JPS57206056A - Lead frame - Google Patents

Lead frame

Info

Publication number
JPS57206056A
JPS57206056A JP8967981A JP8967981A JPS57206056A JP S57206056 A JPS57206056 A JP S57206056A JP 8967981 A JP8967981 A JP 8967981A JP 8967981 A JP8967981 A JP 8967981A JP S57206056 A JPS57206056 A JP S57206056A
Authority
JP
Japan
Prior art keywords
lead frame
tab
wire bonding
pads
pellet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8967981A
Other languages
Japanese (ja)
Inventor
Usuke Enomoto
Haruo Kugimiya
Toshinori Yoshizawa
Kunio Tsushima
Hisayoshi Chigira
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Eastern Japan Semiconductor Inc
Hitachi Iruma Electronic Co Ltd
Original Assignee
Hitachi Ltd
Hitachi Tohbu Semiconductor Ltd
Hitachi Iruma Electronic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Tohbu Semiconductor Ltd, Hitachi Iruma Electronic Co Ltd filed Critical Hitachi Ltd
Priority to JP8967981A priority Critical patent/JPS57206056A/en
Publication of JPS57206056A publication Critical patent/JPS57206056A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H01L23/49582—Metallic layers on lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To prevent faulty installation or connection by a method wherein the entire surface of a lead frame with its pellet mounting and wire bonding regions Ag plated is provided with a very thin protecting film of Ag. CONSTITUTION:A lead frame 1 is composed of a metal of Cu base and three leads 2 running in parallel with each other form a unit. The extremities of the leads 2 are formed larger than the other parts. the extremity of the central lead is a tab 6 accommodating a pellet 5. The extremities of the other side leads work as wire bonding pads 7. The primary surface of the tab 6 and pads 7 are plated with Ni and then with Ag, and the tab 6 forms a pellet installing region and the pads 7 wire bonding regions. The entire surface of the lead frame 1 is covered with protecting Ag film 12 so thin as to diffused into the lead frame base material when exposed to heat generated in a semiconductor device mounting process.
JP8967981A 1981-06-12 1981-06-12 Lead frame Pending JPS57206056A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8967981A JPS57206056A (en) 1981-06-12 1981-06-12 Lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8967981A JPS57206056A (en) 1981-06-12 1981-06-12 Lead frame

Publications (1)

Publication Number Publication Date
JPS57206056A true JPS57206056A (en) 1982-12-17

Family

ID=13977438

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8967981A Pending JPS57206056A (en) 1981-06-12 1981-06-12 Lead frame

Country Status (1)

Country Link
JP (1) JPS57206056A (en)

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