JPS5739564A - Semiconductor integrated circuit device - Google Patents
Semiconductor integrated circuit deviceInfo
- Publication number
- JPS5739564A JPS5739564A JP55115025A JP11502580A JPS5739564A JP S5739564 A JPS5739564 A JP S5739564A JP 55115025 A JP55115025 A JP 55115025A JP 11502580 A JP11502580 A JP 11502580A JP S5739564 A JPS5739564 A JP S5739564A
- Authority
- JP
- Japan
- Prior art keywords
- silicon
- film
- region
- oxidized
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 6
- 229910052710 silicon Inorganic materials 0.000 abstract 6
- 239000010703 silicon Substances 0.000 abstract 6
- 239000000758 substrate Substances 0.000 abstract 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- 150000002500 ions Chemical class 0.000 abstract 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/0688—Integrated circuits having a three-dimensional layout
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Semiconductor Integrated Circuits (AREA)
Abstract
PURPOSE:To highly integrate an integrated circuit by arraying a load resistance region in a longitudinal direction vertical to the plane of a substrate. CONSTITUTION:A field region 13 made of a relatively thick oxidized silicon film or the like is formed on a silicon substrate 10, and an MOS transistor having a source diffused region 11, a drain diffused region 12, a gate insulated film 14 and a gate 15 is formed on the element forming region surrounded by the field. A silicon oxidized film 17 is formed on a polycrystalline silicon wiring layer. Ions of element, e.g., Cr, Si, Ar, C or the like are injected on a dielectric unit of thin silicon oxidized film, silicon nitrided film, etc. having 100Angstrom or less thick, or dielectric film of silicon oxidized film or the like to form a layer forming a load resistance region 16, which is in turn formed on a source region through a contacting hole. Thereafter, an aluminum wiring layer 18 is formed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55115025A JPS5739564A (en) | 1980-08-21 | 1980-08-21 | Semiconductor integrated circuit device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55115025A JPS5739564A (en) | 1980-08-21 | 1980-08-21 | Semiconductor integrated circuit device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5739564A true JPS5739564A (en) | 1982-03-04 |
Family
ID=14652356
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP55115025A Pending JPS5739564A (en) | 1980-08-21 | 1980-08-21 | Semiconductor integrated circuit device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5739564A (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4318334Y1 (en) * | 1964-11-16 | 1968-07-30 | ||
JPS49112326A (en) * | 1973-02-16 | 1974-10-25 |
-
1980
- 1980-08-21 JP JP55115025A patent/JPS5739564A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4318334Y1 (en) * | 1964-11-16 | 1968-07-30 | ||
JPS49112326A (en) * | 1973-02-16 | 1974-10-25 |
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