JPS5724272A - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JPS5724272A JPS5724272A JP9850480A JP9850480A JPS5724272A JP S5724272 A JPS5724272 A JP S5724272A JP 9850480 A JP9850480 A JP 9850480A JP 9850480 A JP9850480 A JP 9850480A JP S5724272 A JPS5724272 A JP S5724272A
- Authority
- JP
- Japan
- Prior art keywords
- adhesives
- heat
- substrate
- glass epoxy
- ceramic substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/345—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors
Abstract
PURPOSE:To discharge excessive heat to the outside, and to prevent an adverse effect due to heat to a LSI by each bonding a ceramic substrate and a glass epoxy substrate on a supporting plate by using adhesives having excellent thermal conductivity and adhesives having inferior conductivity. CONSTITUTION:The ceramic substrate 12 is bonded to the aluminum supporting plate 10 with the adhesives 16 having excellent thermal conductivity, and the glass epoxy substrates 13 are bonded with the adhesives 17 having inferior thermal conductivity. Tape carriers 18 are mounted between each of the ceramic substrate and the glass epoxy substrates, and the LSIs 19 are attached on the carriers. When the resistance heat elements 20 of the thermal head generate heat, heat elevating the temperature of the ceramic substrate is discharged to the outside through radiation fins 11 from the aluminum substrate by the adhesives 16, and the adverse effects due to heat to the glass epoxy substrate and the LSIs on the substrate are prevented by the adhesives 17.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9850480A JPS5724272A (en) | 1980-07-18 | 1980-07-18 | Thermal head |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9850480A JPS5724272A (en) | 1980-07-18 | 1980-07-18 | Thermal head |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5724272A true JPS5724272A (en) | 1982-02-08 |
Family
ID=14221467
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9850480A Pending JPS5724272A (en) | 1980-07-18 | 1980-07-18 | Thermal head |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5724272A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5814779A (en) * | 1981-07-20 | 1983-01-27 | Matsushita Electric Ind Co Ltd | Thermal head for heat-sensitive recording |
JPS5938052U (en) * | 1982-08-31 | 1984-03-10 | ロ−ム株式会社 | Thermal print head heat sink |
JPS59181753U (en) * | 1983-05-24 | 1984-12-04 | ロ−ム株式会社 | thermal printer head |
JPS60152440U (en) * | 1984-03-21 | 1985-10-11 | ロ−ム株式会社 | thermal print head |
JPH01190467A (en) * | 1988-01-25 | 1989-07-31 | Tdk Corp | Thermal head |
CN1050326C (en) * | 1992-04-20 | 2000-03-15 | 罗沐股份有限公司 | Method for pasting terminal plates on heat sensible press head |
-
1980
- 1980-07-18 JP JP9850480A patent/JPS5724272A/en active Pending
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5814779A (en) * | 1981-07-20 | 1983-01-27 | Matsushita Electric Ind Co Ltd | Thermal head for heat-sensitive recording |
JPH0159112B2 (en) * | 1981-07-20 | 1989-12-14 | Matsushita Electric Ind Co Ltd | |
JPS5938052U (en) * | 1982-08-31 | 1984-03-10 | ロ−ム株式会社 | Thermal print head heat sink |
JPH0321962Y2 (en) * | 1982-08-31 | 1991-05-14 | ||
JPS59181753U (en) * | 1983-05-24 | 1984-12-04 | ロ−ム株式会社 | thermal printer head |
JPS60152440U (en) * | 1984-03-21 | 1985-10-11 | ロ−ム株式会社 | thermal print head |
JPH01190467A (en) * | 1988-01-25 | 1989-07-31 | Tdk Corp | Thermal head |
CN1050326C (en) * | 1992-04-20 | 2000-03-15 | 罗沐股份有限公司 | Method for pasting terminal plates on heat sensible press head |
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