JPS57148362A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS57148362A JPS57148362A JP56034439A JP3443981A JPS57148362A JP S57148362 A JPS57148362 A JP S57148362A JP 56034439 A JP56034439 A JP 56034439A JP 3443981 A JP3443981 A JP 3443981A JP S57148362 A JPS57148362 A JP S57148362A
- Authority
- JP
- Japan
- Prior art keywords
- container
- outer lead
- same plane
- side face
- led out
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W90/00—
-
- H10W72/07254—
-
- H10W72/247—
-
- H10W74/15—
-
- H10W90/726—
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56034439A JPS57148362A (en) | 1981-03-10 | 1981-03-10 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56034439A JPS57148362A (en) | 1981-03-10 | 1981-03-10 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57148362A true JPS57148362A (en) | 1982-09-13 |
| JPS6342860B2 JPS6342860B2 (enExample) | 1988-08-25 |
Family
ID=12414252
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56034439A Granted JPS57148362A (en) | 1981-03-10 | 1981-03-10 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57148362A (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5978638U (ja) * | 1982-11-17 | 1984-05-28 | 松下電器産業株式会社 | 電子部品接続構造 |
| JPH0297050A (ja) * | 1988-10-03 | 1990-04-09 | Mitsubishi Electric Corp | 半導体集積回路 |
| JPH05211204A (ja) * | 1991-11-29 | 1993-08-20 | Akira Kitahara | 表面実装電子部品 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5462778A (en) * | 1977-10-28 | 1979-05-21 | Toshiba Corp | Laminated frame for power ic |
| JPS54144872A (en) * | 1978-05-04 | 1979-11-12 | Omron Tateisi Electronics Co | Electronic circuit device |
-
1981
- 1981-03-10 JP JP56034439A patent/JPS57148362A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5462778A (en) * | 1977-10-28 | 1979-05-21 | Toshiba Corp | Laminated frame for power ic |
| JPS54144872A (en) * | 1978-05-04 | 1979-11-12 | Omron Tateisi Electronics Co | Electronic circuit device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5978638U (ja) * | 1982-11-17 | 1984-05-28 | 松下電器産業株式会社 | 電子部品接続構造 |
| JPH0297050A (ja) * | 1988-10-03 | 1990-04-09 | Mitsubishi Electric Corp | 半導体集積回路 |
| JPH05211204A (ja) * | 1991-11-29 | 1993-08-20 | Akira Kitahara | 表面実装電子部品 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6342860B2 (enExample) | 1988-08-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100280762B1 (ko) | 노출 후부를 갖는 열적 강화된 반도체 장치 및 그 제조방법 | |
| GB1526283A (en) | Method of mounting semiconductor chips | |
| JPS57148362A (en) | Semiconductor device | |
| JPS6444056A (en) | Hybrid integrated circuit | |
| JPS5737839A (en) | Manufacture of hybrid integrated circuit | |
| JPS642399A (en) | Semiconductor device | |
| JPS55124250A (en) | Resin sealed semiconductor device | |
| JPS55120153A (en) | Resin molded semiconductor device | |
| JPS572537A (en) | Semiconductor device | |
| JPS6489356A (en) | Hybrid integrated circuit | |
| JPS55138241A (en) | Sealing structure for semiconductor device | |
| JPS5258469A (en) | Resin-molded type semiconductor device | |
| JPS57173948A (en) | Manufacture of semiconductor device | |
| JPS56155556A (en) | Semiconductor device | |
| JPS6449259A (en) | Semiconductor device | |
| JPS57170542A (en) | Semiconductor device | |
| JPS5519846A (en) | Lead frame for resin sealed type semiconductor device | |
| JPS54124690A (en) | Integrated circuit unit | |
| JPS57201053A (en) | Sealing method for semiconductor device | |
| JPS5630732A (en) | Mounting method of semiconductor pellet | |
| JPS5669850A (en) | Method for sealing semiconductor device | |
| JPS5752158A (en) | Composite semiconductor device | |
| JPS57139949A (en) | Resin sealing type semiconductor device | |
| JPS6436055A (en) | Method of sealing electronic component | |
| JPS6472547A (en) | Semiconductor device and manufacture thereof |