JPS57192027A - Forming method of photosensitive resin window - Google Patents

Forming method of photosensitive resin window

Info

Publication number
JPS57192027A
JPS57192027A JP7720081A JP7720081A JPS57192027A JP S57192027 A JPS57192027 A JP S57192027A JP 7720081 A JP7720081 A JP 7720081A JP 7720081 A JP7720081 A JP 7720081A JP S57192027 A JPS57192027 A JP S57192027A
Authority
JP
Japan
Prior art keywords
layer
films
photosensitive resin
forming method
resin window
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7720081A
Other languages
Japanese (ja)
Inventor
Toshio Sugawa
Takeshi Konuma
Kazuyo Nagamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP7720081A priority Critical patent/JPS57192027A/en
Publication of JPS57192027A publication Critical patent/JPS57192027A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/095—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

PURPOSE:To make the opening of the first layer larger than that of the second layer after developing treatment in the first layer and the second layer by substantially changing the photosensitive regions of the first layer and the second layer to the photosensitive resin of two layers or more. CONSTITUTION:Multilayer films 5, 6 consisting of the photosensitive resin films of at least two layers are formed onto a substrate 4, and the condition of etching of the films 5, 6 are made differ. Accordingly, the opening section of the film 5 contacting with the substrate 4 is shaped so as to be contained in the opening section of the film 6. The conditions of etching are made differ in response to the sensitivity of the films 5, 6, the difference of irradiated beams to the films 5, 6, etc.
JP7720081A 1981-05-20 1981-05-20 Forming method of photosensitive resin window Pending JPS57192027A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7720081A JPS57192027A (en) 1981-05-20 1981-05-20 Forming method of photosensitive resin window

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7720081A JPS57192027A (en) 1981-05-20 1981-05-20 Forming method of photosensitive resin window

Publications (1)

Publication Number Publication Date
JPS57192027A true JPS57192027A (en) 1982-11-26

Family

ID=13627175

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7720081A Pending JPS57192027A (en) 1981-05-20 1981-05-20 Forming method of photosensitive resin window

Country Status (1)

Country Link
JP (1) JPS57192027A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02156539A (en) * 1988-12-08 1990-06-15 Hitachi Ltd Manufacture of semiconductor integrated circuit device
US6328409B1 (en) 1998-09-30 2001-12-11 Xerox Corporation Ballistic aerosol making apparatus for marking with a liquid material
US6340216B1 (en) 1998-09-30 2002-01-22 Xerox Corporation Ballistic aerosol marking apparatus for treating a substrate
US6416158B1 (en) * 1998-09-30 2002-07-09 Xerox Corporation Ballistic aerosol marking apparatus with stacked electrode structure
US6751865B1 (en) * 1998-09-30 2004-06-22 Xerox Corporation Method of making a print head for use in a ballistic aerosol marking apparatus
CN102231045A (en) * 2011-06-28 2011-11-02 上海宏力半导体制造有限公司 Photoetching method and semiconductor device
JP2015215585A (en) * 2014-05-07 2015-12-03 サムソン エレクトロ−メカニックス カンパニーリミテッド． Photosensitive insulator film for via hole formation, and via hole formation method using the same

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02156539A (en) * 1988-12-08 1990-06-15 Hitachi Ltd Manufacture of semiconductor integrated circuit device
US6328409B1 (en) 1998-09-30 2001-12-11 Xerox Corporation Ballistic aerosol making apparatus for marking with a liquid material
US6340216B1 (en) 1998-09-30 2002-01-22 Xerox Corporation Ballistic aerosol marking apparatus for treating a substrate
US6416158B1 (en) * 1998-09-30 2002-07-09 Xerox Corporation Ballistic aerosol marking apparatus with stacked electrode structure
US6751865B1 (en) * 1998-09-30 2004-06-22 Xerox Corporation Method of making a print head for use in a ballistic aerosol marking apparatus
CN102231045A (en) * 2011-06-28 2011-11-02 上海宏力半导体制造有限公司 Photoetching method and semiconductor device
JP2015215585A (en) * 2014-05-07 2015-12-03 サムソン エレクトロ−メカニックス カンパニーリミテッド． Photosensitive insulator film for via hole formation, and via hole formation method using the same

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