JPS626573B2 - - Google Patents

Info

Publication number
JPS626573B2
JPS626573B2 JP55093108A JP9310880A JPS626573B2 JP S626573 B2 JPS626573 B2 JP S626573B2 JP 55093108 A JP55093108 A JP 55093108A JP 9310880 A JP9310880 A JP 9310880A JP S626573 B2 JPS626573 B2 JP S626573B2
Authority
JP
Japan
Prior art keywords
weight
resin
epoxy
groups
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55093108A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5718754A (en
Inventor
Toshio Shiobara
Shinichi Ide
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Priority to JP9310880A priority Critical patent/JPS5718754A/ja
Publication of JPS5718754A publication Critical patent/JPS5718754A/ja
Publication of JPS626573B2 publication Critical patent/JPS626573B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP9310880A 1980-07-08 1980-07-08 Epoxy-silicone resin composition Granted JPS5718754A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9310880A JPS5718754A (en) 1980-07-08 1980-07-08 Epoxy-silicone resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9310880A JPS5718754A (en) 1980-07-08 1980-07-08 Epoxy-silicone resin composition

Publications (2)

Publication Number Publication Date
JPS5718754A JPS5718754A (en) 1982-01-30
JPS626573B2 true JPS626573B2 (enrdf_load_stackoverflow) 1987-02-12

Family

ID=14073322

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9310880A Granted JPS5718754A (en) 1980-07-08 1980-07-08 Epoxy-silicone resin composition

Country Status (1)

Country Link
JP (1) JPS5718754A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5876455A (ja) * 1981-11-02 1983-05-09 Matsushita Electric Works Ltd 封止用熱硬化性樹脂成形材料及びこれを用いて成形された電子部品
WO2025159022A1 (ja) * 2024-01-23 2025-07-31 住友ベークライト株式会社 難燃性樹脂組成物

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5150942A (ja) * 1974-10-31 1976-05-06 Nippon Paint Co Ltd Netsukokaseihifukusoseibutsu
US4082719A (en) * 1976-02-23 1978-04-04 Dow Corning Corporation Silicone epoxy curable compositions
US4125510A (en) * 1977-03-01 1978-11-14 Dow Corning Corporation Method of improving crack resistance of siloxane molding compositions
JPS6021608B2 (ja) * 1977-05-31 1985-05-28 信越化学工業株式会社 硬化性組成物
JPS5817536B2 (ja) * 1979-06-21 1983-04-07 株式会社東芝 エポキシ樹脂系組成物
JPS5618643A (en) * 1979-07-25 1981-02-21 Toshiba Corp Preparation of epoxy resin composition
JPS56160055A (en) * 1980-05-15 1981-12-09 Toshiba Corp Resin sealing type semiconductor device

Also Published As

Publication number Publication date
JPS5718754A (en) 1982-01-30

Similar Documents

Publication Publication Date Title
US5516858A (en) Epoxy group-containing silicone resin and compositions based thereon
JP3367964B2 (ja) 硬化性樹脂組成物
US5952439A (en) Epoxy group-containing silicone resin and compositions based thereon
JP3388537B2 (ja) 半導体封止用エポキシ樹脂組成物及び半導体装置
JP3339910B2 (ja) 硬化性樹脂組成物
EP1408083B1 (en) Curable epoxy resin composition
JPS627723A (ja) エポキシ樹脂組成物
JP2009270001A (ja) 半導体封止用樹脂組成物およびそれを用いた半導体装置
JP3466239B2 (ja) 硬化性樹脂組成物
JP3925802B2 (ja) エポキシ樹脂組成物および半導体装置
JPH0450925B2 (enrdf_load_stackoverflow)
JPS626573B2 (enrdf_load_stackoverflow)
JP5990959B2 (ja) 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置
JP2003147050A (ja) エポキシ樹脂組成物及び半導体装置
JPH0496929A (ja) エポキシ樹脂組成物及び半導体装置
JP2002206021A (ja) エポキシ樹脂組成物及び半導体装置
JPH06256364A (ja) 有機ケイ素化合物、その製法及びそれを含有する樹脂組成物
JPH11293089A (ja) エポキシ樹脂組成物及び強誘電体メモリー装置
JP2559626B2 (ja) 半導体封止用エポキシ樹脂組成物
JPH03134016A (ja) 半導体封止用エポキシ樹脂組成物及び半導体装置
JP2541015B2 (ja) 半導体装置封止用エポキシ樹脂組成物及び半導体装置
JP3023023B2 (ja) 半導体封止用樹脂組成物
JP2680351B2 (ja) 封止用樹脂組成物
JP2744493B2 (ja) 樹脂組成物
JP2983613B2 (ja) エポキシ樹脂組成物