JPS57134949A - Forming of ic wiring - Google Patents

Forming of ic wiring

Info

Publication number
JPS57134949A
JPS57134949A JP1964981A JP1964981A JPS57134949A JP S57134949 A JPS57134949 A JP S57134949A JP 1964981 A JP1964981 A JP 1964981A JP 1964981 A JP1964981 A JP 1964981A JP S57134949 A JPS57134949 A JP S57134949A
Authority
JP
Japan
Prior art keywords
wiring
metal
break
deposited
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1964981A
Other languages
Japanese (ja)
Inventor
Hitoshi Ito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP1964981A priority Critical patent/JPS57134949A/en
Publication of JPS57134949A publication Critical patent/JPS57134949A/en
Pending legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

PURPOSE:To improve reliability preventing a break of wiring metal by forming a tapered wiring pattern. CONSTITUTION:A wiring pattern 32 is formed by etching a resist coated on an SiO2 film 36 that serves as a spacer on substrate 11. Then an Al film 33 of the first metal is deposited by the electron beam evaporation method. The first layer metal wiring 33 that is obtained by removing the resist 32 is a belt shaped wiring having a tapered side. Finally an SiO2 film 34 is deposited to form over it a vertically crossed wiring 35. This method eliminates a break of vertically crossed wiring metal and making thickness of the wiring metal uniform in the direction of wiring thus improving the reliability.
JP1964981A 1981-02-13 1981-02-13 Forming of ic wiring Pending JPS57134949A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1964981A JPS57134949A (en) 1981-02-13 1981-02-13 Forming of ic wiring

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1964981A JPS57134949A (en) 1981-02-13 1981-02-13 Forming of ic wiring

Publications (1)

Publication Number Publication Date
JPS57134949A true JPS57134949A (en) 1982-08-20

Family

ID=12005082

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1964981A Pending JPS57134949A (en) 1981-02-13 1981-02-13 Forming of ic wiring

Country Status (1)

Country Link
JP (1) JPS57134949A (en)

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