JPS5735333A - Inspection equipment of semiconductor wafer - Google Patents

Inspection equipment of semiconductor wafer

Info

Publication number
JPS5735333A
JPS5735333A JP11060780A JP11060780A JPS5735333A JP S5735333 A JPS5735333 A JP S5735333A JP 11060780 A JP11060780 A JP 11060780A JP 11060780 A JP11060780 A JP 11060780A JP S5735333 A JPS5735333 A JP S5735333A
Authority
JP
Japan
Prior art keywords
laser beam
mark
chip
wafer
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11060780A
Other languages
English (en)
Japanese (ja)
Other versions
JPS621247B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Kimio Meguro
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP11060780A priority Critical patent/JPS5735333A/ja
Publication of JPS5735333A publication Critical patent/JPS5735333A/ja
Publication of JPS621247B2 publication Critical patent/JPS621247B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP11060780A 1980-08-12 1980-08-12 Inspection equipment of semiconductor wafer Granted JPS5735333A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11060780A JPS5735333A (en) 1980-08-12 1980-08-12 Inspection equipment of semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11060780A JPS5735333A (en) 1980-08-12 1980-08-12 Inspection equipment of semiconductor wafer

Publications (2)

Publication Number Publication Date
JPS5735333A true JPS5735333A (en) 1982-02-25
JPS621247B2 JPS621247B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1987-01-12

Family

ID=14540116

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11060780A Granted JPS5735333A (en) 1980-08-12 1980-08-12 Inspection equipment of semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS5735333A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0248485A (ja) * 1988-08-09 1990-02-19 Mitsutoyo Corp セラミックスのマーキング方法
JPH04287338A (ja) * 1991-03-15 1992-10-12 Nec Yamagata Ltd 半導体ウェーハプロービング装置
JPH04288846A (ja) * 1991-03-18 1992-10-13 Nec Yamagata Ltd 半導体ウェーハプロービング装置
JPH08330367A (ja) * 1995-05-31 1996-12-13 Nec Yamagata Ltd 半導体ウェハのマーキング装置及びそのマーキング方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06250768A (ja) * 1993-02-23 1994-09-09 Nec Corp キーボード装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0248485A (ja) * 1988-08-09 1990-02-19 Mitsutoyo Corp セラミックスのマーキング方法
JPH04287338A (ja) * 1991-03-15 1992-10-12 Nec Yamagata Ltd 半導体ウェーハプロービング装置
JPH04288846A (ja) * 1991-03-18 1992-10-13 Nec Yamagata Ltd 半導体ウェーハプロービング装置
JPH08330367A (ja) * 1995-05-31 1996-12-13 Nec Yamagata Ltd 半導体ウェハのマーキング装置及びそのマーキング方法

Also Published As

Publication number Publication date
JPS621247B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1987-01-12

Similar Documents

Publication Publication Date Title
JPS5719726A (en) Positioning device
JPS5735333A (en) Inspection equipment of semiconductor wafer
DE3671131D1 (de) Ionenstrahlgeraet und verfahren zur ausfuehrung von aenderungen, insbesondere reparaturen an substraten unter verwendung eines ionenstrahlgeraetes.
JPS53114347A (en) Working method for semiconductor device
JPS5757245A (en) Inspecting method and device for appearance of semiconductor wafer
JPS5534430A (en) Positioning method in electron beam exposure
ES8305534A1 (es) Procedimiento de pasivacion de dispositivos semiconductores.
JPS5587004A (en) Surface-property measuring method
JPS55151351A (en) Cutting method of semiconductor chip
JPS5215359A (en) Method and equipment to insepct surface condition of objects
JPS55111135A (en) Semiconductor device and its manufacturing method
JPS5214477A (en) Method to detect a defect in a transparent test object
JPS57102038A (en) Marking device and marking method of semiconductor wafer
JPS5752052A (en) Heat treatment of photosensitive resin
JPS51126192A (en) An inspection apparatus to inspect inside surface of a test piese
JPS5431282A (en) Pattern formation method
JPS538061A (en) Automatic positioning apparatus of articles
JPS5726703A (en) Measuring instrument for size of sectional shape of steel shapes
JPS5690269A (en) Measuring method for semiconductor integrated circuit
JPS542669A (en) Monitoring method for pattern formed on semiconductor wafer
JPS57175201A (en) Length measuring original device and blank for said device
JPS57183033A (en) Method for wafer exposure and device thereof
JPS5587148A (en) Correction method for light shielding mask
JPS57136326A (en) Correcting method for defective mask
JPS5291379A (en) Identification method for defective chip