JPS57208158A - Manufacture of multilayer wiring structure - Google Patents

Manufacture of multilayer wiring structure

Info

Publication number
JPS57208158A
JPS57208158A JP9233581A JP9233581A JPS57208158A JP S57208158 A JPS57208158 A JP S57208158A JP 9233581 A JP9233581 A JP 9233581A JP 9233581 A JP9233581 A JP 9233581A JP S57208158 A JPS57208158 A JP S57208158A
Authority
JP
Japan
Prior art keywords
layer
multilayer wiring
wiring structure
pattern
prescribed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9233581A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6243544B2 (enrdf_load_stackoverflow
Inventor
Kazunari Takemoto
Fumio Kataoka
Fusaji Shoji
Mitsuo Nakatani
Ataru Yokono
Tokio Isogai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9233581A priority Critical patent/JPS57208158A/ja
Publication of JPS57208158A publication Critical patent/JPS57208158A/ja
Publication of JPS6243544B2 publication Critical patent/JPS6243544B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Formation Of Insulating Films (AREA)
JP9233581A 1981-06-17 1981-06-17 Manufacture of multilayer wiring structure Granted JPS57208158A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9233581A JPS57208158A (en) 1981-06-17 1981-06-17 Manufacture of multilayer wiring structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9233581A JPS57208158A (en) 1981-06-17 1981-06-17 Manufacture of multilayer wiring structure

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2851884A Division JPS60121740A (ja) 1984-02-20 1984-02-20 多層配線構造体

Publications (2)

Publication Number Publication Date
JPS57208158A true JPS57208158A (en) 1982-12-21
JPS6243544B2 JPS6243544B2 (enrdf_load_stackoverflow) 1987-09-14

Family

ID=14051515

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9233581A Granted JPS57208158A (en) 1981-06-17 1981-06-17 Manufacture of multilayer wiring structure

Country Status (1)

Country Link
JP (1) JPS57208158A (enrdf_load_stackoverflow)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59119790A (ja) * 1982-12-24 1984-07-11 松下電器産業株式会社 多層印刷配線板およびその製造方法
JPS61121393A (ja) * 1984-11-19 1986-06-09 旭化成株式会社 多層配線板の製造方法
JPH025596A (ja) * 1988-06-24 1990-01-10 Nec Corp 多層配線基板の製造方法
JP2014216623A (ja) * 2013-04-30 2014-11-17 株式会社村田製作所 電子部品の製造方法及び電子部品
WO2017146153A1 (ja) * 2016-02-26 2017-08-31 富士フイルム株式会社 積層体の製造方法および半導体デバイスの製造方法
WO2018025738A1 (ja) * 2016-08-01 2018-02-08 富士フイルム株式会社 感光性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、積層体の製造方法および半導体デバイス
WO2018038002A1 (ja) * 2016-08-25 2018-03-01 富士フイルム株式会社 積層体の製造方法および電子デバイスの製造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI462669B (zh) * 2013-02-08 2014-11-21 Ichia Tech Inc 多層式的軟性印刷電路板及其製造方法

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59119790A (ja) * 1982-12-24 1984-07-11 松下電器産業株式会社 多層印刷配線板およびその製造方法
JPS61121393A (ja) * 1984-11-19 1986-06-09 旭化成株式会社 多層配線板の製造方法
JPH025596A (ja) * 1988-06-24 1990-01-10 Nec Corp 多層配線基板の製造方法
JP2014216623A (ja) * 2013-04-30 2014-11-17 株式会社村田製作所 電子部品の製造方法及び電子部品
WO2017146153A1 (ja) * 2016-02-26 2017-08-31 富士フイルム株式会社 積層体の製造方法および半導体デバイスの製造方法
CN108700836A (zh) * 2016-02-26 2018-10-23 富士胶片株式会社 层叠体的制造方法及半导体器件的制造方法
JPWO2017146153A1 (ja) * 2016-02-26 2019-01-17 富士フイルム株式会社 積層体の製造方法および半導体デバイスの製造方法
WO2018025738A1 (ja) * 2016-08-01 2018-02-08 富士フイルム株式会社 感光性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、積層体の製造方法および半導体デバイス
JPWO2018025738A1 (ja) * 2016-08-01 2019-05-30 富士フイルム株式会社 感光性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、積層体の製造方法および半導体デバイス
WO2018038002A1 (ja) * 2016-08-25 2018-03-01 富士フイルム株式会社 積層体の製造方法および電子デバイスの製造方法
JPWO2018038002A1 (ja) * 2016-08-25 2019-04-11 富士フイルム株式会社 積層体の製造方法および電子デバイスの製造方法

Also Published As

Publication number Publication date
JPS6243544B2 (enrdf_load_stackoverflow) 1987-09-14

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