JPS57211782A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS57211782A JPS57211782A JP9667981A JP9667981A JPS57211782A JP S57211782 A JPS57211782 A JP S57211782A JP 9667981 A JP9667981 A JP 9667981A JP 9667981 A JP9667981 A JP 9667981A JP S57211782 A JPS57211782 A JP S57211782A
- Authority
- JP
- Japan
- Prior art keywords
- circuit element
- compound semiconductor
- semiconductor substrate
- silicon layer
- poly silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/0605—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits made of compound material, e.g. AIIIBV
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
Abstract
PURPOSE:To permit mass production by connecting a circuit element directly formed on a compound semiconductor substrate and the desired electrode section of the circuit element of a poly silicon layer by a wiring layer crawling on an insulating film covering the desired sections of both the circuit elements. CONSTITUTION:A semiconductor device is composed of a compound semiconductor substrate 9, a circuit element 10 formed on the main surface of the compound semiconductor substrate, and a circuit element 13 formed on a poly silicon layer 12 formed on a part of the main surface of the compound semiconductor substrate through an insulating layer 11. The circuit element directly formed on the compound semiconductor substrate and the desired electrode section of the circuit element of the poly silicon layer are connected by a wiring layer 15 crawling on an insulating film covering the desired sections of both the circuit elements. For example, it is preferable that a field effect transistor 8 is formed on the main surface of the CaAs substrate 9 and a protective diode 13 is also formed on the poly silicon layer 12 formed on the GaAs substrate 9 through the insulating film.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9667981A JPS57211782A (en) | 1981-06-24 | 1981-06-24 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9667981A JPS57211782A (en) | 1981-06-24 | 1981-06-24 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57211782A true JPS57211782A (en) | 1982-12-25 |
Family
ID=14171475
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9667981A Pending JPS57211782A (en) | 1981-06-24 | 1981-06-24 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57211782A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59175164A (en) * | 1983-03-24 | 1984-10-03 | Seiko Epson Corp | Semiconductor device |
-
1981
- 1981-06-24 JP JP9667981A patent/JPS57211782A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59175164A (en) * | 1983-03-24 | 1984-10-03 | Seiko Epson Corp | Semiconductor device |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5563840A (en) | Semiconductor integrated device | |
JPS52156580A (en) | Semiconductor integrated circuit device and its production | |
JPS57211782A (en) | Semiconductor device | |
JPS5724563A (en) | Semiconductor device | |
JPS57164571A (en) | Semiconductro integrated circuit device | |
JPS5543864A (en) | Mis semiconductor device | |
JPS57104279A (en) | Photo isolator | |
JPS6489457A (en) | Manufacture of semiconductor device | |
JPS55113344A (en) | Electrode wiring and its manufacture | |
JPS57160156A (en) | Semiconductor device | |
JPS5544711A (en) | Semiconductor device | |
JPS54160186A (en) | Semiconductor integrated circuit device | |
JPS5326585A (en) | Production of mis semiconductor device | |
JPS57190333A (en) | Semiconductor device | |
JPS5263080A (en) | Production of semiconductor integrated circuit device | |
JPS5740968A (en) | Semiconductor device | |
JPS6473637A (en) | Semiconductor integrated circuit device | |
JPS546775A (en) | Semiconductor device featuring stepped electrode structure | |
JPS5434784A (en) | Semiconductor integrated circuit device | |
JPS577950A (en) | Semiconductor integrated circuit device | |
JPS55166954A (en) | Semiconductor device | |
JPS55130145A (en) | Semiconductor integrated circuit device | |
JPS5352388A (en) | Semiconductor device | |
JPS57121275A (en) | Semiconductor device | |
JPS5749254A (en) | Semiconductor device |