JPS5718754A - Epoxy-silicone resin composition - Google Patents
Epoxy-silicone resin compositionInfo
- Publication number
- JPS5718754A JPS5718754A JP9310880A JP9310880A JPS5718754A JP S5718754 A JPS5718754 A JP S5718754A JP 9310880 A JP9310880 A JP 9310880A JP 9310880 A JP9310880 A JP 9310880A JP S5718754 A JPS5718754 A JP S5718754A
- Authority
- JP
- Japan
- Prior art keywords
- formula
- epoxy
- hydrocarbon group
- composition
- substituted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 title 1
- 229920002050 silicone resin Polymers 0.000 title 1
- 239000000203 mixture Substances 0.000 abstract 4
- 125000001183 hydrocarbyl group Chemical group 0.000 abstract 2
- 229920003986 novolac Polymers 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
- 239000011347 resin Substances 0.000 abstract 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 abstract 1
- 125000003118 aryl group Chemical group 0.000 abstract 1
- 125000004429 atom Chemical group 0.000 abstract 1
- 239000003054 catalyst Substances 0.000 abstract 1
- 229910052801 chlorine Inorganic materials 0.000 abstract 1
- 125000001309 chloro group Chemical group Cl* 0.000 abstract 1
- 238000013329 compounding Methods 0.000 abstract 1
- 230000007797 corrosion Effects 0.000 abstract 1
- 238000005260 corrosion Methods 0.000 abstract 1
- 229930003836 cresol Natural products 0.000 abstract 1
- 239000003822 epoxy resin Substances 0.000 abstract 1
- 239000000945 filler Substances 0.000 abstract 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract 1
- 150000001283 organosilanols Chemical class 0.000 abstract 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 abstract 1
- 229920000647 polyepoxide Polymers 0.000 abstract 1
- 229920001296 polysiloxane Polymers 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 150000003377 silicon compounds Chemical class 0.000 abstract 1
- LMBFAGIMSUYTBN-MPZNNTNKSA-N teixobactin Chemical compound C([C@H](C(=O)N[C@@H]([C@@H](C)CC)C(=O)N[C@@H](CO)C(=O)N[C@H](CCC(N)=O)C(=O)N[C@H]([C@@H](C)CC)C(=O)N[C@@H]([C@@H](C)CC)C(=O)N[C@@H](CO)C(=O)N[C@H]1C(N[C@@H](C)C(=O)N[C@@H](C[C@@H]2NC(=N)NC2)C(=O)N[C@H](C(=O)O[C@H]1C)[C@@H](C)CC)=O)NC)C1=CC=CC=C1 LMBFAGIMSUYTBN-MPZNNTNKSA-N 0.000 abstract 1
Landscapes
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9310880A JPS5718754A (en) | 1980-07-08 | 1980-07-08 | Epoxy-silicone resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9310880A JPS5718754A (en) | 1980-07-08 | 1980-07-08 | Epoxy-silicone resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5718754A true JPS5718754A (en) | 1982-01-30 |
| JPS626573B2 JPS626573B2 (enrdf_load_stackoverflow) | 1987-02-12 |
Family
ID=14073322
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9310880A Granted JPS5718754A (en) | 1980-07-08 | 1980-07-08 | Epoxy-silicone resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5718754A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5876455A (ja) * | 1981-11-02 | 1983-05-09 | Matsushita Electric Works Ltd | 封止用熱硬化性樹脂成形材料及びこれを用いて成形された電子部品 |
| WO2025159022A1 (ja) * | 2024-01-23 | 2025-07-31 | 住友ベークライト株式会社 | 難燃性樹脂組成物 |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5150942A (ja) * | 1974-10-31 | 1976-05-06 | Nippon Paint Co Ltd | Netsukokaseihifukusoseibutsu |
| JPS52107049A (en) * | 1976-02-23 | 1977-09-08 | Dow Corning | Curing compound for molding |
| JPS53106754A (en) * | 1977-03-01 | 1978-09-18 | Dow Corning | Process of crack resistance modification of siloxane molding composition |
| JPS53147799A (en) * | 1977-05-31 | 1978-12-22 | Shin Etsu Chem Co Ltd | Curable composition |
| JPS562319A (en) * | 1979-06-21 | 1981-01-12 | Toshiba Corp | Epoxy resin composition |
| JPS5618643A (en) * | 1979-07-25 | 1981-02-21 | Toshiba Corp | Preparation of epoxy resin composition |
| JPS56160055A (en) * | 1980-05-15 | 1981-12-09 | Toshiba Corp | Resin sealing type semiconductor device |
-
1980
- 1980-07-08 JP JP9310880A patent/JPS5718754A/ja active Granted
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5150942A (ja) * | 1974-10-31 | 1976-05-06 | Nippon Paint Co Ltd | Netsukokaseihifukusoseibutsu |
| JPS52107049A (en) * | 1976-02-23 | 1977-09-08 | Dow Corning | Curing compound for molding |
| JPS53106754A (en) * | 1977-03-01 | 1978-09-18 | Dow Corning | Process of crack resistance modification of siloxane molding composition |
| JPS53147799A (en) * | 1977-05-31 | 1978-12-22 | Shin Etsu Chem Co Ltd | Curable composition |
| JPS562319A (en) * | 1979-06-21 | 1981-01-12 | Toshiba Corp | Epoxy resin composition |
| JPS5618643A (en) * | 1979-07-25 | 1981-02-21 | Toshiba Corp | Preparation of epoxy resin composition |
| JPS56160055A (en) * | 1980-05-15 | 1981-12-09 | Toshiba Corp | Resin sealing type semiconductor device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5876455A (ja) * | 1981-11-02 | 1983-05-09 | Matsushita Electric Works Ltd | 封止用熱硬化性樹脂成形材料及びこれを用いて成形された電子部品 |
| WO2025159022A1 (ja) * | 2024-01-23 | 2025-07-31 | 住友ベークライト株式会社 | 難燃性樹脂組成物 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS626573B2 (enrdf_load_stackoverflow) | 1987-02-12 |
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