JPS5724538A - Preparation of semiconductor device - Google Patents

Preparation of semiconductor device

Info

Publication number
JPS5724538A
JPS5724538A JP9923580A JP9923580A JPS5724538A JP S5724538 A JPS5724538 A JP S5724538A JP 9923580 A JP9923580 A JP 9923580A JP 9923580 A JP9923580 A JP 9923580A JP S5724538 A JPS5724538 A JP S5724538A
Authority
JP
Japan
Prior art keywords
wafer
photomask
exposed
mask pattern
rays
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9923580A
Other languages
Japanese (ja)
Inventor
Hiroshi Kuroda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP9923580A priority Critical patent/JPS5724538A/en
Publication of JPS5724538A publication Critical patent/JPS5724538A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes

Abstract

PURPOSE:To prevent a defect in a mask pattern without permitting a photosensitive resin to remain on the outside edge of a wafer with a certain width by a method wherein the wafer coated with a positive type photosensitive resin and a photomask on which a mask pattern region smaller than the wafer has been formed are placed one above another and exposed to rays. CONSTITUTION:The surfaces of a wafer 31 is coated with a positive type photoresist 32. A mask pattern region 35 smaller than the main surface of the wafer 31 but similar to the figure of the latter is formed on a photomask 33. The photomask 33 and the wafer 31 are set against each other, before being exposed to ultraviolet rays 34. The outside edge of the wafer 31 in several mm. width is exposed to the rays through a transparent member 36 of the photomask 33. By so doing, when the wafer 31 is put into grooves 42 of a cassete 41, the photoresist 32 on the wafer does not make contact with the cassette, thus preventing the occcurrence of defects in the pattern such as cracks and exfoliation.
JP9923580A 1980-07-18 1980-07-18 Preparation of semiconductor device Pending JPS5724538A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9923580A JPS5724538A (en) 1980-07-18 1980-07-18 Preparation of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9923580A JPS5724538A (en) 1980-07-18 1980-07-18 Preparation of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5724538A true JPS5724538A (en) 1982-02-09

Family

ID=14242012

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9923580A Pending JPS5724538A (en) 1980-07-18 1980-07-18 Preparation of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5724538A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6060724A (en) * 1983-09-14 1985-04-08 Toshiba Corp Semiconductor exposing device
JPH0232526A (en) * 1988-07-22 1990-02-02 Mitsubishi Electric Corp Substrate periphery exposure device
JPH04121728U (en) * 1991-04-19 1992-10-30 太陽誘電株式会社 Semiconductor device manufacturing equipment
JPH0794450A (en) * 1993-06-29 1995-04-07 Japan Storage Battery Co Ltd Local ashing device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6060724A (en) * 1983-09-14 1985-04-08 Toshiba Corp Semiconductor exposing device
JPH0232526A (en) * 1988-07-22 1990-02-02 Mitsubishi Electric Corp Substrate periphery exposure device
JPH04121728U (en) * 1991-04-19 1992-10-30 太陽誘電株式会社 Semiconductor device manufacturing equipment
JPH0794450A (en) * 1993-06-29 1995-04-07 Japan Storage Battery Co Ltd Local ashing device

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