JPS5745262A - Sealing and fitting structure of semiconductor device - Google Patents

Sealing and fitting structure of semiconductor device

Info

Publication number
JPS5745262A
JPS5745262A JP11984380A JP11984380A JPS5745262A JP S5745262 A JPS5745262 A JP S5745262A JP 11984380 A JP11984380 A JP 11984380A JP 11984380 A JP11984380 A JP 11984380A JP S5745262 A JPS5745262 A JP S5745262A
Authority
JP
Japan
Prior art keywords
cap
sealing
ceramic
melting point
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11984380A
Other languages
English (en)
Japanese (ja)
Other versions
JPS634350B2 (enrdf_load_stackoverflow
Inventor
Toshio Hamano
Hidehiko Akasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP11984380A priority Critical patent/JPS5745262A/ja
Publication of JPS5745262A publication Critical patent/JPS5745262A/ja
Publication of JPS634350B2 publication Critical patent/JPS634350B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP11984380A 1980-09-01 1980-09-01 Sealing and fitting structure of semiconductor device Granted JPS5745262A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11984380A JPS5745262A (en) 1980-09-01 1980-09-01 Sealing and fitting structure of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11984380A JPS5745262A (en) 1980-09-01 1980-09-01 Sealing and fitting structure of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5745262A true JPS5745262A (en) 1982-03-15
JPS634350B2 JPS634350B2 (enrdf_load_stackoverflow) 1988-01-28

Family

ID=14771630

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11984380A Granted JPS5745262A (en) 1980-09-01 1980-09-01 Sealing and fitting structure of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5745262A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6027433U (ja) * 1983-07-29 1985-02-25 松下電工株式会社 電子部品の実装構造
EP0098176A3 (en) * 1982-06-30 1985-09-25 Fujitsu Limited The packaging of semiconductor chips
US6630727B1 (en) * 1998-03-03 2003-10-07 Infineon Technologies Ag Modularly expandable multi-layered semiconductor component

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53130974U (enrdf_load_stackoverflow) * 1977-03-23 1978-10-17
JPS5559746A (en) * 1978-10-27 1980-05-06 Hitachi Ltd Semiconductor device and its mounting circuit device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53130974U (enrdf_load_stackoverflow) * 1977-03-23 1978-10-17
JPS5559746A (en) * 1978-10-27 1980-05-06 Hitachi Ltd Semiconductor device and its mounting circuit device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0098176A3 (en) * 1982-06-30 1985-09-25 Fujitsu Limited The packaging of semiconductor chips
JPS6027433U (ja) * 1983-07-29 1985-02-25 松下電工株式会社 電子部品の実装構造
US6630727B1 (en) * 1998-03-03 2003-10-07 Infineon Technologies Ag Modularly expandable multi-layered semiconductor component

Also Published As

Publication number Publication date
JPS634350B2 (enrdf_load_stackoverflow) 1988-01-28

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