JPS57164552A - Lead-frame for semiconductor device - Google Patents

Lead-frame for semiconductor device

Info

Publication number
JPS57164552A
JPS57164552A JP56048909A JP4890981A JPS57164552A JP S57164552 A JPS57164552 A JP S57164552A JP 56048909 A JP56048909 A JP 56048909A JP 4890981 A JP4890981 A JP 4890981A JP S57164552 A JPS57164552 A JP S57164552A
Authority
JP
Japan
Prior art keywords
plated layer
alloy
base
solder plated
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56048909A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6312385B2 (enExample
Inventor
Ryozo Yamagishi
Osamu Yoshioka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP56048909A priority Critical patent/JPS57164552A/ja
Publication of JPS57164552A publication Critical patent/JPS57164552A/ja
Publication of JPS6312385B2 publication Critical patent/JPS6312385B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/457—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/5363—
    • H10W72/884—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Die Bonding (AREA)
JP56048909A 1981-04-01 1981-04-01 Lead-frame for semiconductor device Granted JPS57164552A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56048909A JPS57164552A (en) 1981-04-01 1981-04-01 Lead-frame for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56048909A JPS57164552A (en) 1981-04-01 1981-04-01 Lead-frame for semiconductor device

Publications (2)

Publication Number Publication Date
JPS57164552A true JPS57164552A (en) 1982-10-09
JPS6312385B2 JPS6312385B2 (enExample) 1988-03-18

Family

ID=12816378

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56048909A Granted JPS57164552A (en) 1981-04-01 1981-04-01 Lead-frame for semiconductor device

Country Status (1)

Country Link
JP (1) JPS57164552A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57192057A (en) * 1981-05-22 1982-11-26 Hitachi Ltd Semiconductor device
JPS603144A (ja) * 1983-06-21 1985-01-09 Oki Electric Ind Co Ltd 半導体パツケ−ジのリ−ド処理方法
JPS6113950U (ja) * 1984-06-29 1986-01-27 大日本印刷株式会社 金属部分被覆を施した半導体リ−ドフレ−ム
JPH07240488A (ja) * 1994-02-28 1995-09-12 Nec Corp 半導体装置およびその製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5373969A (en) * 1976-12-14 1978-06-30 Toshiba Corp Lead frame for semicinductor

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5373969A (en) * 1976-12-14 1978-06-30 Toshiba Corp Lead frame for semicinductor

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57192057A (en) * 1981-05-22 1982-11-26 Hitachi Ltd Semiconductor device
JPS603144A (ja) * 1983-06-21 1985-01-09 Oki Electric Ind Co Ltd 半導体パツケ−ジのリ−ド処理方法
JPS6113950U (ja) * 1984-06-29 1986-01-27 大日本印刷株式会社 金属部分被覆を施した半導体リ−ドフレ−ム
JPH07240488A (ja) * 1994-02-28 1995-09-12 Nec Corp 半導体装置およびその製造方法

Also Published As

Publication number Publication date
JPS6312385B2 (enExample) 1988-03-18

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