JPS5750449A - Semiconductor device and manufacture therefor - Google Patents
Semiconductor device and manufacture thereforInfo
- Publication number
- JPS5750449A JPS5750449A JP12622380A JP12622380A JPS5750449A JP S5750449 A JPS5750449 A JP S5750449A JP 12622380 A JP12622380 A JP 12622380A JP 12622380 A JP12622380 A JP 12622380A JP S5750449 A JPS5750449 A JP S5750449A
- Authority
- JP
- Japan
- Prior art keywords
- smoothing
- wiring
- melting point
- drain
- semiconductor substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Weting (AREA)
- Local Oxidation Of Silicon (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
PURPOSE:To prevent the stepped disconnection of wiring and to maintain thermal treatment temperature for smoothing at a low temperature causing no influence on Al wiring and a diffusion region as well, by smoothing the level difference of the contact hole sections and the like of insulating layers in the wiring on a semiconductor substrate. CONSTITUTION:A field insulating film 3, a gate insulating film 4, and a polysilicon gate electrode 5 are formed on a semiconductor substrate 1 and in a MOS semiconductor device and the like having a source 6 and a drain 7 formed by using the films 3, 4, and electrodes 5 as masks for diffusion, a glass film composing lead oxide as a main component and having a low melting point of melting point 350-600 deg.C is formed on the surface of the device by a CVD method and the like, and contact holes are formed on the source and the drain after smoothing the surface of the device by heating flow and heating flow is again done and wiring 13 is formed by smoothing the end fringe sections of the contact holes. In multilayer interconnection, with the melting point decreased from the lower layer in order, the deformation of the insulating layer at the lower layer and stress can be prevented.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12622380A JPS5750449A (en) | 1980-09-11 | 1980-09-11 | Semiconductor device and manufacture therefor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12622380A JPS5750449A (en) | 1980-09-11 | 1980-09-11 | Semiconductor device and manufacture therefor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5750449A true JPS5750449A (en) | 1982-03-24 |
Family
ID=14929791
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12622380A Pending JPS5750449A (en) | 1980-09-11 | 1980-09-11 | Semiconductor device and manufacture therefor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5750449A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58190043A (en) * | 1982-04-30 | 1983-11-05 | Seiko Epson Corp | Multi-layer wiring |
JPS61154149A (en) * | 1984-12-27 | 1986-07-12 | Fujitsu Ltd | Semiconductor device and manufacture thereof |
JPS62281350A (en) * | 1986-05-29 | 1987-12-07 | Toshiba Corp | Semiconductor device and manufacture thereof |
JPH05267298A (en) * | 1992-03-17 | 1993-10-15 | Mitsubishi Electric Corp | Semiconductor device and manufacture thereof |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS506143U (en) * | 1973-05-11 | 1975-01-22 | ||
JPS506143A (en) * | 1973-05-21 | 1975-01-22 | ||
JPS5055279A (en) * | 1973-09-12 | 1975-05-15 | ||
JPS51134085A (en) * | 1975-05-15 | 1976-11-20 | Fujitsu Ltd | Method to manufacture the semiconductor unit |
JPS5313766A (en) * | 1976-07-23 | 1978-02-07 | Hitachi Ltd | Automatic continuous part sorting device |
JPS5429569A (en) * | 1977-08-09 | 1979-03-05 | Oki Electric Ind Co Ltd | Manufacture for mos type semiconductor device |
-
1980
- 1980-09-11 JP JP12622380A patent/JPS5750449A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS506143U (en) * | 1973-05-11 | 1975-01-22 | ||
JPS506143A (en) * | 1973-05-21 | 1975-01-22 | ||
JPS5055279A (en) * | 1973-09-12 | 1975-05-15 | ||
JPS51134085A (en) * | 1975-05-15 | 1976-11-20 | Fujitsu Ltd | Method to manufacture the semiconductor unit |
JPS5313766A (en) * | 1976-07-23 | 1978-02-07 | Hitachi Ltd | Automatic continuous part sorting device |
JPS5429569A (en) * | 1977-08-09 | 1979-03-05 | Oki Electric Ind Co Ltd | Manufacture for mos type semiconductor device |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58190043A (en) * | 1982-04-30 | 1983-11-05 | Seiko Epson Corp | Multi-layer wiring |
JPS61154149A (en) * | 1984-12-27 | 1986-07-12 | Fujitsu Ltd | Semiconductor device and manufacture thereof |
JPS62281350A (en) * | 1986-05-29 | 1987-12-07 | Toshiba Corp | Semiconductor device and manufacture thereof |
JPH05267298A (en) * | 1992-03-17 | 1993-10-15 | Mitsubishi Electric Corp | Semiconductor device and manufacture thereof |
US5930674A (en) * | 1992-03-17 | 1999-07-27 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device with improved planarization properties |
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