JPS5732658A - Resin sealing type semiconductor device with radiator plate - Google Patents

Resin sealing type semiconductor device with radiator plate

Info

Publication number
JPS5732658A
JPS5732658A JP10729380A JP10729380A JPS5732658A JP S5732658 A JPS5732658 A JP S5732658A JP 10729380 A JP10729380 A JP 10729380A JP 10729380 A JP10729380 A JP 10729380A JP S5732658 A JPS5732658 A JP S5732658A
Authority
JP
Japan
Prior art keywords
radiator plate
semiconductor device
type semiconductor
resin sealing
out leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10729380A
Other languages
English (en)
Other versions
JPS6127909B2 (ja
Inventor
Hidetaka Ikuma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP10729380A priority Critical patent/JPS5732658A/ja
Publication of JPS5732658A publication Critical patent/JPS5732658A/ja
Publication of JPS6127909B2 publication Critical patent/JPS6127909B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP10729380A 1980-08-05 1980-08-05 Resin sealing type semiconductor device with radiator plate Granted JPS5732658A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10729380A JPS5732658A (en) 1980-08-05 1980-08-05 Resin sealing type semiconductor device with radiator plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10729380A JPS5732658A (en) 1980-08-05 1980-08-05 Resin sealing type semiconductor device with radiator plate

Publications (2)

Publication Number Publication Date
JPS5732658A true JPS5732658A (en) 1982-02-22
JPS6127909B2 JPS6127909B2 (ja) 1986-06-27

Family

ID=14455423

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10729380A Granted JPS5732658A (en) 1980-08-05 1980-08-05 Resin sealing type semiconductor device with radiator plate

Country Status (1)

Country Link
JP (1) JPS5732658A (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59112951U (ja) * 1983-01-20 1984-07-30 サンケン電気株式会社 絶縁物封止半導体装置
JPS59157752U (ja) * 1983-04-08 1984-10-23 外山鋳造株式会社 鋳造用消失性模型を成形する装置
JPS63160825A (ja) * 1986-12-25 1988-07-04 Yoshihiko Seki 合成樹脂発泡成形体の製造方法
CN103646940A (zh) * 2013-12-12 2014-03-19 南通华隆微电子有限公司 一种to-220防水密封引线框架

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59112951U (ja) * 1983-01-20 1984-07-30 サンケン電気株式会社 絶縁物封止半導体装置
JPS6336689Y2 (ja) * 1983-01-20 1988-09-28
JPS59157752U (ja) * 1983-04-08 1984-10-23 外山鋳造株式会社 鋳造用消失性模型を成形する装置
JPS63160825A (ja) * 1986-12-25 1988-07-04 Yoshihiko Seki 合成樹脂発泡成形体の製造方法
JPH0588175B2 (ja) * 1986-12-25 1993-12-21 Yoshihiko Seki
CN103646940A (zh) * 2013-12-12 2014-03-19 南通华隆微电子有限公司 一种to-220防水密封引线框架

Also Published As

Publication number Publication date
JPS6127909B2 (ja) 1986-06-27

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