JPS57200598A - Plating apparatus - Google Patents

Plating apparatus

Info

Publication number
JPS57200598A
JPS57200598A JP56084567A JP8456781A JPS57200598A JP S57200598 A JPS57200598 A JP S57200598A JP 56084567 A JP56084567 A JP 56084567A JP 8456781 A JP8456781 A JP 8456781A JP S57200598 A JPS57200598 A JP S57200598A
Authority
JP
Japan
Prior art keywords
work
plating solution
anode
held
plated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56084567A
Other languages
English (en)
Other versions
JPS6347794B2 (ja
Inventor
Kenji Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EEJA Ltd
Original Assignee
Electroplating Engineers of Japan Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electroplating Engineers of Japan Ltd filed Critical Electroplating Engineers of Japan Ltd
Priority to JP56084567A priority Critical patent/JPS57200598A/ja
Publication of JPS57200598A publication Critical patent/JPS57200598A/ja
Publication of JPS6347794B2 publication Critical patent/JPS6347794B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
JP56084567A 1981-06-02 1981-06-02 Plating apparatus Granted JPS57200598A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56084567A JPS57200598A (en) 1981-06-02 1981-06-02 Plating apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56084567A JPS57200598A (en) 1981-06-02 1981-06-02 Plating apparatus

Publications (2)

Publication Number Publication Date
JPS57200598A true JPS57200598A (en) 1982-12-08
JPS6347794B2 JPS6347794B2 (ja) 1988-09-26

Family

ID=13834234

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56084567A Granted JPS57200598A (en) 1981-06-02 1981-06-02 Plating apparatus

Country Status (1)

Country Link
JP (1) JPS57200598A (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60132465U (ja) * 1984-02-14 1985-09-04 上村工業株式会社 板状ワ−クの処理装置
JPS6237390A (ja) * 1985-08-09 1987-02-18 Nippon Denso Co Ltd 部分めつき装置
JPH01290792A (ja) * 1988-05-17 1989-11-22 Katayama Tokushu Kogyo Kk 金属多孔体及びその製造方法並びに製造装置
JPH0393255A (ja) * 1989-09-05 1991-04-18 Hitachi Cable Ltd リードフレームの両面部分めっき方法および装置
JP2003321796A (ja) * 2002-04-30 2003-11-14 Nitto Denko Corp めっき装置およびそれを用いた配線基板の製造方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60132465U (ja) * 1984-02-14 1985-09-04 上村工業株式会社 板状ワ−クの処理装置
JPS644844Y2 (ja) * 1984-02-14 1989-02-07
JPS6237390A (ja) * 1985-08-09 1987-02-18 Nippon Denso Co Ltd 部分めつき装置
JPH01290792A (ja) * 1988-05-17 1989-11-22 Katayama Tokushu Kogyo Kk 金属多孔体及びその製造方法並びに製造装置
JPH0571676B2 (ja) * 1988-05-17 1993-10-07 Katayama Tokushu Kogyo Kk
JPH0393255A (ja) * 1989-09-05 1991-04-18 Hitachi Cable Ltd リードフレームの両面部分めっき方法および装置
JP2003321796A (ja) * 2002-04-30 2003-11-14 Nitto Denko Corp めっき装置およびそれを用いた配線基板の製造方法

Also Published As

Publication number Publication date
JPS6347794B2 (ja) 1988-09-26

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