JPS57141331A - Thin plate piece conveying method - Google Patents

Thin plate piece conveying method

Info

Publication number
JPS57141331A
JPS57141331A JP2625081A JP2625081A JPS57141331A JP S57141331 A JPS57141331 A JP S57141331A JP 2625081 A JP2625081 A JP 2625081A JP 2625081 A JP2625081 A JP 2625081A JP S57141331 A JPS57141331 A JP S57141331A
Authority
JP
Japan
Prior art keywords
magazine
water
thin plate
slit
plate piece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2625081A
Other languages
English (en)
Inventor
Seiji Kumai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP2625081A priority Critical patent/JPS57141331A/ja
Publication of JPS57141331A publication Critical patent/JPS57141331A/ja
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H5/00Feeding articles separated from piles; Feeding articles to machines

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Delivering By Means Of Belts And Rollers (AREA)
JP2625081A 1981-02-24 1981-02-24 Thin plate piece conveying method Pending JPS57141331A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2625081A JPS57141331A (en) 1981-02-24 1981-02-24 Thin plate piece conveying method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2625081A JPS57141331A (en) 1981-02-24 1981-02-24 Thin plate piece conveying method

Publications (1)

Publication Number Publication Date
JPS57141331A true JPS57141331A (en) 1982-09-01

Family

ID=12188026

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2625081A Pending JPS57141331A (en) 1981-02-24 1981-02-24 Thin plate piece conveying method

Country Status (1)

Country Link
JP (1) JPS57141331A (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0298956A (ja) * 1988-10-05 1990-04-11 Nec Corp 半導体基板搬送方法
JPH02142155A (ja) * 1988-11-22 1990-05-31 Fujitsu Ltd 半導体ウェハ移し替え装置
JPH0563058A (ja) * 1991-01-10 1993-03-12 Wacker Chemitronic Ges Elektron Grundstoffe Mbh 積重ねたウエーハを自動的に個別化する装置及び方法
JP2002016121A (ja) * 2000-06-30 2002-01-18 Fujikoshi Mach Corp ウェーハの収納装置
JP2021518664A (ja) * 2018-03-19 2021-08-02 東京エレクトロン株式会社 形状メトロロジのための基板保持装置及び方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0298956A (ja) * 1988-10-05 1990-04-11 Nec Corp 半導体基板搬送方法
JPH02142155A (ja) * 1988-11-22 1990-05-31 Fujitsu Ltd 半導体ウェハ移し替え装置
JPH0563058A (ja) * 1991-01-10 1993-03-12 Wacker Chemitronic Ges Elektron Grundstoffe Mbh 積重ねたウエーハを自動的に個別化する装置及び方法
JP2002016121A (ja) * 2000-06-30 2002-01-18 Fujikoshi Mach Corp ウェーハの収納装置
JP2021518664A (ja) * 2018-03-19 2021-08-02 東京エレクトロン株式会社 形状メトロロジのための基板保持装置及び方法

Similar Documents

Publication Publication Date Title
JPS57162359A (en) Semiconductor device
JPS5743438A (en) Semiconductor device and manufacture thereof
JPS57141331A (en) Thin plate piece conveying method
JPS5752143A (en) Mounting method and device for semiconductor pellet
JPS574183A (en) Metallic thin strip for installing semiconductor light-emitting element
JPS57190324A (en) Manufacture of semiconductor device
JPS5784188A (en) Semiconductor device
JPS5784166A (en) 3-5 group compound semiconductor device
JPS57192049A (en) Manufacture of bump electrode
JPS57149726A (en) Manufacture of semiconductor device
JPS54148379A (en) Plating method of base ribbon for semiconductor device
JPS5615929A (en) Method and device for restoring electrode in electospark machining device
JPS56108235A (en) Semiconductor device
JPS5728366A (en) Semiconductor device
JPS54105479A (en) Manufacture unit of resin sealed type semiconductor device
JPS574173A (en) Semiconductor device
JPS57157585A (en) Manufacture of semiconductor light emitting device
JPS57111050A (en) Semiconductor device
JPS57152146A (en) Manufacture of semiconductor device
JPS57178334A (en) Semiconductor device and manufacture therfof
JPS57206056A (en) Lead frame
JPS56104444A (en) Manufacture of semiconductor device
JPS6452697A (en) Production of group iii-v compound semiconductor single crystal
JPS5426580A (en) Method of machining surrounding of metal lining-laminated plate
JPS5313376A (en) Semiconductor element