JPS57102059A - Hybrid integrated circuit device - Google Patents

Hybrid integrated circuit device

Info

Publication number
JPS57102059A
JPS57102059A JP55178247A JP17824780A JPS57102059A JP S57102059 A JPS57102059 A JP S57102059A JP 55178247 A JP55178247 A JP 55178247A JP 17824780 A JP17824780 A JP 17824780A JP S57102059 A JPS57102059 A JP S57102059A
Authority
JP
Japan
Prior art keywords
integrated circuit
hybrid integrated
case
fixing
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55178247A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6161701B2 (enrdf_load_stackoverflow
Inventor
Shigeo Fujita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP55178247A priority Critical patent/JPS57102059A/ja
Publication of JPS57102059A publication Critical patent/JPS57102059A/ja
Publication of JPS6161701B2 publication Critical patent/JPS6161701B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP55178247A 1980-12-16 1980-12-16 Hybrid integrated circuit device Granted JPS57102059A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55178247A JPS57102059A (en) 1980-12-16 1980-12-16 Hybrid integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55178247A JPS57102059A (en) 1980-12-16 1980-12-16 Hybrid integrated circuit device

Publications (2)

Publication Number Publication Date
JPS57102059A true JPS57102059A (en) 1982-06-24
JPS6161701B2 JPS6161701B2 (enrdf_load_stackoverflow) 1986-12-26

Family

ID=16045153

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55178247A Granted JPS57102059A (en) 1980-12-16 1980-12-16 Hybrid integrated circuit device

Country Status (1)

Country Link
JP (1) JPS57102059A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6139955U (ja) * 1984-08-13 1986-03-13 富士通テン株式会社 パワ−ｉｃ

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5394566U (enrdf_load_stackoverflow) * 1976-12-29 1978-08-01
JPS5440060U (enrdf_load_stackoverflow) * 1977-08-24 1979-03-16
JPS5577159A (en) * 1978-12-06 1980-06-10 Matsushita Electric Works Ltd Electronic part

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5394566U (enrdf_load_stackoverflow) * 1976-12-29 1978-08-01
JPS5440060U (enrdf_load_stackoverflow) * 1977-08-24 1979-03-16
JPS5577159A (en) * 1978-12-06 1980-06-10 Matsushita Electric Works Ltd Electronic part

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6139955U (ja) * 1984-08-13 1986-03-13 富士通テン株式会社 パワ−ｉｃ

Also Published As

Publication number Publication date
JPS6161701B2 (enrdf_load_stackoverflow) 1986-12-26

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