JPS5743455A - Complementary type semiconductor device - Google Patents
Complementary type semiconductor deviceInfo
- Publication number
- JPS5743455A JPS5743455A JP55119212A JP11921280A JPS5743455A JP S5743455 A JPS5743455 A JP S5743455A JP 55119212 A JP55119212 A JP 55119212A JP 11921280 A JP11921280 A JP 11921280A JP S5743455 A JPS5743455 A JP S5743455A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- single crystal
- insulator
- obtaining
- active element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title abstract 5
- 230000000295 complement effect Effects 0.000 title abstract 3
- 239000013078 crystal Substances 0.000 abstract 2
- 239000012212 insulator Substances 0.000 abstract 2
- 238000000034 method Methods 0.000 abstract 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 abstract 2
- 230000010354 integration Effects 0.000 abstract 1
- 238000005468 ion implantation Methods 0.000 abstract 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
- H01L27/085—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
- H01L27/088—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
- H01L27/092—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate complementary MIS field-effect transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8221—Three dimensional integrated circuits stacked in different levels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/0688—Integrated circuits having a three-dimensional layout
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Bipolar Transistors (AREA)
- Bipolar Integrated Circuits (AREA)
Abstract
PURPOSE:To obtain a complementary semiconductor device having high integration by forming a one conductive type active element in a single crystal semiconductor layer on an insulator and forming a reverse conductive type active element in a single crystal semiconductor layer formed via an insulator thereon. CONSTITUTION:A p type polycrystalline silicon layer 2 is formed by a chemical gas growing method on an insulating substrate 1, and is converted into a single crystal silicon layer by emitting a laser beam. Then, a gate insulating film and a polycrystalline silicon gate electrode 3 are formed, and an n<+> type source region 4 and an n<+> type drain region 5 are formed by an ion implantation method, thereby obtaining an n-channel FET. An insulating film 6 having a window 6A is formed thereon, and a p-channel FET is similarly formed on the film 6. Then, the regions 5, 10 of both FETs are connected at a connecting point 12, thereby obtaining a complementary semiconductor device.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55119212A JPS5743455A (en) | 1980-08-29 | 1980-08-29 | Complementary type semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55119212A JPS5743455A (en) | 1980-08-29 | 1980-08-29 | Complementary type semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5743455A true JPS5743455A (en) | 1982-03-11 |
Family
ID=14755708
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP55119212A Pending JPS5743455A (en) | 1980-08-29 | 1980-08-29 | Complementary type semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5743455A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5833869A (en) * | 1981-08-25 | 1983-02-28 | Toshiba Corp | Semiconductor device |
JPS5996761A (en) * | 1982-11-25 | 1984-06-04 | Mitsubishi Electric Corp | Multi-stage semiconductor device |
JPS60147153A (en) * | 1984-01-12 | 1985-08-03 | Agency Of Ind Science & Technol | Manufacture of semiconductor device |
US4698659A (en) * | 1982-05-31 | 1987-10-06 | Tokyo Shibaura Denki Kabushiki Kaisha | Stacked complementary metal oxide semiconductor inverter |
US4754314A (en) * | 1984-01-24 | 1988-06-28 | Texas Instruments Incorporated | Split-level CMOS |
US4777147A (en) * | 1987-01-28 | 1988-10-11 | Texas Instruments Incorporated | Forming a split-level CMOS device |
US5194749A (en) * | 1987-11-30 | 1993-03-16 | Hitachi, Ltd. | Semiconductor integrated circuit device |
-
1980
- 1980-08-29 JP JP55119212A patent/JPS5743455A/en active Pending
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5833869A (en) * | 1981-08-25 | 1983-02-28 | Toshiba Corp | Semiconductor device |
US4698659A (en) * | 1982-05-31 | 1987-10-06 | Tokyo Shibaura Denki Kabushiki Kaisha | Stacked complementary metal oxide semiconductor inverter |
JPS5996761A (en) * | 1982-11-25 | 1984-06-04 | Mitsubishi Electric Corp | Multi-stage semiconductor device |
JPS60147153A (en) * | 1984-01-12 | 1985-08-03 | Agency Of Ind Science & Technol | Manufacture of semiconductor device |
US4754314A (en) * | 1984-01-24 | 1988-06-28 | Texas Instruments Incorporated | Split-level CMOS |
US4777147A (en) * | 1987-01-28 | 1988-10-11 | Texas Instruments Incorporated | Forming a split-level CMOS device |
US5194749A (en) * | 1987-11-30 | 1993-03-16 | Hitachi, Ltd. | Semiconductor integrated circuit device |
US5483083A (en) * | 1987-11-30 | 1996-01-09 | Hitachi, Ltd. | Semiconductor integrated circuit device |
US5619055A (en) * | 1987-11-30 | 1997-04-08 | Hitachi, Ltd. | Semiconductor integrated circuit device |
US5700705A (en) * | 1987-11-30 | 1997-12-23 | Hitachi, Ltd. | Semiconductor integrated circuit device |
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