JPS57118656A - Mounting structure of large scale integrated circuit (lsi) - Google Patents
Mounting structure of large scale integrated circuit (lsi)Info
- Publication number
- JPS57118656A JPS57118656A JP580081A JP580081A JPS57118656A JP S57118656 A JPS57118656 A JP S57118656A JP 580081 A JP580081 A JP 580081A JP 580081 A JP580081 A JP 580081A JP S57118656 A JPS57118656 A JP S57118656A
- Authority
- JP
- Japan
- Prior art keywords
- lsi
- lsis
- integrated circuit
- mounting structure
- large scale
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP580081A JPS57118656A (en) | 1981-01-16 | 1981-01-16 | Mounting structure of large scale integrated circuit (lsi) |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP580081A JPS57118656A (en) | 1981-01-16 | 1981-01-16 | Mounting structure of large scale integrated circuit (lsi) |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57118656A true JPS57118656A (en) | 1982-07-23 |
Family
ID=11621149
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP580081A Pending JPS57118656A (en) | 1981-01-16 | 1981-01-16 | Mounting structure of large scale integrated circuit (lsi) |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57118656A (ja) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62150867A (ja) * | 1985-12-25 | 1987-07-04 | Nec Corp | 高密度セラミツクパツケ−ジ |
JPH042050U (ja) * | 1990-04-23 | 1992-01-09 | ||
JPH04124777U (ja) * | 1991-04-26 | 1992-11-13 | ミツミ電機株式会社 | コネクタ |
WO1994017649A1 (en) * | 1993-01-20 | 1994-08-04 | Wavedriver Limited | Mounting assembly for power semiconductors |
GB2383682A (en) * | 2001-12-27 | 2003-07-02 | Chin-Wen Wang | Heat sink for CPU |
JP2014138442A (ja) * | 2013-01-15 | 2014-07-28 | Fanuc Ltd | 放熱器を備えたモータ駆動装置 |
EP3674842A1 (en) * | 2018-12-26 | 2020-07-01 | General Dynamics Mission Systems, Inc. | Multi-card subsystem for embedded computing systems |
-
1981
- 1981-01-16 JP JP580081A patent/JPS57118656A/ja active Pending
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62150867A (ja) * | 1985-12-25 | 1987-07-04 | Nec Corp | 高密度セラミツクパツケ−ジ |
JPH042050U (ja) * | 1990-04-23 | 1992-01-09 | ||
JPH04124777U (ja) * | 1991-04-26 | 1992-11-13 | ミツミ電機株式会社 | コネクタ |
WO1994017649A1 (en) * | 1993-01-20 | 1994-08-04 | Wavedriver Limited | Mounting assembly for power semiconductors |
AU696858B2 (en) * | 1993-01-20 | 1998-09-17 | Wavedriver Limited | Mounting assembly for power semiconductors |
GB2383682A (en) * | 2001-12-27 | 2003-07-02 | Chin-Wen Wang | Heat sink for CPU |
JP2014138442A (ja) * | 2013-01-15 | 2014-07-28 | Fanuc Ltd | 放熱器を備えたモータ駆動装置 |
US9155231B2 (en) | 2013-01-15 | 2015-10-06 | Fanuc Corporation | Motor-drive unit having heat radiator |
EP3674842A1 (en) * | 2018-12-26 | 2020-07-01 | General Dynamics Mission Systems, Inc. | Multi-card subsystem for embedded computing systems |
US11071221B2 (en) | 2018-12-26 | 2021-07-20 | General Dynamics Mission Systems, Inc. | Multi-card subsystem for embedded computing systems |
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