JPS5735362A - Structure of circuit substrate - Google Patents
Structure of circuit substrateInfo
- Publication number
- JPS5735362A JPS5735362A JP11074980A JP11074980A JPS5735362A JP S5735362 A JPS5735362 A JP S5735362A JP 11074980 A JP11074980 A JP 11074980A JP 11074980 A JP11074980 A JP 11074980A JP S5735362 A JPS5735362 A JP S5735362A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- circuit substrate
- grounding electrode
- long device
- reinforcing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W42/60—
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11074980A JPS5735362A (en) | 1980-08-12 | 1980-08-12 | Structure of circuit substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11074980A JPS5735362A (en) | 1980-08-12 | 1980-08-12 | Structure of circuit substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5735362A true JPS5735362A (en) | 1982-02-25 |
| JPS6249984B2 JPS6249984B2 (OSRAM) | 1987-10-22 |
Family
ID=14543569
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11074980A Granted JPS5735362A (en) | 1980-08-12 | 1980-08-12 | Structure of circuit substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5735362A (OSRAM) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS599187A (ja) * | 1982-07-01 | 1984-01-18 | ナシヨナル・セミコンダクタ−・コ−ポレ−シヨン | メツキ装置 |
| JPS6359593A (ja) * | 1986-08-30 | 1988-03-15 | 株式会社東芝 | 携帯可能媒体における実装方法 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0263686U (OSRAM) * | 1988-11-01 | 1990-05-14 |
-
1980
- 1980-08-12 JP JP11074980A patent/JPS5735362A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS599187A (ja) * | 1982-07-01 | 1984-01-18 | ナシヨナル・セミコンダクタ−・コ−ポレ−シヨン | メツキ装置 |
| JPS6359593A (ja) * | 1986-08-30 | 1988-03-15 | 株式会社東芝 | 携帯可能媒体における実装方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6249984B2 (OSRAM) | 1987-10-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| AU524769B2 (en) | Mounting chip type circuit elements on a printed circuit board | |
| EP0299252A3 (en) | Integrated circuit lead frame assembly containing voltage bussing and distribution to an integrated circuit die using tape automated bonding with two metal layers | |
| EP1030365A4 (en) | SUBSTRATE OF A HOUSING | |
| JPS6428930A (en) | Semiconductor device | |
| JPS55111151A (en) | Integrated circuit device | |
| DE3177208D1 (de) | Integrierter monolithischer mikrowellenschaltkreis mit integraler antennenanordnung. | |
| EP0039160A3 (en) | Methods for bonding conductive bumps to electronic circuitry | |
| EP1041618A4 (en) | SEMICONDUCTOR ARRANGEMENT AND METHOD FOR THE PRODUCTION THEREOF, CIRCUIT BOARD AND ELECTRONIC SYSTEM | |
| JPS5735362A (en) | Structure of circuit substrate | |
| DE3681193D1 (de) | Auf einem verbundhalbleitersubstrat gebildete logische integrierte schaltungsvorrichtung. | |
| JPS5618448A (en) | Composite electronic part | |
| JPS575356A (en) | Hybrid integrated circuit device | |
| JPS57192058A (en) | Semiconductor device | |
| JPS5546561A (en) | Method of fabricating hybrid integrated circuit | |
| JPS57166061A (en) | Semiconductor device | |
| JPS5795640A (en) | Mounting structure of semiconductor | |
| JPS556852A (en) | Semiconductor device | |
| JPS5791549A (en) | Circuit substrate structure | |
| US4857375A (en) | Shielding of semiconductor module | |
| JPS56144549A (en) | Electronic device | |
| JPS57147262A (en) | Manufacture of semiconductor device | |
| JPS6469092A (en) | Surface mount type electronic parts | |
| JPS5552231A (en) | Semiconductor attaching device | |
| JPS5587461A (en) | Microwave integrated circuit package | |
| JPS6239033A (ja) | 半導体チツプキヤリアの製造方法 |