JPS57157543A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS57157543A
JPS57157543A JP4249581A JP4249581A JPS57157543A JP S57157543 A JPS57157543 A JP S57157543A JP 4249581 A JP4249581 A JP 4249581A JP 4249581 A JP4249581 A JP 4249581A JP S57157543 A JPS57157543 A JP S57157543A
Authority
JP
Japan
Prior art keywords
film
layer
semiconductor device
whole surface
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4249581A
Other languages
English (en)
Japanese (ja)
Other versions
JPH035656B2 (enrdf_load_html_response
Inventor
Katsuhiko Hieda
Ryozo Nakayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP4249581A priority Critical patent/JPS57157543A/ja
Publication of JPS57157543A publication Critical patent/JPS57157543A/ja
Publication of JPH035656B2 publication Critical patent/JPH035656B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP4249581A 1981-03-25 1981-03-25 Manufacture of semiconductor device Granted JPS57157543A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4249581A JPS57157543A (en) 1981-03-25 1981-03-25 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4249581A JPS57157543A (en) 1981-03-25 1981-03-25 Manufacture of semiconductor device

Publications (2)

Publication Number Publication Date
JPS57157543A true JPS57157543A (en) 1982-09-29
JPH035656B2 JPH035656B2 (enrdf_load_html_response) 1991-01-28

Family

ID=12637633

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4249581A Granted JPS57157543A (en) 1981-03-25 1981-03-25 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS57157543A (enrdf_load_html_response)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60148146A (ja) * 1984-01-12 1985-08-05 Seiko Instr & Electronics Ltd 半導体装置の配線形成方法
JPS63254746A (ja) * 1987-04-11 1988-10-21 Sony Corp 配線形成方法
JPH0287628A (ja) * 1988-09-26 1990-03-28 Nec Corp 半導体装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5444474A (en) * 1977-09-14 1979-04-07 Matsushita Electric Ind Co Ltd Contact forming method of semiconductor device
JPS54142981A (en) * 1978-04-27 1979-11-07 Matsushita Electric Ind Co Ltd Manufacture of insulation gate type semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5444474A (en) * 1977-09-14 1979-04-07 Matsushita Electric Ind Co Ltd Contact forming method of semiconductor device
JPS54142981A (en) * 1978-04-27 1979-11-07 Matsushita Electric Ind Co Ltd Manufacture of insulation gate type semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60148146A (ja) * 1984-01-12 1985-08-05 Seiko Instr & Electronics Ltd 半導体装置の配線形成方法
JPS63254746A (ja) * 1987-04-11 1988-10-21 Sony Corp 配線形成方法
JPH0287628A (ja) * 1988-09-26 1990-03-28 Nec Corp 半導体装置

Also Published As

Publication number Publication date
JPH035656B2 (enrdf_load_html_response) 1991-01-28

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