JPS572560A - High voltage semiconductor device - Google Patents

High voltage semiconductor device

Info

Publication number
JPS572560A
JPS572560A JP7563380A JP7563380A JPS572560A JP S572560 A JPS572560 A JP S572560A JP 7563380 A JP7563380 A JP 7563380A JP 7563380 A JP7563380 A JP 7563380A JP S572560 A JPS572560 A JP S572560A
Authority
JP
Japan
Prior art keywords
semiconductor device
groups
high voltage
voltage semiconductor
rectifying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7563380A
Other languages
Japanese (ja)
Inventor
Toshiyuki Hidaka
Kenzo Shima
Takeshi Ishizuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP7563380A priority Critical patent/JPS572560A/en
Publication of JPS572560A publication Critical patent/JPS572560A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/074—Stacked arrangements of non-apertured devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To obtain a semiconductor device having arbitrary bidirectional avalanche characteristics by so connecting two sets of a plurality of p-n junction semiconductor pellets that the rectifying direction become reverse. CONSTITUTION:Two groups 1a, 1b of silicon pellets 1 having p-n junctions and laminated and bonded simultaneously in the same rectifying direction are prepared, and are bonded in such a manner that the rectifying directions of the groups 1a, 1b are reverse. Thus, arbitrary avalanche characteristic can be obtaind bidirectionally with the number of the groups.
JP7563380A 1980-06-06 1980-06-06 High voltage semiconductor device Pending JPS572560A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7563380A JPS572560A (en) 1980-06-06 1980-06-06 High voltage semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7563380A JPS572560A (en) 1980-06-06 1980-06-06 High voltage semiconductor device

Publications (1)

Publication Number Publication Date
JPS572560A true JPS572560A (en) 1982-01-07

Family

ID=13581842

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7563380A Pending JPS572560A (en) 1980-06-06 1980-06-06 High voltage semiconductor device

Country Status (1)

Country Link
JP (1) JPS572560A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6428099A (en) * 1987-07-23 1989-01-30 Nec Corp Artificial satellite separation system
JPH0666409B2 (en) * 1986-05-02 1994-08-24 アンプ インコーポレーテッド Surface mountable diode
JP2017208988A (en) * 2016-05-20 2017-11-24 新電元工業株式会社 Switching power supply device and clamp type semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0666409B2 (en) * 1986-05-02 1994-08-24 アンプ インコーポレーテッド Surface mountable diode
JPS6428099A (en) * 1987-07-23 1989-01-30 Nec Corp Artificial satellite separation system
JP2017208988A (en) * 2016-05-20 2017-11-24 新電元工業株式会社 Switching power supply device and clamp type semiconductor device

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