JPS57194556A - Heat radiating package - Google Patents
Heat radiating packageInfo
- Publication number
- JPS57194556A JPS57194556A JP7956481A JP7956481A JPS57194556A JP S57194556 A JPS57194556 A JP S57194556A JP 7956481 A JP7956481 A JP 7956481A JP 7956481 A JP7956481 A JP 7956481A JP S57194556 A JPS57194556 A JP S57194556A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- elements
- ceramic
- fins
- heat radiating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7956481A JPS57194556A (en) | 1981-05-26 | 1981-05-26 | Heat radiating package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7956481A JPS57194556A (en) | 1981-05-26 | 1981-05-26 | Heat radiating package |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57194556A true JPS57194556A (en) | 1982-11-30 |
Family
ID=13693499
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7956481A Pending JPS57194556A (en) | 1981-05-26 | 1981-05-26 | Heat radiating package |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57194556A (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5155579A (en) * | 1991-02-05 | 1992-10-13 | Advanced Micro Devices | Molded heat sink for integrated circuit package |
US5650593A (en) * | 1994-05-26 | 1997-07-22 | Amkor Electronics, Inc. | Thermally enhanced chip carrier package |
US5827999A (en) * | 1994-05-26 | 1998-10-27 | Amkor Electronics, Inc. | Homogeneous chip carrier package |
EP1406303A1 (en) * | 2001-07-09 | 2004-04-07 | Daikin Industries, Ltd. | Power module and air conditioner |
-
1981
- 1981-05-26 JP JP7956481A patent/JPS57194556A/ja active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5155579A (en) * | 1991-02-05 | 1992-10-13 | Advanced Micro Devices | Molded heat sink for integrated circuit package |
US5650593A (en) * | 1994-05-26 | 1997-07-22 | Amkor Electronics, Inc. | Thermally enhanced chip carrier package |
US5827999A (en) * | 1994-05-26 | 1998-10-27 | Amkor Electronics, Inc. | Homogeneous chip carrier package |
EP1406303A1 (en) * | 2001-07-09 | 2004-04-07 | Daikin Industries, Ltd. | Power module and air conditioner |
EP1406303A4 (en) * | 2001-07-09 | 2007-12-12 | Daikin Ind Ltd | POWER MODULE AND AIR CONDITIONER |
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