JPS57120342A - Manufacture of glass passivation semiconductor device - Google Patents
Manufacture of glass passivation semiconductor deviceInfo
- Publication number
- JPS57120342A JPS57120342A JP56004615A JP461581A JPS57120342A JP S57120342 A JPS57120342 A JP S57120342A JP 56004615 A JP56004615 A JP 56004615A JP 461581 A JP461581 A JP 461581A JP S57120342 A JPS57120342 A JP S57120342A
- Authority
- JP
- Japan
- Prior art keywords
- film
- glass
- grooves
- region
- passivation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Formation Of Insulating Films (AREA)
Abstract
PURPOSE:To avoid the adherence of glass powder particles to other material by covering a resist film except the grooves when grooves are formed in a semiconductor substrate formed with a P-N junction and glass for passivation is filled therein. CONSTITUTION:An SiO2 film is covered on a semiconductor substrate 2 formed with a P-N junction, is then etched with a photoresist film of the prescribed pattern as a mask, and an electrode contacting region and a glass passivation region are removed. Then, deep grooves 3 are opened in the passivation region, photoresist film 7 is covered on the overall surface, the passivation region is removed, and the exposed grooves 3 are buried with glass film 4 by an electrophoresis. Thereafter, it is heat treated to bake the film 4, the film 7 is then vanished, a resist film 7' is again provided, and a window is opened corresponding to the contacting region 5, an aluminum electrode film is formed thereon, and the film 7' is removed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56004615A JPS57120342A (en) | 1981-01-17 | 1981-01-17 | Manufacture of glass passivation semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56004615A JPS57120342A (en) | 1981-01-17 | 1981-01-17 | Manufacture of glass passivation semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57120342A true JPS57120342A (en) | 1982-07-27 |
Family
ID=11588957
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56004615A Pending JPS57120342A (en) | 1981-01-17 | 1981-01-17 | Manufacture of glass passivation semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57120342A (en) |
-
1981
- 1981-01-17 JP JP56004615A patent/JPS57120342A/en active Pending
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