JPH01190467A - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JPH01190467A JPH01190467A JP1417588A JP1417588A JPH01190467A JP H01190467 A JPH01190467 A JP H01190467A JP 1417588 A JP1417588 A JP 1417588A JP 1417588 A JP1417588 A JP 1417588A JP H01190467 A JPH01190467 A JP H01190467A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- mounting plate
- projecting portion
- ceramic board
- grooves
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 claims abstract description 36
- 230000001070 adhesive effect Effects 0.000 claims abstract description 36
- 239000000758 substrate Substances 0.000 claims description 21
- 238000010438 heat treatment Methods 0.000 claims description 10
- 239000000919 ceramic Substances 0.000 abstract description 23
- 230000000694 effects Effects 0.000 description 8
- 239000010409 thin film Substances 0.000 description 5
- 239000010408 film Substances 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000007651 thermal printing Methods 0.000 description 2
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- 241000321422 Mycteroperca jordani Species 0.000 description 1
- KGWWEXORQXHJJQ-UHFFFAOYSA-N [Fe].[Co].[Ni] Chemical compound [Fe].[Co].[Ni] KGWWEXORQXHJJQ-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、サーマルヘッドに係シ、特に、セラミック
基板上に、薄膜パターンまたは厚膜パターンによる多数
の発熱素子を形成し、該発熱素子を選択的に発熱させて
感熱印刷させる感熱印刷装置に用いるサーマルヘッドに
関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a thermal head, and in particular, to forming a large number of heating elements with thin film patterns or thick film patterns on a ceramic substrate, and forming the heating elements with a thin film pattern or a thick film pattern. The present invention relates to a thermal head used in a thermal printing device that selectively generates heat to perform thermal printing.
サーマルヘッドは、セラミック基板上に薄膜抵抗体パタ
ーンまたは厚膜抵抗体パターンによる多数の発熱素子を
形成し、これを金属製の取付板に取付けて形成される。The thermal head is formed by forming a large number of heating elements using thin film resistor patterns or thick film resistor patterns on a ceramic substrate, and attaching the heating elements to a metal mounting plate.
このサーマルヘッドは、使用時には１発熱体の発熱で約
３０℃温度も上昇し、使用温度範囲を例えば５℃〜４０
℃とした場谷には、最高的７０℃にも達することになる
。このため９発熱素子が形成されるセラミック板と、金
属製等の取付板との間の熱膨張係数の差によりてバイメ
タル効果が生じ１発熱素子と記碌紙との当シが悪くなり
、サーマルヘッドの長手方向において印刷濃度むらが生
ずる等の問題点を生じていた。When this thermal head is used, the temperature increases by approximately 30℃ due to the heat generated by one heating element, and the operating temperature range is, for example, 5℃ to 40℃.
In Baya, the temperature reaches a maximum of 70 degrees Celsius. For this reason, the bimetal effect occurs due to the difference in thermal expansion coefficient between the ceramic plate on which the heating element 9 is formed and the mounting plate made of metal, etc., and the contact between the heating element 1 and the recording paper becomes poor, resulting in thermal Problems such as uneven printing density occur in the longitudinal direction of the head.
そのため、従来より、この薄膜パターンによる発熱素子
を形成したセラミック基板と、それを取付ける取付板の
接着構造によって、バイメタル効果を極力低く押さえて
いる。Therefore, conventionally, the bimetal effect has been kept as low as possible by using an adhesive structure between a ceramic substrate on which a heating element is formed using a thin film pattern and a mounting plate to which it is attached.
第２図は、この従来例を示すものであシ、囚は斜視図、
ａ３）は断面図を示している。第２図において、１はセ
ラミック基板であり２図示はしていないが、この上に薄
膜抵抗体または厚膜抵抗体による発熱素子が形成されて
いる。２は鉄板、或いは鉄−ニッケルーコバルト系合金
等よりなる取付板でｔＤｂ、中央部に溝７が形成されて
いる。この溝中に硬化後にゴム弾性を有する接着剤８（
以下ゴム系接着剤）を充てんし、これによって、セラミ
ック基板を接着する。Figure 2 shows this conventional example;
a3) shows a cross-sectional view. In FIG. 2, reference numeral 1 denotes a ceramic substrate, and 2, although not shown, a heating element made of a thin film resistor or a thick film resistor is formed on this substrate. Reference numeral 2 denotes a mounting plate made of an iron plate or an iron-nickel-cobalt alloy, and has a groove 7 formed in the center thereof. In this groove, an adhesive 8 (
It is filled with a rubber-based adhesive (hereinafter referred to as rubber-based adhesive), and the ceramic substrate is bonded with this.
これＫよれば、接着剤８が中央部に限定されておシ、さ
らに弾性を有することから、セラミック基板と取付板と
の間の膨張の差に基づくバイメタル作用の発生を最小限
に抑えることができる。According to K, since the adhesive 8 is limited to the central part and has elasticity, it is possible to minimize the occurrence of bimetallic action due to the difference in expansion between the ceramic substrate and the mounting plate. can.
ところが、この従来のセラミック基板の取付は構造では
、接着剤の塗布量を一定にすることが困難でアリ、安定
した特性を得ることが困難であるという問題点を有する
。However, this conventional method of attaching a ceramic substrate has a problem in that it is difficult to maintain a constant amount of adhesive applied, and it is difficult to obtain stable characteristics.
例えば、接着剤が少ない場合は２両者の接着面積が少な
くなシ接着力、熱伝導性に差が生ずることになる。また
、接着剤が多い場合は、接着剤が溝部以外に流れ出し、
溝以外での接着部分が多くなり２本来目的とするバイメ
タル効果の抑えが不十分となる。For example, if the amount of adhesive is small, the bonding area between the two parts will be small, resulting in a difference in adhesive strength and thermal conductivity. Also, if there is a lot of adhesive, the adhesive may flow out other than the groove,
There are many adhesive parts other than the grooves, and the original objective of suppressing the bimetal effect becomes insufficient.
この発明は、このような点に鑑みてなされたものであり
、セラミック基板と取付板との熱膨張率の差に基づくバ
イメタル効果を極力低く抑さえると共に、接着剤塗布量
のバラツキを抑さえて、安定した特性のサーマルヘッド
を得ることを目的とする。This invention was made in view of these points, and it is possible to suppress the bimetallic effect due to the difference in thermal expansion coefficient between the ceramic substrate and the mounting plate as much as possible, and to suppress the variation in the amount of adhesive applied. The purpose is to obtain a thermal head with stable characteristics.
上述の課題を解決するため、この発明においては、接着
剤を充てんする溝部分を凸構造としているＯ
これによれば、接着剤の塗布を凸部頂点のみで行ない、
余分な接着剤を、その側部の溝部分に流し込むことがで
きるので、セラミック基板と取付板の接着面積を一定に
することができる。In order to solve the above-mentioned problems, in the present invention, the groove part filled with adhesive has a convex structure. According to this, the adhesive is applied only at the apex of the convex part,
Since excess adhesive can be poured into the grooves on the sides, the bonding area between the ceramic substrate and the mounting plate can be kept constant.
第１図はこの発明の一実施例であシ、第１図囚は斜視図
、第１図（６）は断面図である。また、第２図の従来例
と同一の部材については同一の番号が付与しであるので
、それらの部材についての詳細な説明は省く。FIG. 1 shows one embodiment of the present invention, FIG. 1 is a perspective view, and FIG. 1 (6) is a sectional view. Further, since the same members as in the conventional example shown in FIG. 2 are given the same numbers, a detailed explanation of these members will be omitted.
この発明においては、セラミック基板１と取付板２とを
接着するための接着剤を充てんする溝として、中央部に
凸部５を有し、その両側に溝３゜４を有する溝構造とし
ている。In this invention, the groove structure is such that the groove is filled with an adhesive for bonding the ceramic substrate 1 and the mounting plate 2, and has a protrusion 5 in the center and grooves 3 and 4 on both sides thereof.
第１図（ロ）に示すように１幅Ｗ１のセラミック基板に
対し、それより幅広のＷ２の取付板を接着固定する場合
に、巾ａの凸部５を中央に有し、その両側に溝３，４を
有する溝構造とする。そして。As shown in Fig. 1 (b), when a mounting plate of width W2 is fixed to a ceramic substrate of width W1 by adhesive, it has a convex part 5 of width a in the center and grooves on both sides. It has a groove structure with 3 and 4 grooves. and.
この凸部５の高さを２両側より低くしている。即ち、溝
３，４の底部から上面までの高さＢＫ対し。The height of this convex portion 5 is made lower than those on both sides. That is, with respect to the height BK from the bottom of the grooves 3 and 4 to the top surface.
それよプも低い凸部５として、セラミック基板１との間
Ｋｂだけ間隔がとれるようにし、この部分に硬化後ゴム
弾性を有する接着剤すなわちゴム系の接着剤６を充てん
させている。The convex portion 5 is even lower than that and is spaced by Kb from the ceramic substrate 1, and this portion is filled with an adhesive having rubber elasticity after hardening, that is, a rubber adhesive 6.
このゴム系の接着剤６によって、セラミック基板１と取
付板２を接着固定する。このとき、接着剤６を少し多め
に塗布しておけば、余分な接着剤は凸部５の両側の溝３
．４中に流れ出すことＫなシ、常に一定の安定した接着
を行なうことが可能となる。The ceramic substrate 1 and the mounting plate 2 are bonded and fixed by this rubber adhesive 6. At this time, if you apply a little more adhesive 6, the excess adhesive can be removed from the grooves on both sides of the protrusion 5.
．． 4, it is possible to always perform constant and stable adhesion without flowing out.
また、この時、凸部５の巾寸法ａ、凸部５の頂部とセラ
ミック基板の底面との間隔寸法すを変えることにより、
セラミック基板から取付板への熱伝導抵抗を変化させ、
サーマルヘッドとしての最適効率を設定できる。Moreover, at this time, by changing the width dimension a of the convex part 5 and the distance dimension between the top of the convex part 5 and the bottom surface of the ceramic substrate,
Changes the heat conduction resistance from the ceramic substrate to the mounting plate,
Optimal efficiency as a thermal head can be set.
以上述べてきたとおり、この発明によれば、バイメタル
効果を最小とすることができる外。As described above, according to the present invention, the bimetal effect can be minimized.
１、接着剤塗布面積を安定化できるため、熱変化に対す
るバイメタル効果の発生を安定的に把握することができ
、最適設計が容易である。1. Since the adhesive application area can be stabilized, it is possible to stably understand the occurrence of bimetallic effects in response to thermal changes, making it easy to create an optimal design.
２、寸法８２寸法すを変えることによってセラミック基
板から取付板への熱伝導抵抗を変化させることができる
ので、サーマルヘッドとしての最適効率を容易に設定で
きる。2. Since the heat conduction resistance from the ceramic substrate to the mounting plate can be changed by changing the dimension 82, the optimum efficiency as a thermal head can be easily set.
３、接着層の上、下のみで接着されるため、接着樹脂そ
のものの伸びや内部応力が単純化し、それだけゴム弾性
としての本来の特性が得やすくなシ寿命も長くなる。3. Since it is bonded only on the top and bottom of the adhesive layer, the elongation and internal stress of the adhesive resin itself are simplified, and the original properties of rubber elasticity are easily obtained and the service life is extended.
等の効果を有する。It has the following effects.
第１図はこの発明の実施例、第２図は従来例を示す。
１・・・セラミック基板。
２・・・取付板。
３．４・・・溝。
５・・・凸部。
６・・・接着剤。
特許出願人 ティーデイ−ケイ株式会社代理人弁理士
山 谷 晧 榮FIG. 1 shows an embodiment of the present invention, and FIG. 2 shows a conventional example. 1... Ceramic substrate. 2...Mounting plate. 3.4...Groove. 5...Protrusion. 6...Adhesive. Patent applicant Akira Yamatani, patent attorney of TDC Co., Ltd.
Claims (3)
ける取付板より成るサーマルヘッドにおいて、前記取付
板に溝を設けると共に、該溝の中央部に凸部を設け、該
凸部に付着せしめた接着剤により、前記基板と取付板を
接着せしめたことを特徴とするサーマルヘッド。(1) In a thermal head consisting of a substrate on which a heating element is formed and a mounting plate to which the substrate is attached, a groove is provided in the mounting plate, a convex portion is provided in the center of the groove, and the adhesive is attached to the convex portion. A thermal head characterized in that the substrate and the mounting plate are bonded together using an adhesive.
を用いたことを特徴とする請求項１記載のサーマルヘッ
ド。(2) The thermal head according to claim 1, wherein the adhesive is an adhesive that exhibits rubber elasticity when cured.
の表面より低く構成されていることを特徴とする請求項
１、又は請求項２記載のサーマルヘッド。(3) The thermal head according to claim 1 or 2, wherein the top of the convex portion provided at the center of the groove of the mounting plate is configured to be lower than the surface of the mounting plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63014175A JPH064341B2 (en) | 1988-01-25 | 1988-01-25 | Thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63014175A JPH064341B2 (en) | 1988-01-25 | 1988-01-25 | Thermal head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01190467A true JPH01190467A (en) | 1989-07-31 |
| JPH064341B2 JPH064341B2 (en) | 1994-01-19 |
Family
ID=11853808
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63014175A Expired - Lifetime JPH064341B2 (en) | 1988-01-25 | 1988-01-25 | Thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH064341B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0244046U (en) * | 1988-09-06 | 1990-03-27 | ||
| US5285216A (en) * | 1989-09-27 | 1994-02-08 | Kyocera Corporation | Thermal head |
| EP1582360A2 (en) | 2004-03-30 | 2005-10-05 | Alps Electric Co., Ltd. | Thermal head having adhesive interposed between adhesion surface of heat-dissipation plate and adhesion surface of head substrate and method for producing the same |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5724272A (en) * | 1980-07-18 | 1982-02-08 | Ricoh Co Ltd | Thermal head |
| JPS61140844U (en) * | 1985-02-21 | 1986-09-01 |
-
1988
- 1988-01-25 JP JP63014175A patent/JPH064341B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5724272A (en) * | 1980-07-18 | 1982-02-08 | Ricoh Co Ltd | Thermal head |
| JPS61140844U (en) * | 1985-02-21 | 1986-09-01 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0244046U (en) * | 1988-09-06 | 1990-03-27 | ||
| US5285216A (en) * | 1989-09-27 | 1994-02-08 | Kyocera Corporation | Thermal head |
| EP1582360A2 (en) | 2004-03-30 | 2005-10-05 | Alps Electric Co., Ltd. | Thermal head having adhesive interposed between adhesion surface of heat-dissipation plate and adhesion surface of head substrate and method for producing the same |
| US7250960B2 (en) | 2004-03-30 | 2007-07-31 | Alps Electric Co., Ltd. | Thermal head having adhesive interposed between adhesion surface of heat-dissipation plate and adhesion surface of head substrate and method for producing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH064341B2 (en) | 1994-01-19 |
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