AU1566076A - Multilayer printed circuit board - Google Patents

Multilayer printed circuit board

Info

Publication number
AU1566076A
AU1566076A AU15660/76A AU1566076A AU1566076A AU 1566076 A AU1566076 A AU 1566076A AU 15660/76 A AU15660/76 A AU 15660/76A AU 1566076 A AU1566076 A AU 1566076A AU 1566076 A AU1566076 A AU 1566076A
Authority
AU
Australia
Prior art keywords
circuit board
printed circuit
multilayer printed
multilayer
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
AU15660/76A
Other versions
AU499670B2 (en
Inventor
E Smith
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Services Ltd
Original Assignee
Fujitsu Services Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Services Ltd filed Critical Fujitsu Services Ltd
Publication of AU1566076A publication Critical patent/AU1566076A/en
Application granted granted Critical
Publication of AU499670B2 publication Critical patent/AU499670B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09681—Mesh conductors, e.g. as a ground plane

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
AU15660/76A 1975-09-19 1976-07-07 Multilayer printed circuit board Expired AU499670B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB38462/75 1975-09-19
GB38462/75A GB1502977A (en) 1975-09-19 1975-09-19 Multilayer printed circuit boards

Publications (2)

Publication Number Publication Date
AU1566076A true AU1566076A (en) 1978-01-12
AU499670B2 AU499670B2 (en) 1979-04-26

Family

ID=10403611

Family Applications (1)

Application Number Title Priority Date Filing Date
AU15660/76A Expired AU499670B2 (en) 1975-09-19 1976-07-07 Multilayer printed circuit board

Country Status (3)

Country Link
AU (1) AU499670B2 (en)
GB (1) GB1502977A (en)
ZA (1) ZA763980B (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2613539A1 (en) * 1987-04-03 1988-10-07 Bull Sa Impedance-matched bus connector and method of manufacturing such a connector
US5568107A (en) * 1995-05-01 1996-10-22 Apple Computer, Inc. Transmission line having impedance set by reference plane fenestration
EP1701601B1 (en) * 1996-12-13 2008-06-04 Ibiden Co., Ltd. Multilayer printed wiring board
JP4680410B2 (en) * 2001-04-24 2011-05-11 日本特殊陶業株式会社 Wiring board
FR2966692B1 (en) 2010-10-26 2012-12-14 Sagem Defense Securite ELECTRONIC CARD, ELECTRONIC DEVICE COMPRISING SUCH A CARD AND METHOD FOR PROTECTING AN ELECTRONIC CARD
CN104582258B (en) * 2015-01-06 2017-11-14 广东小天才科技有限公司 The manufacture method of film circuit board and film circuit board
CN105430890A (en) * 2015-12-29 2016-03-23 广东欧珀移动通信有限公司 Printed circuit board and mobile terminal

Also Published As

Publication number Publication date
ZA763980B (en) 1977-05-25
GB1502977A (en) 1978-03-08
AU499670B2 (en) 1979-04-26

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