JPS6342860B2 - - Google Patents

Info

Publication number
JPS6342860B2
JPS6342860B2 JP56034439A JP3443981A JPS6342860B2 JP S6342860 B2 JPS6342860 B2 JP S6342860B2 JP 56034439 A JP56034439 A JP 56034439A JP 3443981 A JP3443981 A JP 3443981A JP S6342860 B2 JPS6342860 B2 JP S6342860B2
Authority
JP
Japan
Prior art keywords
semiconductor
package
leads
semiconductor device
external
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56034439A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57148362A (en
Inventor
Tooru Yamazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP56034439A priority Critical patent/JPS57148362A/ja
Publication of JPS57148362A publication Critical patent/JPS57148362A/ja
Publication of JPS6342860B2 publication Critical patent/JPS6342860B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W90/00
    • H10W72/07254
    • H10W72/247
    • H10W74/15
    • H10W90/726

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP56034439A 1981-03-10 1981-03-10 Semiconductor device Granted JPS57148362A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56034439A JPS57148362A (en) 1981-03-10 1981-03-10 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56034439A JPS57148362A (en) 1981-03-10 1981-03-10 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS57148362A JPS57148362A (en) 1982-09-13
JPS6342860B2 true JPS6342860B2 (enExample) 1988-08-25

Family

ID=12414252

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56034439A Granted JPS57148362A (en) 1981-03-10 1981-03-10 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS57148362A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5978638U (ja) * 1982-11-17 1984-05-28 松下電器産業株式会社 電子部品接続構造
JPH0297050A (ja) * 1988-10-03 1990-04-09 Mitsubishi Electric Corp 半導体集積回路
JP2537325B2 (ja) * 1991-11-29 1996-09-25 明 北原 表面実装電子部品と製法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5462778A (en) * 1977-10-28 1979-05-21 Toshiba Corp Laminated frame for power ic
JPS54144872A (en) * 1978-05-04 1979-11-12 Omron Tateisi Electronics Co Electronic circuit device

Also Published As

Publication number Publication date
JPS57148362A (en) 1982-09-13

Similar Documents

Publication Publication Date Title
US7008824B2 (en) Method of fabricating mounted multiple semiconductor dies in a package
US6297547B1 (en) Mounting multiple semiconductor dies in a package
KR100480909B1 (ko) 적층 칩 패키지의 제조 방법
US5864174A (en) Semiconductor device having a die pad structure for preventing cracks in a molding resin
US4677526A (en) Plastic pin grid array chip carrier
JP3063032B2 (ja) ボ―ルグリッドアレイ型半導体パッケ―ジ及びその製造方法
KR100255476B1 (ko) 볼 그리드 어레이 패키지
US6242283B1 (en) Wafer level packaging process of semiconductor
US5559305A (en) Semiconductor package having adjacently arranged semiconductor chips
JPH01303730A (ja) 半導体素子の実装構造とその製造方法
JPS6342860B2 (enExample)
JPH01137660A (ja) 半導体装置
KR19990015823A (ko) 비지에이패키지 및 그 제조방법
JP3466354B2 (ja) 半導体装置
KR100437821B1 (ko) 반도체 패키지 및 그 제조방법
KR100533761B1 (ko) 반도체패키지
KR102233649B1 (ko) 적층형 반도체 패키지 및 적층형 반도체 패키지의 제조방법
JP3136274B2 (ja) 半導体装置
KR0173930B1 (ko) 리드 프레임을 이용한 볼 그리드 어레이 패키지
KR100388291B1 (ko) 반도체패키지 구조
KR940006578B1 (ko) 반도체 패케이지 및 그 제조방법
JPS59231826A (ja) 半導体装置
KR100308393B1 (ko) 반도체패키지및그제조방법
KR950010866B1 (ko) 표면 실장형(surface mounting type) 반도체 패키지(package)
JPH02180061A (ja) リードフレームおよび半導体装置