JPS6366377B2 - - Google Patents
Info
- Publication number
- JPS6366377B2 JPS6366377B2 JP57118165A JP11816582A JPS6366377B2 JP S6366377 B2 JPS6366377 B2 JP S6366377B2 JP 57118165 A JP57118165 A JP 57118165A JP 11816582 A JP11816582 A JP 11816582A JP S6366377 B2 JPS6366377 B2 JP S6366377B2
- Authority
- JP
- Japan
- Prior art keywords
- weight
- less
- corrosion resistance
- lead frame
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
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- 239000000463 material Substances 0.000 claims description 23
- 229910052742 iron Inorganic materials 0.000 claims description 6
- 229910052758 niobium Inorganic materials 0.000 claims description 6
- 229910052715 tantalum Inorganic materials 0.000 claims description 6
- 229910052719 titanium Inorganic materials 0.000 claims description 6
- 229910052726 zirconium Inorganic materials 0.000 claims description 4
- 238000007747 plating Methods 0.000 description 20
- 230000007797 corrosion Effects 0.000 description 17
- 238000005260 corrosion Methods 0.000 description 17
- 229910045601 alloy Inorganic materials 0.000 description 13
- 239000000956 alloy Substances 0.000 description 13
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 10
- 239000010949 copper Substances 0.000 description 7
- 229910017060 Fe Cr Inorganic materials 0.000 description 5
- 229910002544 Fe-Cr Inorganic materials 0.000 description 5
- UPHIPHFJVNKLMR-UHFFFAOYSA-N chromium iron Chemical compound [Cr].[Fe] UPHIPHFJVNKLMR-UHFFFAOYSA-N 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- 229910052748 manganese Inorganic materials 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 229910000859 α-Fe Inorganic materials 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 229910019589 Cr—Fe Inorganic materials 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 229910001566 austenite Inorganic materials 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
- 150000001247 metal acetylides Chemical class 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910003271 Ni-Fe Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- VASIZKWUTCETSD-UHFFFAOYSA-N manganese(II) oxide Inorganic materials [Mn]=O VASIZKWUTCETSD-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910000734 martensite Inorganic materials 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000001603 reducing effect Effects 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Landscapes
- Die Bonding (AREA)
Description
本発明は安価にして耐食性およびめつき性に優
れた低Cr−Fe系合金からなるICリードフレーム
材料に関する。
近時のエレクトロニクス分野等の発展に伴い、
IC（集積回路）の需要が飛躍的に増大し、そのリ
ードフレーム材料の需要も増大し、安価なリード
フレーム材料の開発が当業界の待望するところに
なつている。
一般にこれらリードフレーム材は帯材となした
後、裁断、打抜き加工を施し、その表面にCu、
Ag、Au等がめつき等により被覆され、これにシ
リコンチツプをボンデイング（ダイボンデイン
グ）し結線（ワイヤボンデイング）することによ
りICとして使用されるものである。従つて、こ
れらリードフレーム材料はめつき性が良好である
ことを必要とし、さらにその端子部がIC基盤等
にはんだ付けされるために耐食性とともに良好な
はんだ付け性が要求される。
従来、リードフレーム材料は銅合金あるいは曲
型的には42％Ni−Fe合金で代表される熱膨脹制
御合金等で形成されていた。しかしながら、前述
したようにリードフレーム材料の需要の増大によ
る大量生産に伴い、従来材よりも少しでも安価な
材料を提供することは実用上極めて有益である。
安価な材料としては純鉄を用いればよいが、純
鉄は耐食性が劣るため実用に供し得ない。また通
常のFe−Cr系合金、例えばSUS430（17％Cr−
Fe、SUS410（13％Cr−Fe）等の実用鋼種は耐食
性は良好であるが、はんだ付け性およびめつき性
が著しく劣り、リードフレーム材料として使用す
ることは全く顧みられなかつた。
しかるところ、本発明者は純鉄およびFe−Cr
系合金の安価な点に着目し、純鉄における耐食性
を改善し、同時に従来のFe−Cr系合金のはんだ
付け性およびめつき性を改善するために種種検討
したところ、通常のFe−Cr系合金におけるより
も少量のCrを含有せしめ且つ酸化物形成元素の
Ｃ、Si、Mn、Alの上限値を規定することにより
ICリードフレーム材料としての諸特性が具備さ
れることを見い出し、本発明を完成したものであ
る。
すなわち、本発明によれば、Cr5.0〜10.5重量
％、C0.05重量％以下、Si0.50重量％以下、
Mn0.30重量％以下、Al0.05重量％以下を含有し、
残部が実質的にFeからなる材料、およびこれに
さらにNb、Ti、Ta、Znの１種または２種以上
を合計で0.6重量％以下および／またはNi3.0重量
％以下およびCu2.0重量％以下の１種または２種
を含有したリードフレーム材料が提供される。
以下に本発明をより詳細に説明する。
今、Fe−Cr系合金における耐食性およびめつ
き性をCr含量との関係で説明すると第１図およ
び第２図のようになる。第１図は温度49℃、湿度
98％で96時間の湿潤試験を行つた場合のCr含量
と単位面積当りの発錆個数との関係を示すもので
あり、この図よりCr含量が０〜４重量％までは
試料の全面に発錆が生ずるが、Cr含量が５重量
％以上になると発錆が急激に減少し、実用上十分
な耐食性を有することがわかる。また、第２図は
試料上に銅ストライクめつきを施した後、さらに
全面に銀めつきを施し、これを450℃に加熱した
ホツトプレート上にのせて大気中で５分間放置し
た場合のCr含量と単位面積当りのフクレ発生個
数との関係を示すものであり、この図からめつき
性はCr含量が少い程良好であり、Cr含量が10.5重
量％を越えると急激に劣化することがわかる。従
つて、耐食性およびめつき性の両特性を共に具備
せしめるためにはCr含量を5.0〜10.5重量％の範
囲とする。
また本発明は上述のような低Cr領域とすると
ともにＣ、Si、Mn、Alの上限値を規定する必要
がある。すなわちSi、Al、Mn等の酸素との親和
力の大きい元素（脱酸元素）を含有すると、
SiO2、Al2O3、MnO等の酸化物できやすく、特
に帯鋼まで加工する途中における焼鈍中や、加工
終了後の大気中放置等により極く表層に強固な酸
化膜が形成されることが多い。これらの酸化皮膜
はその後のめつき工程、はんだ付け工程におい
て、化学処理またははんだフラツクスの還元作用
によつても十分に除去されず、めつき性、はんだ
付け性を阻害させると考えられる。したがつて実
用上の上限をそれぞれSi：0.50重量％、Al：0.05
重量％、Mn：0.30重量％とする。
またＣは0.05重量％を越えて含有すると炭化物
等の形成が著しく、耐食性が劣化したりまたオー
ステナイト領域を増大させ、熱処理時のフエライ
トの安定性を阻害することになるためその上限は
0.05重量％とする。また多量のＣ添加はオーステ
ナイト域からの加熱後の冷却によつてマルテンサ
イト化し、ひずみ等発生の原因となり、超精密な
寸法精度を要求されるIC等のリードフレーム材
料として不適当になるためである。
本発明にあつては、上記基本合金の耐食性をよ
り向上させるためにNb0.6重量％以下、Ti0.6重
量％以下、Ta0.6重量％以下、Zn0.6重量％以下
の量で含有せしめてもよい。この場合Nb、Ti、
Ta、Zrの各元素は単独で含有せしめてもあるい
は２種以上を含有せしめてもよいがこれら元素の
合計量が0.6重量％を越えると金属間化合物、炭
化物等の第２相が多くなり耐食性が劣化するので
避けなければならない。
また、上記基本合金にNi3.0重量％以下および
Cu2.0重量％以下の１種または２種を含有させて
もよい。これによりめつき性がより向上する。す
なわち、めつき下地効果としてめつき膜とのなじ
みがよくなるためにめつき性が向上するものと思
われる。しかしNiが3.0重量％を越えると、フエ
ライト相が不安定化するほか高価となり本発明の
意図にそぐわなくなる。またCuが2.0重量％を越
えるとフエライト相を不安定化するとともに固溶
しきれずに粒界等に存在するCuが熱間加工性を
著しく阻害するので避けなければならない。
さらに本発明では基本合金にNb、Ti、Ta、
Zrの１種または２種以上とNiおよびCuの１種ま
たは２種とも上述した含量範囲において併有させ
てもよい。これによりNb、Ti、Ta、Zrを含有
させることによる耐食性の向上とともにNi、Cu
を含有させることによるめつき性の向上がともに
図れることになる。
なお、本発明の各合金に所望によりMoを0.2〜
4.0重量％含有させてもよい。これによりフエラ
イト相の安定化、耐食性の向上が期待できる。
以上のような本発明によれば、極めて低廉にし
てめつき性、耐食性、はんだ付け性等に優れた
ICリードフレーム材料が提供され、実用的に極
めて有用である。
以下に実施例を示す。
実施例
次表に示すような成分組成となるように各成分
を調整して各合金試料を調整した。溶製は大気中
にて行い、ガス成分の除去には十分注意を払つた
結果、Ｏ：20〜80ppm、Ｎ：60〜100ppmであつ
た。
各試料のうちNo.1〜No.4は本発明の実施例を、
またNo.5〜No.7は比較例を示す。これら各試料
を前述した耐食性試験およびめつき性試験に供し
た。また、はんだ付け性試験としてメニスコグラ
フ法による自動はんだ付け試験装置を使用し、下
記の条件にて試験し、はんだ槽への装入直後の試
片のうける最大浮力と、10秒後の浮力の差（％）
ではんだ付けを判定した（大きい程はんだ付け性
良）。
はんだ種類 60％Sn−40％Pb
温 度 220℃
非ハロゲンフラツクス使用
試験片 0.25t×10w（冷延素材のまま）
はんだへの浸漬深さ 2mm
これらの試験結果を次表に示す。
The present invention relates to an IC lead frame material made of a low Cr-Fe alloy that is inexpensive and has excellent corrosion resistance and plating properties. With the recent development of the electronics field,
The demand for ICs (integrated circuits) has increased dramatically, and so has the demand for lead frame materials, and the development of inexpensive lead frame materials has become a long-awaited goal in the industry. Generally, these lead frame materials are made into strips, then cut and punched, and the surface is coated with Cu.
It is coated with Ag, Au, etc. by plating, etc., and is used as an IC by bonding a silicon chip (die bonding) and connecting it (wire bonding). Therefore, these lead frame materials are required to have good fitting properties, and furthermore, since their terminal portions are soldered to an IC board or the like, they are required to have good corrosion resistance and good solderability. Conventionally, lead frame materials have been made of copper alloys or thermal expansion control alloys such as 42% Ni-Fe alloys. However, as described above, with the increasing demand for lead frame materials leading to mass production, it is extremely useful in practice to provide materials that are even slightly cheaper than conventional materials. Pure iron may be used as an inexpensive material, but pure iron has poor corrosion resistance and cannot be put to practical use. Ordinary Fe-Cr alloys, such as SUS430 (17% Cr-
Although practical steels such as Fe and SUS410 (13% Cr-Fe) have good corrosion resistance, their solderability and plating properties are extremely poor, and their use as lead frame materials has not been considered at all. However, the inventor has discovered that pure iron and Fe-Cr
Focusing on the low cost of Fe-Cr-based alloys, we investigated various types to improve the corrosion resistance of pure iron and at the same time improve the solderability and plating properties of conventional Fe-Cr-based alloys. By containing a smaller amount of Cr than in the alloy and specifying the upper limit values of oxide-forming elements C, Si, Mn, and Al.
The present invention was completed based on the discovery that the material has various characteristics suitable for an IC lead frame material. That is, according to the present invention, Cr5.0 to 10.5% by weight, C0.05% by weight or less, Si0.50% by weight or less,
Contains Mn 0.30% by weight or less, Al 0.05% by weight or less,
A material in which the balance is essentially Fe, and further contains one or more of Nb, Ti, Ta, and Zn in a total of 0.6% by weight or less and/or 3.0% by weight or less of Ni and 2.0% by weight of Cu. A lead frame material containing one or two of the following is provided. The present invention will be explained in more detail below. Now, the corrosion resistance and plating properties of Fe-Cr alloys are explained in relation to the Cr content as shown in FIGS. 1 and 2. Figure 1 shows a temperature of 49℃ and humidity.
This figure shows the relationship between the Cr content and the number of rusted particles per unit area when a 96-hour wet test was conducted at 98% humidity. From this figure, it can be seen that when the Cr content is 0 to 4% by weight, rust occurs on the entire surface of the sample. Rust occurs, but when the Cr content increases to 5% by weight or more, rusting rapidly decreases, indicating that the material has corrosion resistance sufficient for practical use. Figure 2 shows the results of Cr strike plating on the sample, then silver plating on the entire surface, placing it on a hot plate heated to 450°C and leaving it in the air for 5 minutes. This figure shows the relationship between the content and the number of blisters per unit area. From this figure, it can be seen that the lower the Cr content, the better the plating properties, and that it deteriorates rapidly when the Cr content exceeds 10.5% by weight. . Therefore, in order to provide both corrosion resistance and plating properties, the Cr content should be in the range of 5.0 to 10.5% by weight. Further, in the present invention, it is necessary to set the above-mentioned low Cr region and to define the upper limit values of C, Si, Mn, and Al. In other words, when containing elements (deoxidizing elements) such as Si, Al, and Mn that have a high affinity for oxygen,
Oxides such as SiO 2 , Al 2 O 3 , MnO, etc. are easily formed, and a strong oxide film is formed on the very surface layer, especially during annealing during processing to the steel strip, or when left in the atmosphere after processing. There are many. It is thought that these oxide films are not sufficiently removed during the subsequent plating and soldering processes even by chemical treatment or the reducing action of solder flux, and thus impede the plating and soldering properties. Therefore, the practical upper limits are Si: 0.50% by weight and Al: 0.05%.
Weight %, Mn: 0.30 weight %. Furthermore, if C exceeds 0.05% by weight, the formation of carbides will be significant, which will deteriorate corrosion resistance and increase the austenite region, inhibiting the stability of ferrite during heat treatment, so the upper limit is
The content shall be 0.05% by weight. In addition, adding a large amount of C converts the austenite region into martensite upon cooling after heating, causing distortion, making it unsuitable as a lead frame material for ICs etc. that require ultra-precise dimensional accuracy. be. In the present invention, in order to further improve the corrosion resistance of the basic alloy, Nb is contained in an amount of 0.6% by weight or less, Ti 0.6% by weight or less, Ta 0.6% by weight or less, and Zn 0.6% by weight or less. You can. In this case Nb, Ti,
Each element of Ta and Zr may be contained alone or in combination of two or more types, but if the total amount of these elements exceeds 0.6% by weight, second phases such as intermetallic compounds and carbides increase, resulting in poor corrosion resistance. should be avoided as it will cause deterioration. In addition, Ni3.0% by weight or less is added to the above basic alloy.
One or two types of Cu may be contained in an amount of 2.0% by weight or less. This further improves plating properties. In other words, it is thought that the plating properties are improved because the plating base effect improves the compatibility with the plating film. However, if Ni exceeds 3.0% by weight, the ferrite phase becomes unstable and becomes expensive, which does not meet the intent of the present invention. Further, if Cu exceeds 2.0% by weight, it must be avoided because it destabilizes the ferrite phase and Cu that is not completely dissolved and exists at grain boundaries etc. significantly impedes hot workability. Furthermore, in the present invention, the basic alloy includes Nb, Ti, Ta,
One or more types of Zr and one or more types of Ni and Cu may be used together within the above-mentioned content range. This improves corrosion resistance by containing Nb, Ti, Ta, and Zr, as well as improves Ni, Cu
By including this, it is possible to improve the plating properties. Additionally, if desired, Mo may be added to each alloy of the present invention from 0.2 to
It may be contained in an amount of 4.0% by weight. This can be expected to stabilize the ferrite phase and improve corrosion resistance. According to the present invention as described above, it is extremely inexpensive and has excellent plating properties, corrosion resistance, solderability, etc.
IC lead frame materials are provided and are of great practical utility. Examples are shown below. Examples Each alloy sample was prepared by adjusting each component so as to have the composition shown in the following table. The melting was carried out in the atmosphere, and sufficient care was taken to remove gas components, resulting in O: 20-80 ppm and N: 60-100 ppm. Of each sample, No. 1 to No. 4 are examples of the present invention.
Moreover, No. 5 to No. 7 show comparative examples. Each of these samples was subjected to the corrosion resistance test and plating test described above. In addition, as a solderability test, an automatic soldering test device using the meniscograph method was used, and the test was conducted under the following conditions. (%)
Soldering was determined by (the larger the value, the better the soldering performance). Solder type: 60%Sn-40%Pb Temperature: 220℃ Test piece using non-halogen flux: 0.25t x 10w (as cold-rolled material) Depth of immersion in solder: 2mm The results of these tests are shown in the table below.
【表】
上表より、本発明実施例のものは比較例のもの
に比べて耐食性、めつき性およびはんだ付け性が
ともに優れたものであることが明らかである。[Table] From the above table, it is clear that the samples of the examples of the present invention are superior in corrosion resistance, plating properties, and solderability compared to the samples of the comparative examples.
第１図は耐食性試験におけるCr含量と単位面
積当りの発錆個数との関係図である。第２図はめ
つき性試験におけるCr含量と単位面積当りのフ
クレ発生個数との関係図である。
FIG. 1 is a diagram showing the relationship between the Cr content and the number of rusted particles per unit area in a corrosion resistance test. FIG. 2 is a diagram showing the relationship between the Cr content and the number of blisters per unit area in the plating test.
Claims (1)
Si0.50重量％以下、Mn0.30重量％以下、Al0.05重
量％以下を含有し、残部が実質的にFeからなる
リードフレーム材料。 ２ Cr5.0〜10.5重量％、C0.05重量％以下、
Si0.50重量％以下、Mn0.30重量％以下、Al0.05重
量％以下を含有し、さらにNb、Ti、Ta、Zrの
１種または２種以上を合計で0.6重量％以下含有
し、残部が実質的にFeからなるリードフレーム
材料。 ３ Cr5.0〜10.5重量％、C0.05重量％以下、
Si0.50重量％以下、Mn0.30重量％以下、Al0.05重
量％以下を含有し、さらにNi3.0重量％以下およ
びCu2.0重量％以下の１種または２種を含有し、
残部が実質的にFeからなるリードフレーム材料。 ４ Cr5.0〜10.5重量％、C0.05重量％以下、
Si0.50重量％以下、Mn0.30重量％以下、Al0.05重
量％以下、Nb、Ti、Ta、Zrの１種または２種
以上を合計で0.6重量％以下を含有し、さらに
Ni3.0重量％以下およびCu2.0重量％以下の１種ま
たは２種を含有し、残部が実質的にFeからなる
リードフレーム材料。[Claims] 1 Cr5.0 to 10.5% by weight, C0.05% by weight or less,
A lead frame material containing 0.50% by weight or less of Si, 0.30% by weight or less of Mn, and 0.05% by weight of Al, with the balance essentially consisting of Fe. 2 Cr5.0-10.5% by weight, C0.05% by weight or less,
Contains 0.50% by weight or less of Si, 0.30% by weight or less of Mn, and 0.05% by weight of Al, and further contains 0.6% by weight or less of one or more of Nb, Ti, Ta, and Zr in total, and the remainder A lead frame material consisting essentially of Fe. 3 Cr5.0-10.5% by weight, C0.05% by weight or less,
Contains 0.50% by weight or less of Si, 0.30% by weight or less of Mn, 0.05% by weight or less of Al, and further contains one or both of 3.0% by weight or less of Ni and 2.0% by weight or less of Cu,
A lead frame material in which the remainder is essentially Fe. 4 Cr5.0-10.5% by weight, C0.05% by weight or less,
Contains 0.50 wt% or less of Si, 0.30 wt% or less of Mn, 0.05 wt% or less of Al, and 0.6 wt% or less of one or more of Nb, Ti, Ta, and Zr in total, and
A lead frame material containing one or both of 3.0% by weight or less of Ni and 2.0% by weight or less of Cu, with the remainder essentially consisting of Fe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11816582A JPS599149A (en) | 1982-07-07 | 1982-07-07 | Material for lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11816582A JPS599149A (en) | 1982-07-07 | 1982-07-07 | Material for lead frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS599149A JPS599149A (en) | 1984-01-18 |
| JPS6366377B2 true JPS6366377B2 (en) | 1988-12-20 |
Family
ID=14729713
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11816582A Granted JPS599149A (en) | 1982-07-07 | 1982-07-07 | Material for lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS599149A (en) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6026642A (en) * | 1983-07-22 | 1985-02-09 | Nippon Mining Co Ltd | Iron alloy for lead frame |
| JPS60102151A (en) * | 1983-11-09 | 1985-06-06 | Riken Vitamin Co Ltd | Novel emulsifier composition and method for improving quality of starch food |
| JPS60103158A (en) * | 1983-11-11 | 1985-06-07 | Hitachi Metals Ltd | Material for lead frame of ic |
| JPS61119656A (en) * | 1984-11-15 | 1986-06-06 | Hitachi Metals Ltd | Material for lead frame for ic |
| JPS61119653A (en) * | 1984-11-15 | 1986-06-06 | Hitachi Metals Ltd | Material for lead frame for ic |
| JPH07116555B2 (en) * | 1985-06-11 | 1995-12-13 | 大同特殊鋼株式会社 | Lead frame material and manufacturing method thereof |
| JPS6355968A (en) * | 1986-08-26 | 1988-03-10 | Mitsui Haitetsuku:Kk | Lead frame |
| JPS63109155A (en) * | 1986-10-28 | 1988-05-13 | Nippon Steel Corp | Cu coated steel sheet having superior corrosion resistance, solderability and adhesion |
| JPH0788529B2 (en) * | 1987-02-02 | 1995-09-27 | 日本鋼管株式会社 | Manufacturing method of ferritic stainless steel for lead frame |
| JPH0210761A (en) * | 1988-06-28 | 1990-01-16 | Mitsui High Tec Inc | Lead frame and its manufacture |
| JP2534954Y2 (en) * | 1991-05-22 | 1997-05-07 | 株式会社トーキン | Piezoelectric vibration gyro |
| JP2534958Y2 (en) * | 1991-06-21 | 1997-05-07 | 株式会社トーキン | Piezoelectric vibration gyro |
| JP2534964Y2 (en) * | 1991-09-30 | 1997-05-07 | 株式会社トーキン | Surface mount type vibration gyro |
| JPH0573518U (en) * | 1992-03-11 | 1993-10-08 | 株式会社トーキン | Piezoelectric vibration gyro |
| US5591392A (en) * | 1992-11-24 | 1997-01-07 | Nippon Steel Corporation | Steel plate having good corrosion resistance to condensed water |
| JP5598013B2 (en) * | 2010-02-19 | 2014-10-01 | 富士ゼロックス株式会社 | Image carrier for image forming apparatus, process cartridge, and image forming apparatus |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5215265A (en) * | 1975-07-24 | 1977-02-04 | Telcon Metals Ltd | Lead frame for semicoductors |
| JPS5230715A (en) * | 1975-09-05 | 1977-03-08 | Showa Denko Kk | High chromium ferritic stainless steel |
| JPS5479117A (en) * | 1977-12-07 | 1979-06-23 | Nisshin Steel Co Ltd | Production of ridginggfree single phase ferrite stainless steel |
| JPS5750457A (en) * | 1980-09-12 | 1982-03-24 | Hitachi Metals Ltd | Ic lead frame material |
-
1982
- 1982-07-07 JP JP11816582A patent/JPS599149A/en active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5215265A (en) * | 1975-07-24 | 1977-02-04 | Telcon Metals Ltd | Lead frame for semicoductors |
| JPS5230715A (en) * | 1975-09-05 | 1977-03-08 | Showa Denko Kk | High chromium ferritic stainless steel |
| JPS5479117A (en) * | 1977-12-07 | 1979-06-23 | Nisshin Steel Co Ltd | Production of ridginggfree single phase ferrite stainless steel |
| JPS5750457A (en) * | 1980-09-12 | 1982-03-24 | Hitachi Metals Ltd | Ic lead frame material |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS599149A (en) | 1984-01-18 |
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