GB1502977A - Multilayer printed circuit boards - Google Patents
Multilayer printed circuit boardsInfo
- Publication number
- GB1502977A GB1502977A GB38462/75A GB3846275A GB1502977A GB 1502977 A GB1502977 A GB 1502977A GB 38462/75 A GB38462/75 A GB 38462/75A GB 3846275 A GB3846275 A GB 3846275A GB 1502977 A GB1502977 A GB 1502977A
- Authority
- GB
- United Kingdom
- Prior art keywords
- screens
- apertures
- over
- conductors
- insulant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
- H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0715—Shielding provided by an outer layer of PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09681—Mesh conductors, e.g. as a ground plane
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
1502977 Printed circuits INTERNATIONAL COMPUTERS Ltd 26 July 1976 [19 Sept 1975] 38462/75 Heading H1R A printed circuit board (Fig. 1) comprises an insulant substrate of, e.g. phenolic or epoxy resin, ceramic or glass with an array of circuit conductors 4 on face 2 for formed or mounted components (not shown) and a ground or power supply screen 5 having retriculated apertures is mounted on opposed face 3. The screen (Fig. 2, not shown) may be formed as an openwork lattice with apertures and conductors proportional to provide a continuous conductive plane effective to match the natural characteristic impedence of conductors 4 (forming transmission lines) to the requirements of the circuit. Alternate apertures of the rows and columns of the lattice may be omitted (Fig. 3, not shown) and the apertures may be rectangular or diamond shaped (Fig. 4, not shown) to provide a trellis configuration. Circular apertures may also be used, and they are disposed in a regular pattern to provide even distribution of conductive material over the area of the screen providing the required impedance matching. The screen may be continuous over some areas of the board and omitted over others, e.g. those on which a discrete component is mounted. In a multilayer printed circuit board (Fig. 5) a central insulant substrate 13 carries orthogonal strip conductor patterns 14, 15 on either face with interconnection over through holes (not shown). Insulant layers 16, 18 over conductors 14, 15 carry lattice screens 17, 18 acting as power and ground planes with connections to the circuitry of conductors 14, 15 over through holes (not shown) and covered by external protective layers. Alternatively (Fig. 6) the screens may be positioned interiorly of a multilayer board; screens 20, 21 with circular apertures 23 acting as power and supply planes on each face of a central insulant substrate 22; the circuit conductors 24, 26 being carried by insulant layers 25, 27 over screens 20, 21 with interconnections through plated through holes (not shown) traversing clearance apertures of the insulant layers and of the screens. External protective layers may be provided. Different aperture patterns may be employed for different screens, and selected screens may be imperforate, to provide required impedence matching. The spacings between conductor layers and screens may be varied in different areas.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB38462/75A GB1502977A (en) | 1975-09-19 | 1975-09-19 | Multilayer printed circuit boards |
ZA763980A ZA763980B (en) | 1975-09-19 | 1976-07-05 | Improvements in or relating to multilayer printed circuit boards |
AU15660/76A AU499670B2 (en) | 1975-09-19 | 1976-07-07 | Multilayer printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB38462/75A GB1502977A (en) | 1975-09-19 | 1975-09-19 | Multilayer printed circuit boards |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1502977A true GB1502977A (en) | 1978-03-08 |
Family
ID=10403611
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB38462/75A Expired GB1502977A (en) | 1975-09-19 | 1975-09-19 | Multilayer printed circuit boards |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU499670B2 (en) |
GB (1) | GB1502977A (en) |
ZA (1) | ZA763980B (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2613539A1 (en) * | 1987-04-03 | 1988-10-07 | Bull Sa | Impedance-matched bus connector and method of manufacturing such a connector |
WO1996035319A1 (en) * | 1995-05-01 | 1996-11-07 | Apple Computer, Inc. | Transmission line having impedance set by reference plane fenestration |
EP0949854A1 (en) * | 1996-12-13 | 1999-10-13 | Ibiden Co., Ltd. | Multilayered printed wiring board |
CN1326431C (en) * | 2001-04-24 | 2007-07-11 | 日本特殊陶业株式会社 | Wiring substrate |
WO2012055733A1 (en) * | 2010-10-26 | 2012-05-03 | Sagem Defense Securite | An electronics card, an electronic device including such a card, and a method of protecting an electronics card |
CN104582258A (en) * | 2015-01-06 | 2015-04-29 | 广东小天才科技有限公司 | Thin film circuit board and method for manufacturing thin film circuit board |
CN105430890A (en) * | 2015-12-29 | 2016-03-23 | 广东欧珀移动通信有限公司 | Printed circuit board and mobile terminal |
-
1975
- 1975-09-19 GB GB38462/75A patent/GB1502977A/en not_active Expired
-
1976
- 1976-07-05 ZA ZA763980A patent/ZA763980B/en unknown
- 1976-07-07 AU AU15660/76A patent/AU499670B2/en not_active Expired
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2613539A1 (en) * | 1987-04-03 | 1988-10-07 | Bull Sa | Impedance-matched bus connector and method of manufacturing such a connector |
WO1996035319A1 (en) * | 1995-05-01 | 1996-11-07 | Apple Computer, Inc. | Transmission line having impedance set by reference plane fenestration |
EP1701601A3 (en) * | 1996-12-13 | 2007-03-28 | Ibiden Co., Ltd. | Multilayer printed wiring board |
EP0949854A4 (en) * | 1996-12-13 | 2005-05-25 | Ibiden Co Ltd | Multilayered printed wiring board |
EP1696714A2 (en) * | 1996-12-13 | 2006-08-30 | Ibiden Co., Ltd. | Multilayer printed wiring board |
EP1701601A2 (en) * | 1996-12-13 | 2006-09-13 | Ibiden Co., Ltd. | Multilayer printed wiring board |
EP0949854A1 (en) * | 1996-12-13 | 1999-10-13 | Ibiden Co., Ltd. | Multilayered printed wiring board |
EP1696714A3 (en) * | 1996-12-13 | 2007-04-18 | Ibiden Co., Ltd. | Multilayer printed wiring board |
CN1326431C (en) * | 2001-04-24 | 2007-07-11 | 日本特殊陶业株式会社 | Wiring substrate |
WO2012055733A1 (en) * | 2010-10-26 | 2012-05-03 | Sagem Defense Securite | An electronics card, an electronic device including such a card, and a method of protecting an electronics card |
US9338931B2 (en) | 2010-10-26 | 2016-05-10 | Sagem Defense Securite | Electronic card, an electronic device including such a card, and a method of protecting an electronics card |
CN104582258A (en) * | 2015-01-06 | 2015-04-29 | 广东小天才科技有限公司 | Thin film circuit board and method for manufacturing thin film circuit board |
CN105430890A (en) * | 2015-12-29 | 2016-03-23 | 广东欧珀移动通信有限公司 | Printed circuit board and mobile terminal |
Also Published As
Publication number | Publication date |
---|---|
AU1566076A (en) | 1978-01-12 |
AU499670B2 (en) | 1979-04-26 |
ZA763980B (en) | 1977-05-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PE20 | Patent expired after termination of 20 years |
Effective date: 19960725 |