead frame
JPS6174561A (en) * 1982-09-29 1986-04-16 ステイ−ヴン・ジエイ・フイツシユマン Coloring of fish meat
JPS61119653A (en) * 1984-11-15 1986-06-06 Hitachi Metals Ltd Material for lead frame for ic
JPS61239838A (en) * 1985-04-15 1986-10-25 I P M:Kk Liquid injection into meat
JPS6355968A (en) * 1986-08-26 1988-03-10 Mitsui Haitetsuku:Kk Lead frame

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5215265A (en) * 1975-07-24 1977-02-04 Telcon Metals Ltd Lead frame for semicoductors

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5215265A (en) * 1975-07-24 1977-02-04 Telcon Metals Ltd Lead frame for semicoductors

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS599149A (en) * 1982-07-07 1984-01-18 Daido Steel Co Ltd Material for lead frame
JPS6366377B2 (en) * 1982-07-07 1988-12-20 Daido Steel Co Ltd
JPS6174561A (en) * 1982-09-29 1986-04-16 ステイ−ヴン・ジエイ・フイツシユマン Coloring of fish meat
JPS61119653A (en) * 1984-11-15 1986-06-06 Hitachi Metals Ltd Material for lead frame for ic
JPS6215627B2 (en) * 1984-11-15 1987-04-08 Hitachi Metals Ltd
JPS61239838A (en) * 1985-04-15 1986-10-25 I P M:Kk Liquid injection into meat
JPH0139730B2 (en) * 1985-04-15 1989-08-23 Ai Pii Emu Kk
JPS6355968A (en) * 1986-08-26 1988-03-10 Mitsui Haitetsuku:Kk Lead frame

Also Published As

Publication number Publication date
JPS6244691B2 (en) 1987-09-22

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