JPS57143329A - Photosensitive resin and its production - Google Patents
Photosensitive resin and its productionInfo
- Publication number
- JPS57143329A JPS57143329A JP2938081A JP2938081A JPS57143329A JP S57143329 A JPS57143329 A JP S57143329A JP 2938081 A JP2938081 A JP 2938081A JP 2938081 A JP2938081 A JP 2938081A JP S57143329 A JPS57143329 A JP S57143329A
- Authority
- JP
- Japan
- Prior art keywords
- formula
- group
- diamine
- photosensitive resin
- chain
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Polymerisation Methods In General (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2938081A JPS57143329A (en) | 1981-03-03 | 1981-03-03 | Photosensitive resin and its production |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2938081A JPS57143329A (en) | 1981-03-03 | 1981-03-03 | Photosensitive resin and its production |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57143329A true JPS57143329A (en) | 1982-09-04 |
JPH0153292B2 JPH0153292B2 (ja) | 1989-11-13 |
Family
ID=12274531
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2938081A Granted JPS57143329A (en) | 1981-03-03 | 1981-03-03 | Photosensitive resin and its production |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57143329A (ja) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59210939A (ja) * | 1983-05-13 | 1984-11-29 | Toyobo Co Ltd | 架橋したポリエ−テルイミド成形物 |
US4786569A (en) * | 1985-09-04 | 1988-11-22 | Ciba-Geigy Corporation | Adhesively bonded photostructurable polyimide film |
EP0293904A2 (en) * | 1987-06-03 | 1988-12-07 | Ube Industries, Ltd. | Antistatic aromatic polyimide article |
US6350845B1 (en) | 1999-06-28 | 2002-02-26 | Kaneka Corporation | Polyimide compositions and novel acid dianhydrides to be used therein |
JP2002080596A (ja) * | 2000-09-04 | 2002-03-19 | Univ Kanagawa | ポリイミド、その製造方法および硬化性樹脂組成物 |
JP2002356553A (ja) * | 2000-04-28 | 2002-12-13 | Mitsui Chemicals Inc | ポリイミドおよびポリアミド酸 |
JP2003076017A (ja) * | 2001-09-06 | 2003-03-14 | Mitsui Chemicals Inc | ネガ型感光性樹脂組成物およびその用途 |
JP2018070829A (ja) * | 2016-11-02 | 2018-05-10 | 東レ株式会社 | 樹脂組成物 |
JP2020504769A (ja) * | 2016-10-25 | 2020-02-13 | フジフイルム エレクトロニック マテリアルズ ユー.エス.エー., インコーポレイテッド | ポリイミド |
JPWO2021045126A1 (ja) * | 2019-09-05 | 2021-03-11 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69121790T2 (de) * | 1990-05-24 | 1997-04-10 | Sumitomo Chemical Co | Positivresistzusammensetzung |
EP0460416B1 (en) * | 1990-06-05 | 1996-08-21 | Sumitomo Chemical Company, Limited | Positive resist composition |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5062300A (ja) * | 1973-10-01 | 1975-05-28 |
-
1981
- 1981-03-03 JP JP2938081A patent/JPS57143329A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5062300A (ja) * | 1973-10-01 | 1975-05-28 |
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59210939A (ja) * | 1983-05-13 | 1984-11-29 | Toyobo Co Ltd | 架橋したポリエ−テルイミド成形物 |
US4786569A (en) * | 1985-09-04 | 1988-11-22 | Ciba-Geigy Corporation | Adhesively bonded photostructurable polyimide film |
EP0293904A2 (en) * | 1987-06-03 | 1988-12-07 | Ube Industries, Ltd. | Antistatic aromatic polyimide article |
US6642393B2 (en) | 1999-06-28 | 2003-11-04 | Kaneka Corporation | Acid anhydrides |
US6350845B1 (en) | 1999-06-28 | 2002-02-26 | Kaneka Corporation | Polyimide compositions and novel acid dianhydrides to be used therein |
JP4565769B2 (ja) * | 2000-04-28 | 2010-10-20 | 三井化学株式会社 | ポリイミドおよびポリアミド酸 |
JP2002356553A (ja) * | 2000-04-28 | 2002-12-13 | Mitsui Chemicals Inc | ポリイミドおよびポリアミド酸 |
JP4494609B2 (ja) * | 2000-09-04 | 2010-06-30 | 学校法人神奈川大学 | ポリイミド、その製造方法および硬化性樹脂組成物 |
JP2002080596A (ja) * | 2000-09-04 | 2002-03-19 | Univ Kanagawa | ポリイミド、その製造方法および硬化性樹脂組成物 |
JP2003076017A (ja) * | 2001-09-06 | 2003-03-14 | Mitsui Chemicals Inc | ネガ型感光性樹脂組成物およびその用途 |
JP4603215B2 (ja) * | 2001-09-06 | 2010-12-22 | 三井化学株式会社 | ネガ型感光性樹脂組成物およびその用途 |
JP2020504769A (ja) * | 2016-10-25 | 2020-02-13 | フジフイルム エレクトロニック マテリアルズ ユー.エス.エー., インコーポレイテッド | ポリイミド |
US11939428B2 (en) | 2016-10-25 | 2024-03-26 | Fujifilm Electronic Materials U.S.A., Inc. | Polyimides |
JP2018070829A (ja) * | 2016-11-02 | 2018-05-10 | 東レ株式会社 | 樹脂組成物 |
JPWO2021045126A1 (ja) * | 2019-09-05 | 2021-03-11 | ||
WO2021045126A1 (ja) * | 2019-09-05 | 2021-03-11 | 富士フイルム株式会社 | 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、半導体デバイス、樹脂、及び、樹脂の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JPH0153292B2 (ja) | 1989-11-13 |
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